Patents by Inventor Shih Chia Fang

Shih Chia Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making rigid-flexible printed circuit board having a peelable mask
    Patent number: 8033013
    Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: October 11, 2011
    Assignee: Compeq Manufacturing Co., Ltd.
    Inventors: Yen Ching Chiang, Shih Chia Fang, Jun Yi Wang, Hsiu Lin Huang
  • RIGID-FLEXIBLE PRINTED CIRCUIT BOARD HAVING A PEELABLE MASK AND METHOD OF MAKING
    Publication number: 20090321112
    Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.
    Type: Application
    Filed: June 30, 2008
    Publication date: December 31, 2009
    Inventors: Yen Ching Chiang, Shih Chia Fang, Jun Yi Wang, Hsiu Lin Huang