Patents by Inventor Shih-Cheng Wu

Shih-Cheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7368928
    Abstract: A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: May 6, 2008
    Assignee: MJC Probe Incorporation
    Inventors: Hsin-Hung Lin, Shih-Cheng Wu, Wei-Cheng Ku, Chien-Liang Chen, Ming-Chi Chen, Hendra Sudin
  • Publication number: 20080054918
    Abstract: A vertical-type probe card includes a circuit board, which has signal circuits and grounding circuits arranged in such a manner that each signal circuit is disposed in parallel and adjacent to one grounding circuit and kept a predetermined distance from the grounding circuit, and a probe assembly, which is arranged at the bottom side of the circuit board and has an upper guide plate, a lower guide plate, a conducting layer provided on the lower guide plate, a plurality of signal probes respectively electrically connected to the signal circuits and adjacent to a plurality of compensation probes, and at least one grounding probe electrically connected to the grounding circuits in a manner that the signal, compensation and grounding probes are vertically inserted through the upper and lower guide plates, and the conducting layer is conducted with the compensation probe and the grounding probe while electrically insulated to the signal probe.
    Type: Application
    Filed: August 29, 2006
    Publication date: March 6, 2008
    Applicant: MJC PROBE INCORPORATION
    Inventors: Hsin-Hung Lin, Shih-Cheng Wu, Wei-Cheng Ku, Chien-Liang Chen, Ming-Chi Chen, Hendra Sudin