Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

Abstract: A physical unclonable function (PUF) generator structure including a substrate and a PUF generator is provided. The PUF generator includes a first electrode layer, a second electrode layer, a first dielectric layer, a first contact, a second contact, and a third contact. The first electrode layer is disposed on the substrate. The second electrode layer is disposed on the first electrode layer. The first dielectric layer is disposed between the first electrode layer and the second electrode layer. The first contact and the second contact are electrically connected to the first electrode layer and are separated from each other. The third contact is electrically connected to the second electrode layer.

Abstract: A transfer-printing method of UV-digital stacked-thickness printing, which comprising following steps of: ink jetting a UV-ink on a carrier with low-adhesive-strength to the carrier to output a color-ink-layer with a mirrored-pattern and fully curing the color-ink-layer through UV-light-irradiation; ink jetting on the color-ink-layer to output a transparent-ink-layer with the same mirrored-pattern processed with gray-scale or binary-conversion, the transparent-ink-layer is divided into a plurality of regions, an inkjet-head ink jets back and forth within one region for multiple times and after ink jets the last time, cures the region through UV-light-irradiation with a low-irradiation-intensity, then the inkjet head moves forward to next region and ink jets back and forth within that region for multiple times; and pressing and transferring the transparent-ink-layer on the carrier onto a workpiece.

Abstract: A package structure and the manufacturing method thereof are provided. The package structure includes a first package including at least one first semiconductor die encapsulated in an insulating encapsulation and through insulator vias electrically connected to the at least one first semiconductor die, a second package including at least one second semiconductor die and conductive pads electrically connected to the at least one second semiconductor die, and solder joints located between the first package and the second package. The through insulator vias are encapsulated in the insulating encapsulation. The first package and the second package are electrically connected through the solder joints. A maximum size of the solder joints is greater than a maximum size of the through insulator vias measuring along a horizontal direction, and is greater than or substantially equal to a maximum size of the conductive pads measuring along the horizontal direction.

Abstract: A display device includes a display panel. The display panel has a functional display area. The functional display area includes a plurality of display pixels and a plurality of light transmitting regions. The plurality of display pixels are around by the plurality of the light transmitting regions. A boundary between one of the plurality of display pixels and one of the plurality of light transmitting regions comprises an arc segment.

Abstract: Provided are Chemical Mechanical Planarization (CMP) compositions that offer high and tunable Cu removal rates and low Cu static etching rates for polishing the broad bulk or advanced node copper or Through Silica Via (TSV). The CMP compositions also provide high selectivity of Cu film vs. other barrier layers, such as Ta, TaN, Ti, TiN, and SiN; and dielectric films, such as TEOS, low-k, and ultra-low-k films. The CMP polishing compositions comprise abrasive, oxidizer, at least two chelators selected from the group consisting of amino acids, amino acid derivatives, and combinations therefore; the Cu static etching reducing agents include, but not limited to, organic alkyl sulfonic acids with straight or branched alkyl chains, and salts of organic alkyl sulfonic acids.

Abstract: A paper scrap pushing structure of a paper shredder, having a paper pushing unit, with a spindle having a longitudinal axis, a spindle flap coupled along the longitudinal axis to the spindle; and a paddle pushing segment, coupled to the spindle flap. The spindle is arranged under a paper outlet of the paper shredder and is in linkage with a paper shredder cutter shaft through a synchronous transmission device. When the rotating shaft rotates, the rotating shaft drives the paddle pushing segment to move in the circumferential direction along with the spindle flap, removing paper scraps at the top of a paper scrap pile in a shredded paper waste bin.

Abstract: Polishing compositions comprising ceria coated silica particles and organic acids having one selected from the group consisting of sulfonic acid group, phosphonic acid group, pyridine compound, and combinations thereof, with pH between 5 and 10 and electrical conductivity between 0.2 and 10 millisiemens per centimeter provide very high silicon oxide removal rates for advanced semiconductor device manufacturing.

Abstract: The present disclosure provides a waveguide structure including an optical component. The optical component includes a plurality of grating coupler teeth over a semiconductive substrate and a plurality of grating coupler openings between adjacent grating coupler teeth, wherein the grating coupler openings are configured to receive a light wave. Each of the grating coupler teeth includes a dielectric stack and an etch stopper embedded in the dielectric stack, wherein the etch stopper has a resistance to a fluorine solution that is higher than that of the dielectric stack. A method of manufacturing a semiconductor device is also provided.

Abstract: Copper chemical mechanical planarization (CMP) polishing formulation, method and system are disclosed. The CMP polishing formulation comprises abrasive particles of specific morphology and mean particle sizes (?100 nm, ?50 nm, ?40 nm, ?30 nm, or ?20 nm), at least two or more amino acids, oxidizer, corrosion inhibitor, and water.

Abstract: Embodiments of a mobile carrier monitoring apparatus are disclosed. The apparatus includes one or more mobile carriers configured to receive items being manufactured in its interior and configured be moved by a transport system to multiple positions within a manufacturing facility. A mobile carrier control system is positioned in the interior or on the exterior of each mobile carrier, as are one or more sensors that are coupled to the mobile carrier control system. A communication system is positioned in the interior or on the exterior of each mobile carrier and communicatively coupled to the at least one sensor and to the mobile carrier control system, and an electrical power system positioned in the interior or on the exterior of each mobile carrier and coupled to deliver electrical power to the mobile carrier control system, to the one or more sensors, and to the communication system. Other embodiments are disclosed and claimed.

