Patents by Inventor Shih-Chang Tai

Shih-Chang Tai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240120355
    Abstract: Implementations of a cover for an image sensor may include an optically transmissive portion and a black mask layer applied as a strip adjacent a perimeter of a largest planar surface of the optically transmissive portion. The first edge of the strip closest to the perimeter may be separated from the perimeter by a predetermined distance.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 11, 2024
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gregg BARDEL, Shih-Chang TAI, Shunsuke YASUDA, Weng-Jin WU
  • Patent number: 5691215
    Abstract: A process for globally planarizing the insulator used to fill narrow and wide shallow trenches, used in a MOSFET device, structure, has been developed. The process features smoothing the topography that exists after the insulator filling of narrow and shallow trenches, by creating photoresist plugs, only in the depressed topography regions. This is accomplished using a negative photoresist layer, a de-focus exposure, and the identical mask used to create the shallow trench pattern in a positive photoresist layer. A RIE procedure, with a 1:1 etch selectivity, is used to complete the planarization process.
    Type: Grant
    Filed: August 26, 1996
    Date of Patent: November 25, 1997
    Assignee: Industrial Technology Research Institute
    Inventors: Chang-Ming Dai, Hong-Chang Dai, Shih-Chang Tai