Patents by Inventor Shih-Chang Lin

Shih-Chang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210225283
    Abstract: A display may have an array of pixels each of which has a light-emitting diode such as an organic light-emitting diode. A drive transistor and an emission transistor may be coupled in series with the light-emitting diode of each pixel between a positive power supply and a ground power supply. The pixels may include first and second switching transistors. A data storage capacitor may be coupled between a gate and source of the drive transistor in each pixel. Signal lines may be provided in columns of pixels to route signals such as data signals, sensed drive currents from the drive transistors, and predetermined voltages between display driver circuitry and the pixels. The switching transistors, emission transistors, and drive transistors may include semiconducting-oxide transistors and silicon transistors and may be n-channel transistors or p-channel transistors.
    Type: Application
    Filed: April 5, 2021
    Publication date: July 22, 2021
    Inventors: Chin-Wei Lin, Hung Sheng Lin, Shih Chang Chang, Shinya Ono
  • Publication number: 20210226020
    Abstract: A semiconductor structure is provided. The semiconductor structure includes nanostructures over a substrate, a gate stack around the nanostructures, a gate spacer layer alongside the gate stack, an inner spacer layer between the gate spacer layer and the nanostructures, a source/drain feature adjoining the nanostructures, a contact plug over the source/drain feature, and a silicon germanium layer along the surface of the source/drain feature and between the contact plug and the inner spacer layer.
    Type: Application
    Filed: January 16, 2020
    Publication date: July 22, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Zhi-Chang LIN, Shih-Cheng CHEN, Kuo-Cheng CHIANG, Pei-Hsun WANG, Chih-Hao WANG
  • Patent number: 11063156
    Abstract: A memory device and a manufacturing method of the memory device are provided. The manufacturing method includes steps below. A plurality of stack structures including a tunneling dielectric layer and a floating gate are formed on a substrate. A liner material layer including a nitride liner layer is formed on the substrate. A top surface of the nitride liner layer is lower than a top surface of the floating gate and is higher than a top surface of the tunneling dielectric layer. An isolation material layer covering the liner material layer is formed on the substrate. The isolation material layer is oxidized, and a portion of the isolation material layer is removed to form an isolation structure. An inter-gate dielectric layer covering the stack structures and the isolation structure is formed on the substrate. A control gate covering the inter-gate dielectric layer is formed on the substrate.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: July 13, 2021
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Wen Chung Yang, Shih Hsi Chen, Wei-Chang Lin
  • Publication number: 20190163061
    Abstract: The present invention relates to a polyimide precursor and a lithography pattern formed by the same. The polyimide precursor has a repeating unit having a structure of formula (I): in the formula (I), Ar represents a tetravalent group derivated from a tetracarboxylic dianhydride compound; R1 represents a divalent group derivated from a diamine compound; and R2 independently represent a thermal-crosslinking group, a photosensitive-crosslinking group, or a hydrogen atom. The polyimide precursor has an excellent pattern-forming ability.
    Type: Application
    Filed: February 28, 2018
    Publication date: May 30, 2019
    Inventors: Chi-Shian CHEN, Bin-Ling TSAI, Yu-Pei CHEN, Chiao-Pei CHEN, Yu-Fu LIAO, Shih-Chang LIN, Chen-Ni CHEN, Tsung-Tai HUNG, Chiu-Feng CHEN
  • Patent number: 10130042
    Abstract: A control device of a cutting tool formed by a first component and a second component pivotally connected to each other is pivotally connected to the second component. The control device can be pushed to act on the second component. The cutting tool performs multi-stage or one-time cutting according to the control device being pushed to the required position. Moreover, the first component and the second component are close to or away from each other under control of the control device.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: November 20, 2018
    Assignee: BOR SHENG INDUSTRIAL CO., LTD.
