Patents by Inventor Shih-An LIAO
Shih-An LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240111210Abstract: A method of manufacturing a semiconductor device includes the following steps. A photoresist layer is formed over a material layer on a substrate. The photoresist layer has a composition including a solvent and a first photo-active compound dissolved in the solvent. The first photo-active compound is represented by the following formula (A1) or formula (A2): Zr12O8(OH)14(RCO2)18 ??Formula (A1); or Hf6O4(OH)6(RCO2)10 ??Formula (A2). R in the formula (A1) and R in the formula (A2) each include one of the following formulae (1) to (6): The photoresist layer is patterned. The material layer is etched using the photoresist layer as an etch mask.Type: ApplicationFiled: May 9, 2023Publication date: April 4, 2024Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TSING HUA UNIVERSITYInventors: Jui-Hsiung LIU, Pin-Chia LIAO, Ting-An LIN, Ting-An SHIH, Yu-Fang TSENG, Burn Jeng LIN, Tsai-Sheng GAU, Po-Hsiung CHEN, Po-Wen CHIU
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Publication number: 20240082964Abstract: A system for maintaining a device in a semiconductor manufacturing environment that includes a controller configured to determine a distance travelled by the device within the semiconductor manufacturing environment, where the device has a feature that selectively engages a carrier configured to carry a semiconductor wafer such that the device moves the semiconductor wafer to different processing stations within the semiconductor manufacturing environment. The system also includes an inspection component configured to inspect the device responsive to the distance travelled by the device exceeding a distance threshold, a repair component configured to repair the device responsive to a repair indication from at least one of the controller or the inspection component, and a cleaning component configured to clean the device responsive to a clean indication from at least one of the controller or the inspection component.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Inventors: Vincent CHIEN, Shih YI-CHENG, Hill LIAO
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Publication number: 20240077701Abstract: An optical imaging lens includes six lens elements. The object-side surface of the first lens element has a convex part in a vicinity of the periphery of the first lens element, the image-side surface of the second lens element has a concave part in a vicinity of the periphery of the first lens element, the object-side surface of the third lens element has a convex part in a vicinity of the optical axis, the image-side surface of the fourth lens element has a convex part in a vicinity of the periphery of the fourth lens element, the image-side surface of the fifth lens element has a concave part in a vicinity of the optical axis, and the sixth lens element has negative refractive power.Type: ApplicationFiled: July 10, 2023Publication date: March 7, 2024Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.Inventors: Shih-Han Chen, Huabin Liao, Changlin Zhao
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Patent number: 11885153Abstract: A door lock with an energy-saving device, comprising: an electromagnet assembly secured on the door frame, which has an electromagnet and a control circuit board, and an adsorption assembly secured on the door board, which has a positioning unit and an iron plate, a set of linkage sensing mechanism set on the electromagnet, and a set of clutch mechanism set on the adsorption assembly; Thereby, when close the door board into the door frame, the control circuit board supplies power to the electromagnet with the high current in the normal locking mode to attract iron plate, and then, the clutch mechanism drives the linkage sensing mechanism to act, triggering the control circuit board to supply power with low current in the power-saving lock mode to maintain the closed state of the door panel.Type: GrantFiled: June 28, 2022Date of Patent: January 30, 2024Inventor: Li-Shih Liao
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Publication number: 20230395562Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.Type: ApplicationFiled: August 15, 2023Publication date: December 7, 2023Applicant: EPISTAR CORPORATIONInventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
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Patent number: 11728310Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.Type: GrantFiled: June 13, 2022Date of Patent: August 15, 2023Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
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Publication number: 20230126928Abstract: A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.Type: ApplicationFiled: October 12, 2022Publication date: April 27, 2023Inventors: Feng-Shih LIAO, Chih-Wei CHEN, Wu-Hsiung LIU
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Publication number: 20230119631Abstract: A semiconductor device includes a semiconductor stack, a protective layer on the semiconductor stack, an electrode on the semiconductor stack and electrically connected to the semiconductor stack, and a conductive bump on the electrode. The thickness of the conductive bump is measured from the topmost point of the conductive bump to the uppermost surface of the protective layer. The ratio of the thickness of the conductive bump to the maximum width of the conductive bump is between 0.1 and 0.4.Type: ApplicationFiled: October 7, 2022Publication date: April 20, 2023Inventors: Min-Hsun HSIEH, Shih-An LIAO
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Patent number: 11588084Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.Type: GrantFiled: January 22, 2020Date of Patent: February 21, 2023Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Shih-An Liao, Ying-Yang Su, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
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Patent number: 11578838Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.Type: GrantFiled: April 19, 2022Date of Patent: February 14, 2023Assignee: EPISTAR CORPORATIONInventors: Chiu-Lin Yao, Min-Hsun Hsieh, Been-Yu Liaw, Wei-Chiang Hu, Po-Hung Lai, Chun-Hung Liu, Shih-An Liao, Yu-His Sung, Ming-Chi Hsu
