Patents by Inventor Shigeyuki Kousaka

Shigeyuki Kousaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9096750
    Abstract: A fiber-reinforced resin composition which is capable of providing a light-weight molded article that has a high mechanical strength. The fiber-reinforced resin composition contains (A) a thermoplastic resin and (B) resin-impregnated filament bundles containing rayon fibers. The rayon fibers of the component (B) have a fiber diameter of 5-30 ?m and an X-ray orientation degree of 86% or more. The resin-impregnated filament bundles are obtained by: tying 2,000-30,000 rayon fibers of the component (B) lined up in the longitudinal direction together in a bundle; integrating the bundle of the rayon fibers by impregnating the bundle with the thermoplastic resin of the component (A) in a molten state; and then cutting the integrated bundle into pieces 3-30 mm long.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: August 4, 2015
    Assignee: DAICEL POLYMER LTD.
    Inventors: Shigeyuki Kousaka, Toshio Oguni, Masahiko Itakura
  • Publication number: 20140343196
    Abstract: Provided is a fiber-reinforced resin composition which is capable of providing a light-weight molded article that has high mechanical strength. This fiber-reinforced resin composition contains (A) a thermoplastic resin and (B) resin-impregnated filament bundles containing rayon fibers. The rayon fibers of the component (B) have a fiber diameter of 5-30 ?m and an X-ray orientation degree of 86% or more. The resin-impregnated filament bundles are obtained by: tying 2,000-30,000 rayon fibers of the component (B) lined up in the longitudinal direction together in a bundle; integrating the bundle of the rayon fibers by impregnating the bundle with the thermoplastic resin of the component (A) in a molten state; and then cutting the integrated bundle into pieces 3-30 mm long.
    Type: Application
    Filed: September 10, 2012
    Publication date: November 20, 2014
    Inventors: Shigeyuki Kousaka, Toshio Oguni, Masahiko Itakura
  • Patent number: 6871724
    Abstract: A frame of an electroacoustic transducer is made from a mixture of a thermoplastic resin and long fibers dispersed in the resin. The long fibers serve as reinforcing fibers. The long fibers have an average length sufficient to achieve a spring back effect. The spring back effect creases a foam structure. The electroacoustic transducer frame includes single-layer portions and three-layer portions. The single-layer portion is made of a non-foam layer. The three-layer portion is made of a pair of non-foam layers and a foam layer sandwiched by the non-foam layers. The electroacoustic transducer frame is lightweight, and has high internal loss, high rigidity and improved environmental resistance.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: March 29, 2005
    Assignees: Pioneer Corporation, Tohoku Pioneer Corporation
    Inventors: Satoshi Hachiya, Masatoshi Sato, Kazuhiko Saheki, Shigeyuki Kousaka, Moriyuki Yokoyama
  • Publication number: 20030024763
    Abstract: A frame of an electroacoustic transducer is made from a mixture of a thermoplastic resin and long fibers dispersed in the resin. The long fibers serve as reinforcing fibers. The long fibers have an average length sufficient to achieve a spring back effect. The spring back effect creases a foam structure. The electroacoustic transducer frame includes single-layer portions and three-layer portions. The single-layer portion is made of a non-foam layer. The three-layer portion is made of a pair of non-foam layers and a foam layer sandwiched by the non-foam layers. The electroacoustic transducer frame is lightweight, and has high internal loss, high rigidity and improved environmental resistance.
    Type: Application
    Filed: July 18, 2002
    Publication date: February 6, 2003
    Inventors: Satoshi Hachiya, Masatoshi Sato, Kazuhiko Saheki, Shigeyuki Kousaka, Moriyuki Yokoyama