    Inventor: Shih-Chang Lin
  • Publication number: 20180188651
    Abstract: A photosensitive composition is provided. The photosensitive composition includes a composition for forming polyimide, a photoinitiator, a photo cross-linking agent, and a thermal cross-linking agent. The composition for forming polyimide includes a diamine monomer component, an anhydride monomer component, and a polyimide modifier. The diamine monomer component includes a long-chain aliphatic diamine monomer, a carboxylic acid-containing diamine monomer, and a triazole compound. The anhydride monomer component includes a dianhydride monomer and a monoanhydride monomer. The polyimide modifier has a double bond and an epoxy group.
    Type: Application
    Filed: March 6, 2017
    Publication date: July 5, 2018
    Applicant: TAIFLEX Scientific Co., Ltd.
    Inventors: Shih-Chang Lin, Yi-Ming Chen, Chiu-Feng Chen, Chun-Yi Kuo
  • Patent number: 9848539
    Abstract: A control device of a cutting tool is revealed. For performing cutting, opening and closing, the cutting tool includes a pair of handles pivotally connected to each other and each handle having a blade. The control device is set on the handle and involved in opening or closing of the blades of the cutting tool. The control device includes a first component and a second component. The first and the second components are connected to and locked with each other tightly by a fastening structure. The control device is disposed on the handle closely, without loosening from the handle.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: December 26, 2017
    Assignee: BOR SHENG INDUSTRIAL CO., LTD.
    Inventor: Shih-Chang Lin
  • Publication number: 20170215346
    Abstract: A control device of a cutting tool for general use or gardening is revealed. The cutting tool, formed by a first component and a second component pivotally connected to each other, can be opened or closed gradually for cutting. The control device is pivotally connected to the second component. The control device can be pushed to act on the second component. The cutting tool performs multi-stage or one-time cutting according to the control device being pushed to the required position. Moreover, the first component and the second component are close to or away from each other under control of the control device.
    Type: Application
    Filed: January 29, 2016
    Publication date: August 3, 2017
    Inventor: Shih-Chang Lin
  • Publication number: 20170171971
    Abstract: A polyimide is provided. The polyimide includes a repeating unit represented by formula 1: wherein Ar is a tetravalent residue obtainable from an aromatic tetracarboxylic dianhydride; and A includes wherein R17 is a single bond or a C1-C18 divalent linking group.
    Type: Application
    Filed: March 1, 2016
    Publication date: June 15, 2017
    Inventors: Shih-Chang Lin, Chiu-Feng Chen, Sheng-Chin Lin, Ching-Hung Huang, Kuang-Ting Hsueh
  • Publication number: 20170105356
    Abstract: A control device of a cutting tool is revealed. For performing cutting, opening and closing, the cutting tool includes a pair of handles pivotally connected to each other and each handle having a blade. The control device is set on the handle and involved in opening or closing of the blades of the cutting tool. The control device includes a first component and a second component. The first and the second components are connected to and locked with each other tightly by a fastening structure. The control device is disposed on the handle closely, without loosening from the handle.
    Type: Application
    Filed: December 30, 2015
    Publication date: April 20, 2017
    Inventor: Shih-Chang Lin
  • Patent number: 9511500
    Abstract: A cutting tool includes an upper handle, a lower handle, a blade, at least one quick release device and a connection part. The cutting tool features on that both the blade and the connection part are pivoted quickly by the quick release device without any special tools. When the cutting tool is in an open state or a closed state, the quick release device disposed on the connection part is switched and moved in a circular part on one end of the blade so as to cut.
    Type: Grant
    Filed: August 8, 2013
    Date of Patent: December 6, 2016
    Assignee: BOR SHENG INDUSTRIAL CO., LTD.