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Publication number: 20230017939Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vieType: ApplicationFiled: September 19, 2022Publication date: January 19, 2023Inventors: Shih-An LIAO, Shau-Yi CHEN, Ming-Chi HSU, Chun-Hung LIU, Min-Hsun HSIEH
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Publication number: 20220412123Abstract: A door lock with an energy-saving device, comprising: an electromagnet assembly secured on the door frame, which has an electromagnet and a control circuit board, and an adsorption assembly secured on the door board, which has a positioning unit and an iron plate, a set of linkage sensing mechanism set on the electromagnet, and a set of clutch mechanism set on the adsorption assembly; Thereby, when close the door board into the door frame, the control circuit board supplies power to the electromagnet with the high current in the normal locking mode to attract iron plate, and then, the clutch mechanism drives the linkage sensing mechanism to act, triggering the control circuit board to supply power with low current in the power-saving lock mode to maintain the closed state of the door panel.Type: ApplicationFiled: June 28, 2022Publication date: December 29, 2022Inventor: LI-SHIH LIAO
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Patent number: 11530804Abstract: A light-emitting device includes a first light-emitting module, a second light-emitting module, a conductive layer and an insulation layer. The first light-emitting module includes a first substrate having a first cavity, a first sidewall, and a light-emitting component disposed on the first substrate. The second module includes a second substrate having a second cavity corresponding to the first cavity and a second sidewall corresponding to the first sidewall. The conductive layer is directly connected to the first cavity and the second cavity and electrically connect the first light-emitting module and the second light-emitting module. The insulation layer is directly connected to the first sidewall and the second sidewall.Type: GrantFiled: January 20, 2021Date of Patent: December 20, 2022Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Ying-Yang Su, Shih-An Liao, Hsin-Mao Liu, Tzu-Hsiang Wang, Chi-Chih Pu
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Patent number: 11519564Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.Type: GrantFiled: July 6, 2021Date of Patent: December 6, 2022Assignee: EPISTAR CORPORATIONInventors: Chiu-Lin Yao, Min-Hsun Hsieh, Been-Yu Liaw, Wei-Chiang Hu, Po-Hung Lai, Chun-Hung Liu, Shih-An Liao, Yu-His Sung, Ming-Chi Hsu
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Publication number: 20220336718Abstract: A light-emitting device includes a carrier, a light-emitting unit disposed on the carrier, a reflective element arranged on the light-emitting unit, and an optical element arranged on the carrier and surrounding the light-emitting unit.Type: ApplicationFiled: July 1, 2022Publication date: October 20, 2022Inventors: Min-Hsun HSIEH, Shih-An LIAO
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Publication number: 20220310555Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.Type: ApplicationFiled: June 13, 2022Publication date: September 29, 2022Applicant: EPISTAR CORPORATIONInventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
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Publication number: 20220302357Abstract: This disclosure discloses a light-emitting element having a light-emitting unit, a transparent layer and a wavelength conversion layer formed on the transparent layer. The transparent layer covers the light-emitting unit.Type: ApplicationFiled: June 7, 2022Publication date: September 22, 2022Inventors: Ching-Tai CHENG, Ju-Lien KUO, Min-Hsun HSIEH, Shau-Yi CHEN, Shih-An LIAO, Jhih-Hao CHEN
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Patent number: 11450639Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stack structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface of the carrier; and a conductive connecting layer comprising a first conductive part, comprising a first outer contour, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conductive part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conductive part to form a covering area, wherein the first bonding surface comprises a first position which is the closest to the carrier within the covering area and a second position which is the farthest from the carrier within the covering area in a cross section vieType: GrantFiled: February 1, 2021Date of Patent: September 20, 2022Assignee: EPISTAR CORPORATIONInventors: Shih-An Liao, Shau-Yi Chen, Ming-Chi Hsu, Chun-Hung Liu, Min-Hsun Hsieh
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Publication number: 20220252228Abstract: This disclosure discloses a light-emitting bulb. The light-emitting bulb includes a cover, an electrical associated with the cover, a board arranged between the cover and the electrical connector, and a first light-emitting device disposed on the board. The first light-emitting device includes a carrier having a first side and a second side, a first electrode part disposed near the first side and extending to the second side, a bended part disposed near to the second side and spaced apart from the first electrode part, and a second electrode part extending from the bended part to the first side. No light-emitting diode unit is arranged on the second electrode part.Type: ApplicationFiled: April 19, 2022Publication date: August 11, 2022Inventors: Chiu-Lin YAO, Min-Hsun HSIEH, Been-Yu LIAW, Wei-Chiang HU, Po-Hung LAI, Chun-Hung LIU, Shih-An LIAO, Yu-His SUNG, Ming-Chi HSU
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Patent number: 11380828Abstract: A light-emitting device includes a carrier, a light-emitting unit disposed on the carrier, a reflective element arranged on the light-emitting unit, and an optical element arranged on the carrier and surrounding the light-emitting unit.Type: GrantFiled: December 21, 2020Date of Patent: July 5, 2022Assignee: EPISTAR CORPORATIONInventors: Min-Hsun Hsieh, Shih-An Liao