Patents by Inventor Shigeyuki Nakagawa

Shigeyuki Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11623262
    Abstract: A method for incrementally forming includes: preparing a tool T disposed on one side of a metal plate W, a fixing jig 1 to hold a periphery of the metal plate W, and a template P1 including a molded edge E that follows at least a part of a contour of a part to be processed F; arranging the template P1 on the other side of the metal plate W; holding the periphery of the metal plate W together with the template P1 by the fixing jig 1 to fix the metal plate W and the template P1; and moving the tool T while pressing the tool T against the metal plate W, to incrementally form the part to be processed F having a three-dimensional shape of the metal plate W. The method enables to form the part to be processed F in high precision with no use of a molding die and thus, is effective in bringing about reducing cost of equipment and manufacturing.
    Type: Grant
    Filed: July 6, 2018
    Date of Patent: April 11, 2023
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Noriko Uchiyama, Hirotaka Miwa, Shigeyuki Nakagawa, Ryou Murakami
  • Publication number: 20210121931
    Abstract: A method for incrementally forming includes: preparing a tool T disposed on one side of a metal plate W, a fixing jig 1 to hold a periphery of the metal plate W, and a template P1 including a molded edge E that follows at least a part of a contour of a part to be processed F; arranging the template P1 on the other side of the metal plate W; holding the periphery of the metal plate W together with the template P1 by the fixing jig 1 to fix the metal plate W and the template P1; and moving the tool T while pressing the tool T against the metal plate W, to incrementally form the part to be processed F having a three-dimensional shape of the metal plate W. The method enables to form the part to be processed F in high precision with no use of a molding die and thus, is effective in bringing about reducing cost of equipment and manufacturing.
    Type: Application
    Filed: July 6, 2018
    Publication date: April 29, 2021
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Noriko UCHIYAMA, Hirotaka MIWA, Shigeyuki NAKAGAWA, Ryou MURAKAMI
  • Patent number: 10173281
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: January 8, 2019
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi
  • Patent number: 9505084
    Abstract: In joining members to be joined (1, 1) by heating the members to be joined (1, 1) that are mated with intervening an insert (2) while applying opposing loads to the members to be joined (1, 1), so as to allow eutectic reaction to occur between the members to be joined (1, 1) and the insert (2) to discharge a eutectic melt from a joining plane along with an oxide film (1a) of the members to be joined, the members to be joined (1) are brought into contact with the insert (2) so that the oxide film (1a) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.
    Type: Grant
    Filed: July 10, 2012
    Date of Patent: November 29, 2016
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Shigeyuki Nakagawa, Yoshitaka Uehara, Chika Yamamoto, Kenji Miyamoto, Toshikazu Nanbu
  • Patent number: 9272361
    Abstract: A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a joining face made of Metal B, the Metal B being mainly composed of at least one selected from the group consisting of Al Cu, Ag and Au, includes interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B.
    Type: Grant
    Filed: February 25, 2013
    Date of Patent: March 1, 2016
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Toshikazu Nanbu
  • Patent number: 9243312
    Abstract: There is provided an aluminum alloy casting consisting essentially of 7.0 to 11.5 mass % of Si, 0.9 to 4.0 mass % of Mg, 0.1 to 0.65 mass % of Fe, 0.1 to 0.8 mass % of Mn and the balance being Al and unavoidable impurities, or consisting essentially of 7.0 to 11.5 mass % of Si, 0.9 to 4.0 mass % of Mg, 0.1 to 0.65 mass % of Fe, 0.1 to 0.8 mass % of Mn, 0.3 to 1.0 mass % of Cu and the balance being Al and unavoidable impurities, and containing eutectic Si grains having an aspect ratio of 2.0 or smaller and an average grain size of 1.0 micrometer or smaller. There is also provided an automotive part formed with the aluminum alloy casting and a production method of the aluminum alloy casting.
    Type: Grant
    Filed: July 27, 2010
    Date of Patent: January 26, 2016
    Assignees: NISSAN MOTOR CO., LTD., NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Yusuke Nagaishi, Shigeyuki Nakagawa, Koji Itakura, Haruyasu Katto, Satoru Suzuki
  • Patent number: 9174298
    Abstract: [Object] To provide a joining method for dissimilar metals which are magnesium alloy and steel and difficult to be metallurgically directly joined to each other while oxide film is present at a joining surface. [Solving Means] In order to join magnesium alloy material 1 and steel plate 2 to each other, a galvanized steel plate to which Zn—Al—Mg alloy plating (a third material) is applied is used as the steel plate 2. When joining is made, ternary eutectic melting of Al—Mg—Zn is caused, so that it is discharged together with oxide film 1f and impurities from the joining interface while Al—Mg intermetallic compound such as Al3Mg2 and Fe—Al intermetallic compound such as FeAl3 are formed, thereby joining the newly generated surfaces of the magnesium alloy material 1 and the steel plate 2 to each other through a compound layer 3 containing these intermetallic compounds.
