Abstract: The present disclosure relates to a system and a method for distributor analysis. The method includes: determining a first group of distributors corresponding to a first range of achievement scores; determining a second group of distributors corresponding to a second range of achievement scores; comparing a value of a stream parameter of a distributor from the second group of distributors with an average value of the stream parameter of the first group of distributors; and informing the distributor of a result of the comparing process.

Abstract: Methods for forming a dielectric isolation region between two active regions are disclosed herein. A mandrel is formed on a substrate, then etched to form a trench. Spacers are formed on the sidewalls of the mandrel. The mandrel is removed, and the substrate is etched to form fins extending in a first direction in the two active regions, and of fins extending in a second direction. A mask is formed that exposes the substrate between the fins extending in the second direction. The substrate is etched to form a trench. The trench is filled with a dielectric material up to the top of the fins to form the dielectric isolation region. The methods provide better depth control during etching between the two active regions, and also permit the trench to extend deeper into the substrate due to reduced depth/width ratios during the etching steps.

Abstract: Semiconductor devices, methods of manufacturing the semiconductor device and tools are disclosed herein. Some methods include providing an electrostatic chuck and placing an edge ring adjacent to the electrostatic chuck. The electrostatic chuck includes a first electrode to generate a sheath at a first distance over the electrostatic chuck. The edge ring includes a coil and a second electrode to generate an electric field control to maintain a portion of the sheath over the edge ring in a coplanar orientation with the portion of the sheath over the electrostatic chuck.

Abstract: A semiconductor device is provided, which includes a first semiconductor structure, a second semiconductor structure, and an active region. The first semiconductor structure includes a first dopant. The second semiconductor structure is located on the first semiconductor structure and includes a second dopant different from the first dopant. The active region includes a plurality of semiconductor pairs and located between the first semiconductor structure and the second semiconductor structure. Each semiconductor pair includes a barrier layer and a well layer and includes the first dopant. The active region does not include a nitrogen element. A doping concentration of the first dopant in the first semiconductor structure is higher than a doping concentration of the first dopant in the active region.

Abstract: In an embodiment, a device includes: an integrated circuit die; a through via adjacent the integrated circuit die; a molding compound encapsulating the integrated circuit die and the through via; and a redistribution structure including: a first conductive via extending through a first dielectric layer, the first conductive via electrically connected to the integrated circuit die, the first dielectric layer being over the integrated circuit die, the through via, and the molding compound; and a first conductive line over the first dielectric layer and the first conductive via, the first conductive via extending into the first conductive line.

Abstract: An LED lamp includes a lamp base, a heat-dissipating unit, a reflecting unit, a board, and at least one LED mounted on one side of the board facing toward the lamp base. The heat-dissipating unit includes a plurality of heat-dissipating fins disposed spacedly along a periphery of the lamp base. The reflecting unit has a reflector portion and is connected in a thermal-conducting manner to a side of the heat-dissipating fins opposite to the lamp base. The board is connected to the reflecting unit in a manner that the board is spaced apart from the reflector portion, and is formed with at least one light-transmissive portion. The LED has a light exit side facing toward the reflector portion. Light emitted by the LED is reflected by the reflector portion and exits the LED lamp via the light-transmissive portion of the board.

Abstract: A heat dissipating device includes a tubular body having a first open end, and a plurality of heat dissipating fins, each having a fin body and a first engaging portion formed on the fin body for engaging the first open end of the tubular body in a manner that the heat dissipating fins are disposed to radiate from and to surround the tubular body. The first engaging portion includes a first extension section bent from the fin body, and a first hook extending from the first extension section for hooking onto the tubular body at the first open end.

Abstract: A reflective LED lamp includes a metallic shell, a reflecting member, and an LED unit. The metallic shell includes a surrounding wall formed with a mounting hole unit, and an accommodating space defined by the surrounding wall. The reflecting member is disposed within the accommodating space, and includes a reflection region unit configured as at least one concaved curve surface. The LED unit is disposed within the mounting hole unit in the shell for emitting light onto the reflection region unit of the reflecting member, so that the light is reflected by the reflection region unit out of the shell.