Abstract: A charging base includes: a base seat installed on a floor surface; a columnar tower part provided on the base seat; a first support provided on the tower part and capable of supporting a vertical first electric vacuum cleaner; and a second support provided on the tower part and capable of supporting a vertical second electric vacuum cleaner. An electric vacuum cleaner system includes the charging base configured as described above, the vertical first electric vacuum cleaner, and the vertical second electric vacuum cleaner.

Abstract: A flux transfer apparatus (100) includes: a stage (12), having a concave part (13) at a central part; a flux pot (20), having, disposed on a bottom plate (25), a through hole (27) supplying flux (50) to a concave part (13), and reciprocally moving on a surface (14, 15) of the stage (12) to supply the flux (50) to the concave part (13); a detector (30), detecting a remaining amount of the flux (50) stored in the flux pot (20). The detector is disposed on a lower side of the stage (12) or a lateral side of the flux pot (20).

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

Abstract: This bonding apparatus is provided with: a tape feeder module which takes out an electronic component from a carrier tape and transfers the electronic component thus taken out; a die supply module which has a die pick-up mechanism for picking up a semiconductor die from a semiconductor wafer bonded to a dicing sheet by pushing up the semiconductor die and which transfers the semiconductor die thus picked up; and a bonding module which arranges, on a circuit substrate, the semiconductor die supplied by the die supply module and/or the electronic component supplied by the tape feeder module.

Abstract: A payment apparatus according to the present invention comprises an input unit to enter transaction information containing a transaction amount, a storage device to store payment method information containing a usage restriction for each of the payment method, a payment method information extracting apparatus to extract payment method information from the storage device by using the transaction information received from the input unit and selects a payment method to execute the payment according to the payment method information extracted, and a payment execution module to execute, by using the transaction information received from the payment method information extracting apparatus, the payment according to the payment method selected

Abstract: A payment apparatus according to the present invention comprises an input unit to enter transaction information containing a transaction amount, a storage device to store payment method information containing a usage restriction for each of the payment method, a payment method information extracting apparatus to extract payment method information from the storage device by using the transaction information received from the input unit and selects a payment method to execute the payment according to the payment method information extracted, and a payment execution module to execute, by using the transaction information received from the payment method information extracting apparatus, the payment according to the payment method selected