Patents by Inventor Shih-Chi Hsieh

Shih-Chi Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984419
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
  • Publication number: 20240146205
    Abstract: A flyback power converter includes a power transformer, a first lossless voltage conversion circuit, a first low-dropout linear regulator and a secondary side power supply circuit. The first low-dropout linear regulator (LDO) generates a first operation voltage as power supply for being supplied to a sub-operation circuit. The secondary side power supply circuit includes a second lossless voltage conversion circuit and a second LDO. The second LDO generates a second operation voltage. The first operation voltage and the second operation voltage are shunted to a common node. When a first lossless conversion voltage is greater than a first threshold voltage, the second LDO is enabled to generate the second operation voltage to replace the first operation voltage as power supply supplied to the sub-operation circuit; wherein the second lossless conversion voltage is lower than the first lossless switching voltage.
    Type: Application
    Filed: September 23, 2023
    Publication date: May 2, 2024
    Inventors: Shin-Li Lin, He-Yi Shu, Shih-Jen Yang, Ta-Yung Yang, Yi-Min Shiu, Chih-Ching Lee, Yu-Chieh Hsieh, Chao-Chi Chen
  • Patent number: 10890715
    Abstract: A light guiding module includes a light guiding assembly and a plate. The light guiding assembly comprises a base, plural light guiding columns and plural first connection portions. The light guiding column comprises a light inlet end and a light outlet end. The first connection portions are connected between the light guiding columns. The plate comprises a first surface and plural extending portions. The first surface is abutted against the light outlet ends. The extending portions are extended from the first surface. The extending portion includes a first protrusion and a second protrusion. The second protrusions are disposed between the first protrusions and the first surface. A part of the first protrusions and the second protrusions of the extending portions are extended along a first direction, and a rest are extended along a second direction. The first connection portions are disposed between the first protrusions and the second protrusions.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: January 12, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Shih-Chi Hsieh
  • Patent number: D967989
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: October 25, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventor: Shih-Chi Hsieh