Abstract: The present invention provides a display module with touch function, including: a touch display panel and a control chip. The touch display panel contains a display area and non-display area around the display area. The display area contains a first sensing electrode constituted by a pixel electrode layer. The non-display area contains two second sensing electrodes. The control chip electrically connects with the first sensing electrode and the two second sensing electrodes separately through wires. The first sensing electrode and the second sensing electrode are self-capacitance sensing electrode. The control chip is used to read the self-capacitance variation of the first sensing electrode and the two second sensing electrodes for outputting a touch signal.

Abstract: A touch control device with ESD protection includes a touch display panel, a switching unit, a touch electrode and a ground electrode. An ESD protection electrode is provided around at least one periphery of the touch display panel. A scanning period of the ESD protection electrode is divided into touch periods and ESD periods. When the scanning period of the ESD protection electrode is during the touch periods, the ESD protection electrode is used as touch electrodes for sensing touch events made by a user on the touch display panel. When the scanning period of the ESD protection electrode is during the ESD periods, the ESD protection electrode is used as ESD protection electrodes for dissipating ESD on the touch display panel in order to protect signal elements inside the touch display panel. The ESD protection electrode is therefore used for not only ESD protection, but also touch sensing.

Abstract: The present disclosure provides a rear structure coupled to a display panel. The rear structure comprises a wall mount assembly comprising a first kit comprising a first wall mount bracket, a plurality of circularly arranged first trenches, and a plurality of first magnets accommodated by the first trenches, and a second kit removably coupled to the first kit comprising a second wall mount bracket structurally complementary to the first wall mount bracket, a plurality of circularly arranged second trenches, and a plurality of second magnets accommodated by the second trenches. Wherein when the first kit is coupled to the second kit, each of the first magnets is located corresponds to one of the second magnets, and a magnetism of a side of one of the first magnets facing the second kit is opposite to a magnetism of a side of one of the second magnets facing the first kit.

Abstract: A method for fabricating microfluidic structures is provided. The method includes: a belt is provided and an adhesion layer is formed on at least one surface of the belt; the belt is cut for forming a first microfluidic channel thereon, wherein the first microfluidic channel has an accommodating space; a second microfluidic channel is provided, wherein a line-width of the second microfluidic channel is smaller than a line-width of the first microfluidic channel; the second microfluidic channel is disposed in the accommodating space of the first microfluidic channel; and a substrate is adhered to the belt via the adhesion layer.

Abstract: A method for fabricating microfluidic structures is provided. The method includes: a belt is provided and an adhesion layer is formed on at least one surface of the belt; the belt is cut for forming a first microfluidic channel thereon, wherein the first microfluidic channel has an accommodating space; a second microfluidic channel is provided, wherein a line-width of the second microfluidic channel is smaller than a line-width of the first microfluidic channel; the second microfluidic channel is disposed in the accommodating space of the first microfluidic channel; and a substrate is adhered to the belt via the adhesion layer.

Abstract: An antenna is provided and includes a first antenna structure, a signal reflection structure, and an assembling unit. The first antenna structure has a first positioning portion and a radiator having a free end. The signal reflection structure has a second positioning portion, in which the signal reflection structure is configured to be assembled with the first antenna structure, and the first positioning portion corresponds with the second positioning portion. The assembling unit is for assembling the first antenna structure and the signal reflection structure in conjunction with the first and second positioning portions. The inner edge is configured to abut against the first antenna structure and the signal reflection structure. The receiving groove is located at one of the end portions of the assembling unit, in which the receiving groove is capable of receiving the free end of the radiator in order to limit its movement.

Abstract: A touch control device with ESD protection includes a touch display panel, a switching unit, a touch electrode and a ground electrode. An ESD protection electrode is provided around at least one periphery of the touch display panel. A scanning period of the ESD protection electrode is divided into touch periods and ESD periods. When the scanning period of the ESD protection electrode is during the touch periods, the ESD protection electrode is used as touch electrodes for sensing touch events made by a user on the touch display panel. When the scanning period of the ESD protection electrode is during the ESD periods, the ESD protection electrode is used as ESD protection electrodes for dissipating ESD on the touch display panel in order to protect signal elements inside the touch display panel. The ESD protection electrode is therefore used for not only ESD protection, but also touch sensing.

