Patents by Inventor Shih-Chao Chih

Shih-Chao Chih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
    Publication number: 20150028485
    Abstract: A substrate structure is provided. The substrate structure includes a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening for exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon. The die attach area covers the entire opening or the metal layer is formed within the die attach area, thereby effectively preventing package delamination and improving the product yield.
    Type: Application
    Filed: July 25, 2013
    Publication date: January 29, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Liang-Yi Hung, Shih-Chao Chih, Yu-Cheng Pai, Wei-Chung Hsiao