    Inventor: Shih-Chang Lin
  • Patent number: 9502556
    Abstract: In a method for manufacturing a semiconductor device, a substrate including a gate structure is provided. A source region and a drain region are formed at opposing sides of the gate structure and an implant region for a resistor device is formed in the substrate. Pocket implant regions are formed in the source region and the drain region. A dielectric layer is formed to cover the gate structure and the substrate. A portion of dopants in the pocket implant regions interact with portions of dopants in the source region and the drain region to form lightly doped drain regions above the pocket implant regions. A resistor region of the resistor device is defined on the implant region. A portion of the dielectric layer is removed to form a spacer on a sidewall of the gate structure and a resistor protection dielectric layer on a portion of the implant region.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: November 22, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ming-Chi Wu, Yu-Lung Yeh, Chieh-Shuo Liang, Shih-Chang Lin, Meng-Yi Wu, Hsing-Chih Lin
  • Patent number: 9285680
    Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.
    Type: Grant
    Filed: July 16, 2014
    Date of Patent: March 15, 2016
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Shih-Chang Lin, Hsiu-Ming Chang, Tzu-Ching Hung
  • Patent number: 9279057
    Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic acid group, and an anhydride monomer having a carboxylic acid group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a polyimide; and mixing the polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: March 8, 2016
    Assignee: Taiflex Scientific Co., Ltd.
    Inventors: Hsiu-Ming Chang, Shih-Chang Lin, Tzu-Ching Hung
  • Publication number: 20160018733
    Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.
    Type: Application
    Filed: July 16, 2014
    Publication date: January 21, 2016
    Inventors: Shih-Chang Lin, Hsiu-Ming Chang, Tzu-Ching Hung
  • Publication number: 20160005860
    Abstract: In a method for manufacturing a semiconductor device, a substrate including a gate structure is provided. A source region and a drain region are formed at opposing sides of the gate structure and an implant region for a resistor device is formed in the substrate. Pocket implant regions are formed in the source region and the drain region. A dielectric layer is formed to cover the gate structure and the substrate. A portion of dopants in the pocket implant regions interact with portions of dopants in the source region and the drain region to form lightly doped drain regions above the pocket implant regions. A resistor region of the resistor device is defined on the implant region. A portion of the dielectric layer is removed to form a spacer on a sidewall of the gate structure and a resistor protection dielectric layer on a portion of the implant region.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 7, 2016
    Inventors: Ming-Chi WU, Yu-Lung YEH, Chieh-Shuo LIANG, Shih-Chang LIN, Meng-Yi WU, Hsing-Chih LIN
  • Publication number: 20150322274
    Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.
    Type: Application
    Filed: May 6, 2014
    Publication date: November 12, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: Hsiu-Ming Chang, Shih-Chang Lin, Tzu-Ching Hung
  • Patent number: 9150620
    Abstract: The present invention relates to a recombinant DNA molecule encoding a mutated hemagglutinin protein, wherein the mutated hemagglutinin protein consists of the amino acid sequence of SEQ ID NO: 2 with one or more mutations at amino acid residue selecting from the group consisting of residue 83, 127, 138 and the combination thereof. The present invention also relates to a composition comprising the recombinant DNA molecule as described above and a pharmaceutically or veterinarily acceptable carrier, excipient, adjuvant, or vehicle. The present invention further relates to a kit for prime-boost vaccination, comprising at least a composition comprising a recombinant DNA molecule as described above and at least a composition for the boost-vaccination comprising a recombinant hemagglutiinin protein or a virus-like particle, wherein the recombinant hemagglutiinin protein is the corresponding hemagglutiinin protein encoded by the recombinant DNA molecule.
    Type: Grant
    Filed: March 19, 2014
    Date of Patent: October 6, 2015
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Suh-Chin Wu, Shih-Chang Lin
  • Patent number: D788557
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: June 6, 2017
    Assignee: BOR SHENG INDUSTRIAL CO., LTD.
    Inventors: Hsueh Hsin Huang, Shih-Chang Lin
  • Patent number: D815501
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: April 17, 2018
    Assignee: BOR SHENG INDUSTRIAL CO., LTD.
    Inventors: Hsueh Hsin Huang, Shih-Chang Lin