Patents by Inventor Shih-An LIAO

Shih-An LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200333564
    Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side along an optical axis. The first lens element has negative refractive power. The object-side surface of the fourth lens element has a convex part in a vicinity of a periphery of the fourth lens element. The image-side surface of the sixth lens element has a convex part in a vicinity of a periphery of the sixth lens element. The effective focal length of the optical imaging lens is EFL, and a sum of all air gaps from the first lens element to the sixth lens element along the optical axis is AAG, and EFL and AAG satisfy 0.9?EFL/AAG?2.6.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 22, 2020
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Shih-Han Chen, Huabin Liao, Changlin Zhao
  • Publication number: 20200333563
    Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side along an optical axis. The object-side surface of the first lens element has a convex portion in a vicinity of a periphery of the first lens element. The second lens element has negative refractive power. The object-side surface of the second lens element has a convex portion in a vicinity of a periphery of the second lens element. The image-side surface of the fifth lens element has a concave portion in a vicinity of the optical axis. The image-side surface of the sixth lens element has a concave portion in a vicinity of the optical axis.
    Type: Application
    Filed: May 4, 2020
    Publication date: October 22, 2020
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Shih-Han Chen, Huabin Liao, Changlin Zhao
  • Publication number: 20200312421
    Abstract: A memory test array and a test method thereof are provided. The memory test array includes a first memory array, a second memory array, and a plurality of first common conductive pads. The first memory array includes a plurality of first bit lines and a plurality of first word lines. The second memory array is adjacent to the first memory array and includes a plurality of second bit lines and a plurality of second word lines. Each of the first common conductive pads has a first end and a second end, and the first ends and the second ends are respectively coupled to the first bit lines and the second bit lines, or respectively coupled to the first word lines and the second word lines. The memory test array of the present disclosure can effectively save the area of the memory test chip and make the test process more efficient.
    Type: Application
    Filed: July 22, 2019
    Publication date: October 1, 2020
    Inventors: Hsiung-Shih CHANG, Yu-Cheng LIAO, Meng-Hsueh TSAI
  • Patent number: 10770636
    Abstract: The invention discloses a light-emitting device and a manufacturing method thereof. The light-emitting device comprising: a light-emitting unit, the light-emitting unit comprises a non-light-emitting element and a light-emitting diode; a reflective layer covering the non-light-emitting element; a light-transmitting layer covering the reflective layer and the light-emitting diode; a metal connection layer electrically connecting the non-light-emitting element and the light-emitting diode.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: September 8, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-An Liao, Ming-Chi Hsu
  • Patent number: 10764475
    Abstract: A driving mechanism is provided, including a housing, a hollow frame, a holder, and a driving assembly. The frame is fixed to the housing and has a stop surface. The holder is movably disposed in the housing for holding the optical element. The driving assembly is disposed in the housing to drive the holder and the optical element moving along the optical axis of the optical element relative to the frame. Specifically, the stop surface is parallel to the optical axis to contact the holder and restrict the holder in a limit position.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: September 1, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Bing-Ru Song, Yi-Ho Chen, Chia-Pin Hsu, Chih-Wei Weng, Shin-Hua Chen, Chien-Lun Huang, Chao-Chun Chang, Shou-Jen Liu, Kun-Shih Lin, Nai-Wen Hsu, Yu-Cheng Lin, Shang-Yu Hsu, Yu-Huai Liao, Yi-Hsin Nieh, Shih-Ting Huang, Kuo-Chun Kao, Fu-Yuan Wu
  • Publication number: 20200243737
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: January 22, 2020
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20200243478
    Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.