Abstract: Provided are Chemical Mechanical Planarization (CMP) formulations that offer high and tunable Cu removal rates and low copper dishing for the broad or advanced node copper or Through Silica Via (TSV). The CMP compositions provide high selectivity of Cu film vs. other barrier layers, such as Ta, TaN, Ti, and TiN, and dielectric films, such as TEOS, low-k, and ultra low-k films. The CMP polishing formulations comprise solvent, abrasive, at least three chelators selected from the group consisting of amino acids, amino acid derivatives, organic amine, and combinations therefor; wherein at least one chelator is an amino acid or an amino acid derivative. Additionally, organic quaternary ammonium salt, corrosion inhibitor, oxidizer, pH adjustor and biocide are used in the formulations.

Abstract: A paper scrap pushing structure of a paper shredder, having a paper pushing unit, with a spindle having a longitudinal axis, a spindle flap coupled along the longitudinal axis to the spindle; and a paddle pushing segment, coupled to the spindle flap. The spindle is arranged under a paper outlet of the paper shredder and is in linkage with a paper shredder cutter shaft through a synchronous transmission device. When the rotating shaft rotates, the rotating shaft drives the paddle pushing segment to move in the circumferential direction along with the spindle flap, removing paper scraps at the top of a paper scrap pile in a shredded paper waste bin.

Abstract: A parking garage elevator system includes a frame including two front posts, two rear posts, two upper support members each interconnecting upper ends of the front and rear posts of the same side, two middle support members each interconnecting intermediate portions of the front and rear posts of the same side, and two cross braces each interconnecting front ends or rear ends of the upper support members; upper and lower automobile platforms; a power transmitting mechanism including first and second electric motors and two chains each for transferring power from the first electric motor to the upper automobile platform or from the second electric motor to the lower automobile platform; and a safety mechanism including four sets of two safety hooks and a plurality of restrain screws on the upper automobile platform or the lower automobile platform.

Abstract: An automatic paper shredder includes a shredder cover, a paper holding box, a shell, a paper holding plate, a paper holding plate inlet, a paper shredding component, a drive motor, a paper pressing plate, a paper pick-up component, and a waste paper bin. The paper pressing effect is improved through a spliced paper pressing plate, and the paper pick-up effect is improved through a damping plate, a soft rubber piece, and a convex rib, and thus, efficiency is improved. The automatic paper shredder has the characteristics of being highly automated, convenient to use, safe, reliable, structurally simple and cost-effective.

Abstract: A paper shredder has a paper tray, a paper inlet, a shredder cover, a paper pressing plate, paper pick-up rollers, a shredder cutter shaft, a motor, a wastepaper barrel, and a paper limiter. The paper tray carries a stack of to-be-shredded paper. The paper inlet guides to-be-shredded paper. The shredder cover end is connected to the shredder body by a rotary shaft, closing or opening the shredder body. The paper pressing pl presses the stack in the paper tray. The paper pick-up rollers are on one side of the paper inlet, feeding the paper tray stack into the paper inlet. The shredder cutter shaft shreds the to-be-shredded paper. The motor drives the shredder cutter shaft to operate. The wastepaper barrel is located below the paper inlet to collect shredded paper. The paper limiter is limits one of a thickness or a length of the stack placed in the paper tray.

Abstract: An automatic paper shredder with a staple removing structure and a staple removing method using the same. The automatic paper shredder includes a shredder cover, a paper holding box, a shell, a paper holding plate, a paper inlet, a paper shredding component, a drive motor, a paper pick-up component, a paper pressing plate, a straight through-hole, a waste paper bin and a staple removing component. The automatic paper shredder removes a staple (or clip) on a stack of paper through cooperation with a paper shredding structure. Paper can be automatically picked up in batches. Meanwhile, damage caused by staples to the whole shredder is prevented, and thus, the whole shredder is protected in use and has a longer service life.

Abstract: An automatic paper shredder with a staple removing structure and a staple removing method using the same. The automatic paper shredder includes a shredder cover, a paper holding box, a shell, a paper holding plate, a paper inlet, a paper shredding component, a drive motor, a paper pick-up component, a paper pressing plate, a straight through-hole, a waste paper bin and a staple removing component. The automatic paper shredder removes a staple (or clip) on a stack of paper through cooperation with a paper shredding structure. Paper can be automatically picked up in batches. Meanwhile, damage caused by staples to the whole shredder is prevented, and thus, the whole shredder is protected in use and has a longer service life.

Abstract: A paper scrap pushing structure of a paper shredder, including a rotating shaft, a paper pushing rod, and connecting rods, in which the rotating shaft is arranged under a paper outlet, and is in linkage with a paper shredder cutter shaft through a synchronous transmission device. The paper pushing rod is located on one side of the rotating shaft, arranged in the length direction of the rotating shaft in parallel and connected with the rotating shaft through the connecting rods. The distance from the paper pushing rod to the rotating shaft is smaller than the distance from the lowest portion of the paper shredder cutter shaft to the rotating shaft. When rotating, the rotating shaft drives the paper pushing rod to move in a circumferential direction through the connecting rods, removing paper scraps at the top of a paper scrap pile in a shredded paper waste bin.

Abstract: A paper shredder has a paper tray, a paper inlet, a shredder cover, a paper pressing plate, paper pick-up rollers, a shredder cutter shaft, a motor, a wastepaper barrel, and a paper limiter. The paper tray carries a stack of to-be-shredded paper. The paper inlet guides to-be-shredded paper. The shredder cover end is connected to the shredder body by a rotary shaft, closing or opening the shredder body. The paper pressing pl presses the stack in the paper tray. The paper pick-up rollers are on one side of the paper inlet, feeding the paper tray stack into the paper inlet. The shredder cutter shaft shreds the to-be-shredded paper. The motor drives the shredder cutter shaft to operate. The wastepaper barrel is located below the paper inlet to collect shredded paper. The paper limiter is limits one of a thickness or a length of the stack placed in the paper tray.