Abstract: A memory device includes a power supply device, a power-on-reset device, a memory array, and a memory controller. The power supply device converts the external supply voltage into an internal supply voltage. When the external supply voltage exceeds a first threshold, the power-on-reset device generates a reset signal. The power-on-reset device further raises the first threshold to a second threshold according to a deep-sleep signal. The memory array is supplied with the internal supply voltage. The memory controller is supplied with the internal supply voltage, accesses the memory array, and is reset according to the reset signal. When the memory controller operates in a deep-sleep mode, the memory controller generates the deep-sleep mode.

Abstract: A memory device includes a power supply device, a power-on-reset device, a memory array, and a memory controller. The power supply device converts the external supply voltage into an internal supply voltage. When the external supply voltage exceeds a first threshold, the power-on-reset device generates a reset signal. The power-on-reset device further raises the first threshold to a second threshold according to a deep-sleep signal. The memory array is supplied with the internal supply voltage. The memory controller is supplied with the internal supply voltage, accesses the memory array, and is reset according to the reset signal. When the memory controller operates in a deep-sleep mode, the memory controller generates the deep-sleep mode.

Abstract: An extending device includes a first riser card, a signal coupling card and a second riser card. A first electric socket of the first riser card is disposed on a side surface of a first circuit board of the first riser card, and a first electric connector is disposed at an edge of the first circuit board. A second electric connector and a third electric connector of the signal coupling card are respectively disposed on both side surfaces of a third circuit board of the signal coupling card. The second electric connector inserts into the first electric socket. A second electric socket and an extending socket of the second riser are respectively disposed on both side surfaces of a second circuit board of the second riser. The third electric connector inserts into the second electric socket and the extending socket is electrically connected to the second electric socket.

Abstract: An extending device includes a first riser card, a signal coupling card and a second riser card. A first electric socket of the first riser card is disposed on a side surface of a first circuit board of the first riser card, and a first electric connector is disposed at an edge of the first circuit board. A second electric connector and a third electric connector of the signal coupling card are respectively disposed on both side surfaces of a third circuit board of the signal coupling card. The second electric connector inserts into the first electric socket. A second electric socket and an extending socket of the second riser are respectively disposed on both side surfaces of a second circuit board of the second riser. The third electric connector inserts into the second electric socket and the extending socket is electrically connected to the second electric socket.

Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.

Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.

Abstract: A socket includes faces, grooves and groups of notches. Each of the grooves is located between two adjacent one of the faces. Each of the grooves includes a width that gets smaller towards an axis of the socket along a radius, thus defining a reduced neck. Each of the groups of notches is located along a related one of the grooves or in a related one of the faces.