    Type: Grant
    Filed: August 26, 2009
    Date of Patent: November 3, 2015
    Assignee: NISSAN MOTOR CO., LTD.
    Inventors: Minoru Kasukawa, Shigeyuki Nakagawa, Kenji Miyamoto
  • Publication number: 20150001280
    Abstract: A method for joining metal materials, which joins a first member with at least a joining face made of Metal A, the Metal A being mainly composed of at least one selected from the group consisting of Al, Cu, Ag and Au, to a second member with at least a joining face made of Metal B, the Metal B being mainly composed of at least one selected from the group consisting of Al Cu, Ag and Au, includes interposing an insert between the joining faces of the first and second members, wherein the insert contains Zn as a metal capable of causing an eutectic reaction with at least one metal except for Au in Metal A as well as at least one metal except for Au in Metal B.
    Type: Application
    Filed: February 25, 2013
    Publication date: January 1, 2015
    Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Toshikazu Nanbu
  • Publication number: 20140348576
    Abstract: In joining members to be joined (1, 1) by heating the members to be joined (1, 1) that are mated with intervening an insert (2) while applying opposing loads to the members to be joined (1, 1), so as to allow eutectic reaction to occur between the members to be joined (1, 1) and the insert (2) to discharge a eutectic melt from a joining plane along with an oxide film (1a) of the members to be joined, the members to be joined (1) are brought into contact with the insert (2) so that the oxide film (1a) is broken by a stress concentrating means previously provided at least one of joining portions breaks to produce a starting point of the eutectic reaction.
    Type: Application
    Filed: July 10, 2012
    Publication date: November 27, 2014
    Inventors: Shigeyuki Nakagawa, Yoshitaka Uehara, Chika Yamamoto, Kenji Miyamoto, Toshikazu Nanbu
  • Publication number: 20140144889
    Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.
    Type: Application
    Filed: January 31, 2014
    Publication date: May 29, 2014
    Applicant: Nissan Motor Co., Ltd.
    Inventors: Hiroshi Sakurai, Shigeyuki Nakagawa, Akira Fukushima, Sadao Yanagida, Chika Sugi
  • Publication number: 20130323531
    Abstract: A bonded body of electrically conductive materials including a bonding interface structure in which paired bonded members (10, 20) made respectively of electrically conductive materials are surface-bonded to each other. The bonding interface structure has at least: a diffusion bonding region in which the electrically conductive materials are mutually diffused; and a plastic flow bonding region which has a pressure bonded and recrystallized structure through plastic flow of the electrically conductive materials.
    Type: Application
    Filed: December 5, 2011
    Publication date: December 5, 2013
    Inventors: Shigeyuki Nakagawa, Toshikazu Nanbu, Chika Yamamoto, Tooru Fukami
  • Patent number: 8507825
    Abstract: Disclosed is a bonding method for dissimilar materials made from metals and its resulting structures. The materials to be bonded are formed by layering three or more sheets such that a dissimilar material interface and a same material interface are formed. A first current is conducted between a three-sheet layered plate material wherein an aluminum alloy plate, a zinc plated steel plate and a bare steel plate, for example, are layered in order. A nugget is formed in an interface between the zinc plated steel plate and the bare steel plate, which are the same materials. Then, a second current greater than the first current is conducted, and a nugget is formed in an interface between the aluminum alloy plate and the zinc plated steel plate.
    Type: Grant
    Filed: September 29, 2011
    Date of Patent: August 13, 2013
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Kenji Miyamoto, Shigeyuki Nakagawa
  • Patent number: 8492005
    Abstract: In joining a magnesium alloy material 1 (first material) and a steel material (second material), a zinc-plated steel plate 2 plated with zinc (metal C) is used as a steel material, Al (metal D) is added to the magnesium alloy material 1. Next, eutectic melting of Mg and Zn is caused so as to remove a product produced by the eutectic melting with an oxide film 1f and impurities from a joint interface. Moreover, an Al—Mg system intermetallic compound such as Al3Mg2 and an Fe—Al system intermetallic compound such as FeAl3 are produced, whereby regenerated surfaces of both materials 1 and 2 are joined via a compound layer 3 containing those intermetallic compounds.
    Type: Grant
    Filed: January 16, 2009
    Date of Patent: July 23, 2013
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masao Aihara, Sadao Yanagida, Akio Hirose
  • Patent number: 8476549
    Abstract: A method of bonding dissimilar metals, a bonding structure formed by such a method and a bonding apparatus for performing such a method. The resulting bond is capable of preventing corrosion (e.g., electric corrosion) resulting from contact of the dissimilar metals and obtains a dissimilar material joint exhibiting anti-corrosive property and bonding strength at low costs. The method includes overlapping two materials made from dissimilar metals having a seal material interposed therebetween and discharging the seal material from a bonding interface and bonding the two materials in direct contact with each other.
