Patents by Inventor Shih-An LIAO

Shih-An LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12210208
    Abstract: A driving mechanism is provided for moving an optical element, including a fixed module, a movable module holding the optical element, a driving assembly for driving the movable module to move relative to the fixed module, a position-sensing element, and a 3D circuit. The fixed module has a base, and the position-sensing element is disposed on the base to detect the movement of the movable module relative to the fixed module. The 3D circuit is embedded in the base and electrically connected to the position-sensing element.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: January 28, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Shao-Chung Chang, Fu-Yuan Wu, Yu-Huai Liao, Shou-Jen Liu, Kun-Shih Lin, Chien-Lun Huang, Shih-Wei Hung
  • Patent number: 12201259
    Abstract: A suction device and a suction force adjustment method thereof are provided. An optical detection unit is disposed on a suction path of a suction pipe to detect an object flowing through the suction pipe. Physical features of the object are determined according to a sensing result of the optical detection unit. A suction force of a suction unit is regulated based on the physical features of the object.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: January 21, 2025
    Assignee: Aspect Microsystems Corp.
    Inventors: Mingshun Shih, Jung-Fu Liao
  • Publication number: 20240405181
    Abstract: An embodiment of the present disclosure provides a semiconductor device arrangement. This arrangement includes a substrate, an adhesive structure, and a first semiconductor device. The substrate includes an upper surface. The adhesive structure is located on the upper surface and includes a first concave region. The first semiconductor device includes a lower surface facing toward the adhesive structure and a conductive bump located under the lower surface and in the first concave region. The conductive bump includes a first portion and a second portion. Wherein the lower surface does not contact the adhesive structure, the first portion contacts the first concave region, and the second portion does not contact the first concave region.
    Type: Application
    Filed: June 4, 2024
    Publication date: December 5, 2024
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Wei-Yu CHEN, Li-Shen TANG, Kun-Wei KAO, Jia-Xing CHUNG, Wei-Shan HU, Ching-Tai CHENG, Chang-Tai HSIAO, Yih-Hua RENN, Chun-Yen WU
  • Patent number: 12154885
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Grant
    Filed: August 15, 2023
    Date of Patent: November 26, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Publication number: 20240363817
    Abstract: A semiconductor device includes a semiconductor stack, a protective layer on the semiconductor stack, an electrode on the semiconductor stack and electrically connected to the semiconductor stack, and a conductive bump on the electrode. The thickness of the conductive bump is measured from the topmost point of the conductive bump to the uppermost surface of the protective layer. The ratio of the thickness of the conductive bump to the maximum width of the conductive bump is between 0.1 and 0.4, and the electrode is devoid of gold.
    Type: Application
    Filed: June 12, 2023
    Publication date: October 31, 2024
    Inventors: Jia-Xing CHUNG, Wei-Shan HU, Ching-Tai CHENG, Shih-An LIAO
  • Patent number: 12127368
    Abstract: A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: October 22, 2024
    Assignee: LDC Precision Engineering CO., Ltd.
    Inventors: Feng-Shih Liao, Chih-Wei Chen, Wu-Hsiung Liu
  • Patent number: 12119321
    Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vie
    Type: Grant
    Filed: September 19, 2022
    Date of Patent: October 15, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-An Liao, Shau-Yi Chen, Ming-Chi Hsu, Chun-Hung Liu, Min-Hsun Hsieh
  • Publication number: 20240203920
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first electrode and a second electrode disposed on a substrate, a first conductive bump disposed on the first electrode, and a second conductive bump disposed on the second electrode, wherein, the first conductive bump has a first convex top surface, the second conductive bump has a second convex top surface, and the top of the first convex top surface and the top of the second convex top surface substantially have a same horizontal height. The composition of the first electrode includes a first metal. The composition of the first conductive bump includes the first metal and a second metal. The content of the first metal in the first conductive bump is gradually decreased in a direction away from the first electrode.
