Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: A three-piece umbrella cover structure having main rectangular cloth and two side-cloths is provided for use with an umbrella having a plurality of umbrella ribs. The main rectangular cloth has two stitch sides and four vertexes. Each side-cloth has one stitch side and a plurality of raised points corresponding to the stitch side. The stitch side has two ends, each having an indent defined therein. The stitch sides of the side cloths are combined with the stitch sides of the main cloth, respectively, wherein the indents are combined with the stitch sides of the main cloth to form indent seaming portions to provide pulling force for stretching the main rectangular cloth.

Abstract: A five-piece umbrella cover includes a primary cover and four secondary covers each securely attached to a corresponding one of the sides of the primary cover. The primary cover is square and may be composed of multiple auxiliary covers. The four corners of the primary cover are not attached to any of the secondary covers. Angles defined by ribs are not all the same.