Abstract: Disclosed are an LED light emitting device and its manufacturing method. A blue LED chip specification is selected, a green phosphor and the blue LED chip are used to determine a green light frame on the CIE1931 chromaticity coordinates and a red phosphor together with a blue LED chip are used to determine a red light frame on the CIE1931 chromaticity coordinates, and a predetermined straight line passing through the color temperature target frame is selected, and both end points of the predetermined straight line fall within the green light frame and the red light frame, so as to determine the concentration of the green phosphor and the red phosphor, and the green and red phosphors and a blue LED chip are packaged to form a first LED and a second LED, and at least one first LED and at least one second LED are installed on a substrate.

Abstract: Disclosed are an LED light emitting device and its manufacturing method. A blue LED chip specification is selected, a green phosphor and the blue LED chip are used to determine a green light frame on the CIE1931 chromaticity coordinates and a red phosphor together with a blue LED chip are used to determine a red light frame on the CIE1931 chromaticity coordinates, and a predetermined straight line passing through the color temperature target frame is selected, and both end points of the predetermined straight line fall within the green light frame and the red light frame, so as to determine the concentration of the green phosphor and the red phosphor, and the green and red phosphors and a blue LED chip are packaged to form a first LED and a second LED, and at least one first LED and at least one second LED are installed on a substrate.

Abstract: An LED lead frame mounted on a platform of a lightbulb includes a metal polarity substrate, a metal retaining substrate and a casing for partially covering the metal polarity substrate and the metal retaining substrate. The metal retaining substrate is a sheet bent into a disposing portion and a carrying portion, and an included angle ?1 is defined between the portions, and an abutting surface of the disposing portion abuts the platform, and a portion of the carrying portion not covered by the casing is provided for installing at least one LED chip. The metal polarity substrate is bent to form an included angle ?2, and ?1=?2, and 93°??1?130°. The casing has a support member formed on the casing and protruded in a direction opposite to the direction of bending the metal retaining substrate. The LED lead frame enhances the illumination angle and light uniformity of the lightbulb.

Abstract: An LED package structure for enhancing mixed light effect comprises: at least one first light emitting chip; at least one second light emitting chip, a frame structure having a first containing portion, a second containing portion, a spacing portion and a light mixing area; a first colloid, filled into the first containing portion; a second colloid, filled into the second containing portion; and an encapsulating colloid, packaged and filled into the light mixing area. This design can enhance the light emission efficiency and achieve a uniform light-mixing dot light source.

Abstract: An LED lead frame mounted on a platform of a lightbulb includes a metal polarity substrate, a metal retaining substrate and a casing for partially covering the metal polarity substrate and the metal retaining substrate. The metal retaining substrate is a sheet bent into a disposing portion and a carrying portion, and an included angle ?1 is defined between the portions, and an abutting surface of the disposing portion abuts the platform, and a portion of the carrying portion not covered by the casing is provided for installing at least one LED chip. The metal polarity substrate is bent to form an included angle ?2, and ?1=?2, and 93°??1?130°. The casing has a support member formed on the casing and protruded in a direction opposite to the direction of bending the metal retaining substrate. The LED lead frame enhances the illumination angle and light uniformity of the lightbulb.

Abstract: An LED package structure for enhancing mixed light effect comprises: at least one first light emitting chip; at least one second light emitting chip, a frame structure having a first containing portion, a second containing portion, a spacing portion and a light mixing area; a first colloid, doped with a green-light phosphor and filled into the first containing portion; a second colloid, filled into the second containing portion; and an encapsulating colloid, packaged and filled into the light mixing area. This design can enhance the light emission efficiency and achieve a uniform light-mixing dot light source.

Abstract: An LED light bulb structure includes a lamp cover and a lamp holder engaged with one another to form a light source accommodating space, and the lamp holder has a circuit board, and at least three first LEDs installed in the light source accommodating space and electrically coupled to the circuit board. Each first LED has a light source portion and a plurality of pins, and an end of the pins is coupled to the light source portion, and the other end of the pins is electrically coupled to the circuit board, and each light source portion has a lens and a chip, and the lens covers the chip, and the chip irradiates a light beam in a horizontal direction, and the first LEDs are installed sequentially next to one another, such that the light source portions are arranged into a circle to form an installation space.

Abstract: A light emitting diode (LED) packaging structure comprises a base, a LED chip and a packaging colloid. The LED chip is disposed in the base. The packaging colloid comprises a first optical resin material and at least one second optical resin material. The first optical resin material is transparent and packages the LED chip. The second optical resin material is disposed to a side of the first optical resin material. The second optical resin material is doped with a second fluorescent-powder. By disposing multilayered second optical resin materials, the fluorescent-powder is far from the LED chip to prevent the fluorescent-powder from being heated to cause light attenuation, thereby extending the service life of the LED chip.

Abstract: Disclosed is an improved light-emitting diode, which can be a PLCC or SMD type light-emitting diode. The light-emitting diode includes a package body, at least one pair of conductive terminals, and an optic lens. The package body has an end surface, a circumferential surface extending from the end surface, and a receptacle for accommodating a light-emitting chip. The pair of conductive terminals is fixed to the package body. The optic lens covers the end surface of the package body and is even expanded to cover the circumferential surface of the package body. In this way, effects of improved bonding strength, improved optic advantages, being easy to adjust to a desired angle with the optic lens, and alleviation of troubles caused by overflow of adhesive can be realized.

Abstract: Disclosed is an improved light-emitting diode, which can be a PLCC or SMD type light-emitting diode. The light-emitting diode includes a package body, at least one pair of conductive terminals, and an optic lens. The package body has an end surface, a circumferential surface extending from the end surface, and a receptacle for accommodating a light-emitting chip. The pair of conductive terminals is fixed to the package body. The optic lens covers the end surface of the package body and is even expanded to cover the circumferential surface of the package body. In this way, effects of improved bonding strength, improved optic advantages, being easy to adjust to a desired angle with the optic lens, and alleviation of troubles caused by overflow of adhesive can be realized.