    Type: Grant
    Filed: July 23, 2007
    Date of Patent: July 2, 2013
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Shigeyuki Nakagawa, Minoru Kasukawa, Kenji Miyamoto, Hiroshi Sakurai, Chika Yamamoto, Takashi Miyamoto, Akira Fukushima
  • Publication number: 20120148444
    Abstract: There is provided an aluminum alloy casting consisting essentially of 7.0 to 11.5 mass % of Si, 0.9 to 4.0 mass % of Mg, 0.1 to 0.65 mass % of Fe, 0.1 to 0.8 mass % of Mn and the balance being Al and unavoidable impurities, or consisting essentially of 7.0 to 11.5 mass % of Si, 0.9 to 4.0 mass % of Mg, 0.1 to 0.65 mass % of Fe, 0.1 to 0.8 mass % of Mn, 0.3 to 1.0 mass % of Cu and the balance being Al and unavoidable impurities, and containing eutectic Si grains having an aspect ratio of 2.0 or smaller and an average grain size of 1.0 micrometer or smaller. There is also provided an automotive part formed with the aluminum alloy casting and a production method of the aluminum alloy casting.
    Type: Application
    Filed: July 27, 2010
    Publication date: June 14, 2012
    Inventors: Yusuke Nagaishi, Shigeyuki Nakagawa, Koji Itakura, Haruyasu Katto, Satoru Suzuki
  • Publication number: 20120021239
    Abstract: Disclosed is a bonding method for dissimilar materials made from metals and its resulting structures. The materials to be bonded are formed by layering three or more sheets such that a dissimilar material interface and a same material interface are formed. A first current is conducted between a three-sheet layered plate material wherein an aluminum alloy plate, a zinc plated steel plate and a bare steel plate, for example, are layered in order. A nugget is formed in an interface between the zinc plated steel plate and the bare steel plate, which are the same materials. Then, a second current greater than the first current is conducted, and a nugget is formed in an interface between the aluminum alloy plate and the zinc plated steel plate.
    Type: Application
    Filed: September 29, 2011
    Publication date: January 26, 2012
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Kenji Miyamoto, Shigeyuki Nakagawa
  • Patent number: 8058584
    Abstract: Disclosed is a bonding method for dissimilar materials made from metals and its resulting structures. The materials to be bonded are formed by layering three or more sheets such that a dissimilar material interface and a same material interface are formed. A first current is conducted between a three-sheet layered plate material wherein an aluminum alloy plate, a zinc plated steel plate and a bare steel plate, for example, are layered in order. A nugget is formed in an interface between the zinc plated steel plate and the bare steel plate, which are the same materials. Then, a second current greater than the first current is conducted, and a nugget is formed in an interface between the aluminum alloy plate and the zinc plated steel plate.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: November 15, 2011
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Kenji Miyamoto, Shigeyuki Nakagawa
  • Patent number: 8020749
    Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.
    Type: Grant
    Filed: November 11, 2010
    Date of Patent: September 20, 2011
    Assignees: Nissan Motor Co., Ltd., Kojiro Kobayashi
    Inventors: Kojiro Kobayashi, Akio Hirose, Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masayuki Inoue, Tetsuji Morita
  • Patent number: 7984840
    Abstract: According to a metal joining method of the present invention, first and second dissimilar metals are joined together by interposing between the first and second metal materials a third metal material dissimilar to the first and second metal materials and causing eutectic melting at least either at an interface between the first and third metal materials or at an interface between the second and third metal materials.
    Type: Grant
    Filed: November 11, 2010
    Date of Patent: July 26, 2011
    Assignees: Nissan Motor Co., Ltd.
    Inventors: Kojiro Kobayashi, Akio Hirose, Shigeyuki Nakagawa, Kenji Miyamoto, Minoru Kasukawa, Masayuki Inoue, Tetsuji Morita
  • Publication number: 20110159313
    Abstract: [Object] To provide a joining method for dissimilar metals which are magnesium alloy and steel and difficult to be metallurgically directly joined to each other while oxide film is present at a joining surface. [Solving Means] In order to join magnesium alloy material 1 and steel plate 2 to each other, a galvanized steel plate to which Zn—Al—Mg alloy plating (a third material) is applied is used as the steel plate 2. When joining is made, ternary eutectic melting of Al—Mg—Zn is caused, so that it is discharged together with oxide film 1f and impurities from the joining interface while Al—Mg intermetallic compound such as Al3Mg2 and Fe—Al intermetallic compound such as FeAl3 are formed, thereby joining the newly generated surfaces of the magnesium alloy material 1 and the steel plate 2 to each other through a compound layer 3 containing these intermetallic compounds.
    Type: Application
    Filed: August 26, 2009
    Publication date: June 30, 2011
    Inventors: Minoru Kasukawa, Shigeyuki Nakagawa, Kenji Miyamoto