Abstract: A technique capable of reducing the possibility of generation of a Cu—Sb compound in an overlay and the possibility of delamination between layers. A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.

Abstract: A sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. The sliding member including an overlay formed of an alloy plating film of Bi and Sb, wherein Bi—Sb oxide is formed on a surface of the overlay.

Abstract: Provided are a sliding member and a sliding bearing which can improve the fatigue resistance. A sliding member having a base layer and a coating layer laminated on the base layer, in which the coating layer contains Bi or Sn as a first metal element, a second metal element which is harder than the first metal element and forms an intermetallic compound with the first metal element, C, and unavoidable impurities.

Abstract: [Object] Provided is a technique capable of reducing the possibility of generation of a Cu—Sb compound in an overlay and the possibility of delamination between layers. [Solution] A sliding member includes: an overlay including an alloy plating film of Bi and Sb; a lining including an Al alloy; a first intermediate layer including Cu as a main component, and laminated on the lining; and a second intermediate layer including Ag as a main component, and connecting the first intermediate layer and the overlay.

Abstract: To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

Abstract: Provided are a sliding member and a sliding bearing which can improve the fatigue resistance. A sliding member having a base layer and a coating layer laminated on the base layer, in which the coating layer contains Bi or Sn as a first metal element, a second metal element which is harder than the first metal element and forms an intermetallic compound with the first metal element, C, and unavoidable impurities.

Abstract: To provide a sliding member including an overlay capable of realizing good fatigue resistance while preventing interlayer peeling. A sliding member including an overlay formed of an alloy plating film of Bi and Sb, and the overlay is bonded to a lining formed of a copper alloy via an intermediate layer containing Ag as a main component.

Abstract: Provided are a sliding member and a sliding bearing which can improve the fatigue resistance. A sliding member having a base layer and a coating layer laminated on the base layer, in which the coating layer contains Bi or Sn as a first metal element, a second metal element which is harder than the first metal element and forms an intermetallic compound with the first metal element, C, and unavoidable impurities.

Abstract: In a method, in which a plain bearing alloy layer is bonded to a surface of a backing steel sheet, and, a Bi-based overlay layer is then deposited on the plain bearing alloy layer by electroplating, replacement of Bi with the backing steel sheet and deposition of Bi on the backing steel sheet are prevented. Prior to the step of electroplating of the Bi-based overlay layer, the following metals and the like are formed on at least the back surface of the backing steel sheet. An electrochemically more noble metal than Bi, an electrochemically more base metal than Bi and capable of forming a passivation state, or resin.

Abstract: In a method, in which a plain bearing alloy layer is bonded to a surface of a backing steel sheet, and, a Bi-based overlay layer is then deposited on the plain bearing alloy layer by electroplating, replacement of Bi with the backing steel sheet and deposition of Bi on the backing steel sheet are prevented. Prior to the step of electroplating of the Bi-based overlay layer, the following metals and the like are formed on at least the back surface of the backing steel sheet. An electrochemically more noble metal than Bi, an electrochemically more base metal than Bi and capable of forming a passivation state, or resin.

Abstract: The copper alloy (lining) prevails in an overwhelmingly large amount in a plain-bearing layer structure. Cu of the plain bearing copper-alloy diffuses into the Sn-based overlay diffuses into the Sn-based overlay and detrimentally impairs the performance of the overlay. The present invention takes a measure against this problem. An Sn-based overlay having a thickness of 3 to 19 ?m is deposited by electro-plating without an intermediate layer for diffusion prevention on a plain-bearing layer, which contains Sn and Ni in a total amount of more than 4 mass % to 20 mass % (the minimum amount of Sn is 4 mass %) and has a hardness of Hv 150 or less.

Abstract: [Task] In a method, in which a plain bearing alloy layer 3 is bonded to a surface of a backing steel sheet 1, and, a Bi-based overlay layer 10 is then deposited on the plain bearing alloy layer 3 by electroplating, replacement of Bi with the backing steel sheet 1 and deposition of Bi on the backing steel sheet 1 are prevented. [Solution Means] Prior to the step of electroplating of said Bi-based overlay layer 10, the following metals and the like are formed on at least the back surface of said backing steel sheet 1. An electrochemically more noble metal 2 than Bi, an electrochemically more base metal 2 than Bi and capable of forming a passivation state, or resin 4.

Abstract: The copper alloy (lining) prevails in an overwhelmingly large amount in a plain-bearing layer structure. Cu of the plain bearing copper-alloy diffuses into the Sn-based overlay diffuses into the Sn-based overlay and detrimentally impairs the performance of the overlay. The present invention takes a measure against this problem. An Sn-based overlay having a thickness of 3 to 19 ?m is deposited by electro-plating without an intermediate layer for diffusion prevention on a plain-bearing layer, which contains Sn and Ni in a total amount of more than 4 mass % to 20 mass % (the minimum amount of Sn is 4 mass %) and has a hardness of Hv 150 or less.

Abstract: An overlay alloy for sliding bearing is deposited on a lining by plating and consists of from 2 to less than 5% of tin, from 0.05 to 10% of indium, from 0.05 to 5% of copper, the balance consisting of lead and unavoidable compound. Seizure at high speed travel is almost completely eliminated.