    Type: Application
    Filed: August 27, 2019
    Publication date: July 30, 2020
    Applicant: EPISTAR CORPORATION
    Inventors: Min-Hsun HSIEH, Shih-An LIAO, Ying-Yang SU, Hsin-Mao LIU, Tzu-Hsiang WANG, Chi-Chih PU
  • Publication number: 20200227371
    Abstract: A light-emitting module includes a common carrier; a plurality of semiconductor devices formed on the common carrier, and each of the plurality of semiconductor devices including three semiconductor dies; a carrier including a connecting surface; a third bonding pad and a fourth bonding pad formed on the connecting surface; and a connecting layer. One of the three semiconductor dies includes a stacking structure; a first bonding pad; and a second bonding pad with a shortest distance less than 150 microns between the first bonding pad. The connecting layer includes a first conductive part including a first conductive material having a first shape; and a blocking part covering the first conductive part and including a second conductive material having a second shape with a diameter in a cross-sectional view. The first shape has a height greater than the diameter.
    Type: Application
    Filed: March 31, 2020
    Publication date: July 16, 2020
    Inventors: Shih-An LIAO, Shau-Yi CHEN, Ming-Chi HSU, Chun-Hung LIU, Min-Hsun HSIEH
  • Patent number: 10714666
    Abstract: A light-emitting device includes a light body having an internal electrode layer, and a conductive layer. The conductive layer has a first portion formed on the internal electrode layer and overlapping the light body in a first direction, and a second portion overlapping the light body in a second direction. The first direction is perpendicular to the second direction.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: July 14, 2020
    Assignee: Epistar Corporation
    Inventors: Lung-Kuan Lai, Ching-Tai Cheng, Yih-Hua Renn, Min-Hsun Hsieh, Chun-Hung Liu, Shih-An Liao, Ming-Chi Hsu, Yu Chen Liao
  • Publication number: 20200215284
    Abstract: An airway device for a subject which has an airway tube having a distal end and a proximal end, and a laryngeal mask disposed surrounding the distal end of the airway tube, wherein the inner part of the laryngeal mask has a hollow body filled with a biocompatible thermosensitive hydrogel, wherein the biocompatible thermosensitive hydrogel is gelified within a temperature range such that the biocompatible thermosensitive hydrogel, upon being gelified, allows the laryngeal mask to fit over the circumference of a laryngeal inlet of the subject.
    Type: Application
    Filed: December 22, 2017
    Publication date: July 9, 2020
    Applicant: E-PROSPERITY & DEVELOPMENT CO., Ltd.
    Inventors: Cheng-Shih Lien, Tsu-Tai Lin, Ming-Thau Sheu, Chen-Chun Liao
  • Publication number: 20200191157
    Abstract: A heat dissipation fan suited for being assembled in an electronic device is provided. The heat dissipation fan includes a hub and a plurality of fan blades disposed at and surrounding the hub. The fan blade has ductility and flexibility, and any two fan blades next to each other are in different thickness.
    Type: Application
    Filed: December 17, 2019
    Publication date: June 18, 2020
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Wen-Neng Liao, Cheng-Wen Hsieh, Chun-Chieh Wang, Hung-Chi Chen, Yu-Shih Wang, Ming-Fei Tsai
  • Patent number: 10684451
    Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side. The object-side surface of the fourth lens element has a convex portion in a vicinity of a periphery of the fourth lens element. The fifth lens element has negative refractive power. The effective focal length of the optical imaging lens EFL and the sum of all air gaps from the first lens element to the sixth lens element along the optical axis AAG of the optical imaging lens satisfies the relation: 0.9?EFL/AAG?2.6.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 16, 2020
    Assignee: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Shih-Han Chen, Huabin Liao, Changlin Zhao
  • Patent number: 10673482
    Abstract: A signal transmission device includes a transceiver circuitry and a control circuitry. The transceiver circuitry is configured to receive first device data from an external device through a channel. The control circuitry is configured to calculate a least one system parameter of the transceiver circuitry based on the first device data, second device data associated with the transceiver circuitry, and at least one requirement of a predetermined communication protocol, in order to link with the external device.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: June 2, 2020
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Juh Kang, Yu-Chu Chen, Hua-Shih Liao
  • Patent number: 10622325
    Abstract: A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stacking structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface; and a conductive connecting layer comprising a first conducting part, comprising a first outer boundary, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conducting part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conducting part.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: April 14, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-An Liao, Shau-Yi Chen, Ming-Chi Hsu, Chun-Hung Liu, Min-Hsun Hsieh
  • Publication number: 20200110246
    Abstract: An optical imaging lens includes first, second, third, fourth, fifth and sixth lens elements arranged in order from the object side to the image side. The object-side surface of the fourth lens element has a convex portion in a vicinity of a periphery of the fourth lens element. The fifth lens element has negative refractive power. The effective focal length of the optical imaging lens EFL and the sum of all air gaps from the first lens element to the sixth lens element along the optical axis AAG of the optical imaging lens satisfies the relation: 0.9?EFL/AAG?2.6.
