Abstract: A memory management circuit, an electronic device and a memory management method are provided. The memory management circuit includes a controller and an address mapping logic. The controller records addresses of available storage spaces within a memory device, wherein a searching logic of the controller stores the addresses in a storage device, and the addresses are queued with a specific order in the storage device. When a computing circuit send a storage request to request for a storage resource, the searching logic obtains at least one address queued in the storage device according to the specific order of the addresses queued in the storage device, to accordingly generate a mapping table, and the address mapping logic performs an address mapping operation upon the storage request according to the mapping table, to allow the computing circuit to utilize the available storage spaces according to the mapping table.

Abstract: The present invention relates to a polyimide precursor and a lithography pattern formed by the same. The polyimide precursor has a repeating unit having a structure of formula (I): in the formula (I), Ar represents a tetravalent group derivated from a tetracarboxylic dianhydride compound; R1 represents a divalent group derivated from a diamine compound; and R2 independently represent a thermal-crosslinking group, a photosensitive-crosslinking group, or a hydrogen atom. The polyimide precursor has an excellent pattern-forming ability.

Abstract: A control device of a cutting tool formed by a first component and a second component pivotally connected to each other is pivotally connected to the second component. The control device can be pushed to act on the second component. The cutting tool performs multi-stage or one-time cutting according to the control device being pushed to the required position. Moreover, the first component and the second component are close to or away from each other under control of the control device.

Abstract: A photosensitive composition is provided. The photosensitive composition includes a composition for forming polyimide, a photoinitiator, a photo cross-linking agent, and a thermal cross-linking agent. The composition for forming polyimide includes a diamine monomer component, an anhydride monomer component, and a polyimide modifier. The diamine monomer component includes a long-chain aliphatic diamine monomer, a carboxylic acid-containing diamine monomer, and a triazole compound. The anhydride monomer component includes a dianhydride monomer and a monoanhydride monomer. The polyimide modifier has a double bond and an epoxy group.

Abstract: A control device of a cutting tool is revealed. For performing cutting, opening and closing, the cutting tool includes a pair of handles pivotally connected to each other and each handle having a blade. The control device is set on the handle and involved in opening or closing of the blades of the cutting tool. The control device includes a first component and a second component. The first and the second components are connected to and locked with each other tightly by a fastening structure. The control device is disposed on the handle closely, without loosening from the handle.

Abstract: A control device of a cutting tool for general use or gardening is revealed. The cutting tool, formed by a first component and a second component pivotally connected to each other, can be opened or closed gradually for cutting. The control device is pivotally connected to the second component. The control device can be pushed to act on the second component. The cutting tool performs multi-stage or one-time cutting according to the control device being pushed to the required position. Moreover, the first component and the second component are close to or away from each other under control of the control device.

Abstract: A polyimide is provided. The polyimide includes a repeating unit represented by formula 1: wherein Ar is a tetravalent residue obtainable from an aromatic tetracarboxylic dianhydride; and A includes wherein R17 is a single bond or a C1-C18 divalent linking group.

Abstract: A control device of a cutting tool is revealed. For performing cutting, opening and closing, the cutting tool includes a pair of handles pivotally connected to each other and each handle having a blade. The control device is set on the handle and involved in opening or closing of the blades of the cutting tool. The control device includes a first component and a second component. The first and the second components are connected to and locked with each other tightly by a fastening structure. The control device is disposed on the handle closely, without loosening from the handle.

Abstract: A cutting tool includes an upper handle, a lower handle, a blade, at least one quick release device and a connection part. The cutting tool features on that both the blade and the connection part are pivoted quickly by the quick release device without any special tools. When the cutting tool is in an open state or a closed state, the quick release device disposed on the connection part is switched and moved in a circular part on one end of the blade so as to cut.

Abstract: In a method for manufacturing a semiconductor device, a substrate including a gate structure is provided. A source region and a drain region are formed at opposing sides of the gate structure and an implant region for a resistor device is formed in the substrate. Pocket implant regions are formed in the source region and the drain region. A dielectric layer is formed to cover the gate structure and the substrate. A portion of dopants in the pocket implant regions interact with portions of dopants in the source region and the drain region to form lightly doped drain regions above the pocket implant regions. A resistor region of the resistor device is defined on the implant region. A portion of the dielectric layer is removed to form a spacer on a sidewall of the gate structure and a resistor protection dielectric layer on a portion of the implant region.

Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.

Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic acid group, and an anhydride monomer having a carboxylic acid group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a polyimide; and mixing the polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

Abstract: A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.

Abstract: In a method for manufacturing a semiconductor device, a substrate including a gate structure is provided. A source region and a drain region are formed at opposing sides of the gate structure and an implant region for a resistor device is formed in the substrate. Pocket implant regions are formed in the source region and the drain region. A dielectric layer is formed to cover the gate structure and the substrate. A portion of dopants in the pocket implant regions interact with portions of dopants in the source region and the drain region to form lightly doped drain regions above the pocket implant regions. A resistor region of the resistor device is defined on the implant region. A portion of the dielectric layer is removed to form a spacer on a sidewall of the gate structure and a resistor protection dielectric layer on a portion of the implant region.

Abstract: A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

Abstract: The present invention relates to a recombinant DNA molecule encoding a mutated hemagglutinin protein, wherein the mutated hemagglutinin protein consists of the amino acid sequence of SEQ ID NO: 2 with one or more mutations at amino acid residue selecting from the group consisting of residue 83, 127, 138 and the combination thereof. The present invention also relates to a composition comprising the recombinant DNA molecule as described above and a pharmaceutically or veterinarily acceptable carrier, excipient, adjuvant, or vehicle. The present invention further relates to a kit for prime-boost vaccination, comprising at least a composition comprising a recombinant DNA molecule as described above and at least a composition for the boost-vaccination comprising a recombinant hemagglutiinin protein or a virus-like particle, wherein the recombinant hemagglutiinin protein is the corresponding hemagglutiinin protein encoded by the recombinant DNA molecule.

Abstract: A power jack, comprising an insulating housing, a socket which set in the bottom of the insulating housing, a movable socket cover which covers the socket and an elastic device between the socket cover and the socket which for ejecting the cover; the housing has a pair of limiting portions each having a button assembled thereto; the socket cover has an elastic arm which could clamp the limiting portion, so as to lock the socket cover; the elastic arm can be pushed away from the limiting portion by the button, so that the cover can be removed away from the socket. Therefore, it is convenient and safe for users to extract the plug with single hand.

Abstract: A cutting tool is revealed. The cutting tool includes an upper handle, a lower handle, a blade, at least one quick release device and a connection part. The cutting tool features on that both the blade and the connection part are pivoted quickly by the quick release device without any special tools. When the cutting tool is in an open state or a closed state, the quick release device disposed on the connection part is switched and moved in a circular part on one end of the blade so as to cut.