    Type: Application
    Filed: December 12, 2023
    Publication date: June 20, 2024
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Jan-Way CHIEN
  • Patent number: 11885153
    Abstract: A door lock with an energy-saving device, comprising: an electromagnet assembly secured on the door frame, which has an electromagnet and a control circuit board, and an adsorption assembly secured on the door board, which has a positioning unit and an iron plate, a set of linkage sensing mechanism set on the electromagnet, and a set of clutch mechanism set on the adsorption assembly; Thereby, when close the door board into the door frame, the control circuit board supplies power to the electromagnet with the high current in the normal locking mode to attract iron plate, and then, the clutch mechanism drives the linkage sensing mechanism to act, triggering the control circuit board to supply power with low current in the power-saving lock mode to maintain the closed state of the door panel.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: January 30, 2024
    Inventor: Li-Shih Liao
  • Publication number: 20230395562
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: August 15, 2023
    Publication date: December 7, 2023
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Patent number: 11728310
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: August 15, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Publication number: 20230126928
    Abstract: A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.
    Type: Application
    Filed: October 12, 2022
    Publication date: April 27, 2023
    Inventors: Feng-Shih LIAO, Chih-Wei CHEN, Wu-Hsiung LIU
  • Publication number: 20230119631
    Abstract: A semiconductor device includes a semiconductor stack, a protective layer on the semiconductor stack, an electrode on the semiconductor stack and electrically connected to the semiconductor stack, and a conductive bump on the electrode. The thickness of the conductive bump is measured from the topmost point of the conductive bump to the uppermost surface of the protective layer. The ratio of the thickness of the conductive bump to the maximum width of the conductive bump is between 0.1 and 0.4.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 20, 2023
    Inventors: Min-Hsun HSIEH, Shih-An LIAO
  • Patent number: 11588084
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: February 21, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Patent number: 11578838
    Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.
    Type: Grant
    Filed: April 19, 2022
    Date of Patent: February 14, 2023
    Assignee: EPISTAR CORPORATION
    Inventors: Chiu-Lin Yao, Min-Hsun Hsieh, Been-Yu Liaw, Wei-Chiang Hu, Po-Hung Lai, Chun-Hung Liu, Shih-An Liao, Yu-His Sung, Ming-Chi Hsu
  • Publication number: 20230017939
    Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vie
    Type: Application
    Filed: September 19, 2022
    Publication date: January 19, 2023
    Inventors: Shih-An LIAO, Shau-Yi CHEN, Ming-Chi HSU, Chun-Hung LIU, Min-Hsun HSIEH
  • Publication number: 20220412123
    Abstract: A door lock with an energy-saving device, comprising: an electromagnet assembly secured on the door frame, which has an electromagnet and a control circuit board, and an adsorption assembly secured on the door board, which has a positioning unit and an iron plate, a set of linkage sensing mechanism set on the electromagnet, and a set of clutch mechanism set on the adsorption assembly; Thereby, when close the door board into the door frame, the control circuit board supplies power to the electromagnet with the high current in the normal locking mode to attract iron plate, and then, the clutch mechanism drives the linkage sensing mechanism to act, triggering the control circuit board to supply power with low current in the power-saving lock mode to maintain the closed state of the door panel.
    Type: Application
    Filed: June 28, 2022
    Publication date: December 29, 2022
    Inventor: LI-SHIH LIAO
  • Patent number: 11530804
    Abstract: A light-emitting device includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: December 20, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Hsun Hsieh, Ying-Yang Su, Shih-An Liao, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
  • Patent number: 11519564
    Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: December 6, 2022
    Assignee: EPISTAR CORPORATION
    Inventors: Chiu-Lin Yao, Min-Hsun Hsieh, Been-Yu Liaw, Wei-Chiang Hu, Po-Hung Lai, Chun-Hung Liu, Shih-An Liao, Yu-His Sung, Ming-Chi Hsu
  • Publication number: 20220336718
    Abstract: A light-emitting device includes a carrier, a light-emitting unit disposed on the carrier, a reflective element arranged on the light-emitting unit, and an optical element arranged on the carrier and surrounding the light-emitting unit.
    Type: Application
    Filed: July 1, 2022
    Publication date: October 20, 2022
    Inventors: Min-Hsun HSIEH, Shih-An LIAO