Abstract: An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.

Abstract: The present disclosure provides a rear structure coupled to a display panel. The rear structure comprises a wall mount assembly comprising a first kit comprising a first wall mount bracket, a plurality of circularly arranged first trenches, and a plurality of first magnets accommodated by the first trenches, and a second kit removably coupled to the first kit comprising a second wall mount bracket structurally complementary to the first wall mount bracket, a plurality of circularly arranged second trenches, and a plurality of second magnets accommodated by the second trenches. Wherein when the first kit is coupled to the second kit, each of the first magnets is located corresponds to one of the second magnets, and a magnetism of a side of one of the first magnets facing the second kit is opposite to a magnetism of a side of one of the second magnets facing the first kit.

Abstract: An antenna is provided and includes a first antenna structure, a signal reflection structure, and an assembling unit. The first antenna structure has a first positioning portion and a radiator having a free end. The signal reflection structure has a second positioning portion, in which the signal reflection structure is configured to be assembled with the first antenna structure, and the first positioning portion corresponds with the second positioning portion. The assembling unit is for assembling the first antenna structure and the signal reflection structure in conjunction with the first and second positioning portions. The inner edge is configured to abut against the first antenna structure and the signal reflection structure. The receiving groove is located at one of the end portions of the assembling unit, in which the receiving groove is capable of receiving the free end of the radiator in order to limit its movement.

Abstract: An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.

Abstract: The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a first protective layer directly on the first metal layer, forming a second protective layer by using a compound comprising a thiol group directly on the first protective layer, patterning the second protective layer to form a pattern having an opening exposing the first protective layer, and forming a second metal layer within the opening of the second protective layer and directly on the first protective layer. The substrate structure would include a base, a first metal layer, a first protective layer, a second protective layer, and a second metal layer.

Abstract: A metal pattern formed in the electromagnetic absorber structure is provided. By performing the laser treatment to form the active layer thereon, the metal pattern can be regionally formed on the electromagnetic absorber structure in the following electroless plating processes.

Abstract: A manufacturing method of a substrate structure including the following steps is provided. A chemical surface treatment is performed on a metal base such that a passivation layer is formed on a surface of the metal base. The metal base is assembled to a substrate. A metal pattern is formed on the substrate, wherein the metal pattern is separated from the metal base. A substrate structure and a metal component are also provided.

Abstract: A method for fabricating microfluidic structures is provided. The method includes: a belt is provided and an adhesion layer is formed on at least one surface of the belt; the belt is cut for forming a first microfluidic channel thereon wherein the first microfluidic channel has an accommodating space; a second microfluidic channel is provided, wherein a line-width of the second microfluidic channel is smaller than a line-width of the first microfluidic channel; the second microfluidic channel is disposed in the accommodating space of the first microfluidic channel; and a substrate is adhered to the belt via the adhesion layer.

Abstract: A method for fabricating microfluidic structures is provided. The method includes: a belt is provided and an adhesion layer is formed on at least one surface of the belt; the belt is cut for forming a first microfluidic channel thereon, wherein the first microfluidic channel has an accommodating space; a second microfluidic channel is provided, wherein a line-width of the second microfluidic channel is smaller than a line-width of the first microfluidic channel; the second microfluidic channel is disposed in the accommodating space of the first microfluidic channel; and a substrate is adhered to the belt via the adhesion layer.

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form a conductive pattern on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the conductive pattern is remained on the surface of the polymer substrate. Then, the conductive pattern on the polymer substrate is subjected to an electroplating process to form the metallic pattern over the conductive pattern on the polymer substrate.

Abstract: A method for forming a patterned conductive structure is provided. The method includes forming a soluble layer on a surface of a substrate, wherein the soluble layer has an opening exposing a rough portion of the surface. A first conductive layer is formed on the soluble layer, wherein the first conductive layer extends onto the rough portion in the opening. The soluble layer and the first conductive layer on the soluble layer are removed, wherein a portion of the first conductive layer corresponding to the rough portion is remained on the substrate. A patterned conductive structure formed by the method is also provided.