Patents by Inventor Shih-Cheng Hung

Shih-Cheng Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11915977
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
  • Patent number: 11671285
    Abstract: A signal equalization method includes: receiving a clock signal and a first reference signal; detecting a phase and a frequency of the clock signal based on the first reference signal to generate a detection result; generating a speed judgement signal according to the detection result; and, receiving the speed judgement signal and deciding an equalizer operation parameter according to the speed judgement signal.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: June 6, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Shih-Cheng Hung, Cong-An Lu
  • Patent number: 11381225
    Abstract: A single ended receiver includes a current mode logic circuit, a differential to single amplifier, and a voltage detector. The current mode logic circuit is configured to receive an input signal and a reference voltage value and is configured to output a first output signal. The differential to single amplifier is coupled to the current mode logic circuit and is configured to receive the first output signal and to output a second output signal. The voltage detector is coupled to the differential to single amplifier and is configured to output a control signal to the differential to single amplifier according to the reference voltage value. The differential to single amplifier is further configured to adjust a voltage value of the differential to single amplifier internal signal according to the control signal, so that a duty cycle of the second output signal is adjusted.
    Type: Grant
    Filed: May 19, 2021
    Date of Patent: July 5, 2022
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Cong-An Lu, Shih-Cheng Hung