    Type: Application
    Filed: October 7, 2019
    Publication date: April 9, 2020
    Inventors: Shih-Han Chen, Huabin Liao, Changlin Zhao
  • Publication number: 20200098207
    Abstract: A smart locking system with biometrics authentication allows a user with a portable electronic device installed with an application program. The portable electronic device includes an identification code, a biometric characteristics retrieving module and an input unit. The application program has the identification code registered in a controller of a smart lock device and has the biometric characteristics retrieving module retrieve the biometric characteristics of the user. After matching and authentication of the application program, a password is produced and input into a biometric characteristics button of the input unit correspondingly. When the user is carrying the portable electronic device in the predetermined distance set in a Bluetooth module of the electronic device, the device automatically transmits a Bluetooth package to the controller and when the biometric characteristics button is touched and pressed, the controller is activated and operates the lock device via the driving circuit module.
    Type: Application
    Filed: March 12, 2019
    Publication date: March 26, 2020
    Inventor: LI-SHIH LIAO
  • Publication number: 20200096728
    Abstract: An optical element driving mechanism is provided, including: a movable portion for holding an optical element; a fixed portion comprising a case and a bottom arranged along a main axis, wherein the case includes: a top plate extended along a direction that is perpendicular to the main axis; a sidewall extended from edges of the top plate along the main axis and fixed on the bottom, wherein the sidewall includes: a first surface parallel to the main axis; a second surface connected to the first surface and is not parallel to the first surface; and a third surface opposite to the second surface and is not parallel to the first surface; and an adhesive element, wherein the case is connected to the bottom through the adhesive element, and the adhesive element is in direct contact with the second surface and the third surface.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Inventors: Kun-Shih LIN, Yu-Sheng LI, Shih-Ting HUANG, Yi-Hsin NIEH, Yu-Huai LIAO
  • Patent number: 10586902
    Abstract: A light-emitting device includes a light-emitting structure with a side surface, and a reflective layer covering the side surface. The light-emitting structure has a first light-emitting angle and a second light-emitting angle. The difference between the first light-emitting angle and the second light-emitting angle is larger than 15°.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: March 10, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chien-Liang Liu, Ming-Chi Hsu, Shih-An Liao, Chun-Hung Liu, Zhi-Ting Ye, Cheng-Teng Ye, Po-Chang Chen, Sheng-Che Chiou
  • Publication number: 20200067557
    Abstract: A signal transmission device includes a transceiver circuitry and a control circuitry. The transceiver circuitry is configured to receive first device data from an external device through a channel. The control circuitry is configured to calculate a least one system parameter of the transceiver circuitry based on the first device data, second device data associated with the transceiver circuitry, and at least one requirement of a predetermined communication protocol, in order to link with the external device.
    Type: Application
    Filed: March 6, 2019
    Publication date: February 27, 2020
    Inventors: Wen-Juh KANG, Yu-Chu CHEN, Hua-Shih LIAO
  • Patent number: D891504
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: July 28, 2020
    Assignee: TDK TAIWAN CORP.
    Inventors: Fu-Yuan Wu, Kun-Shih Lin, Shang-Yu Hsu, Yi-Ho Chen, Shih-Ting Huang, Shou-Jen Liu, Chien-Lun Huang, Yi-Hsin Nieh, Chen-Chi Kuo, Chia-Pin Hsu, Yu-Huai Liao, Shin-Hua Chen, Yu-Cheng Lin, Shao-Chung Chang, Kuo-Chun Kao, Chia-Hsiu Liu, Chao-Chun Chang, Yuan-Shih Liao