Patents by Inventor Shih Chieh Tang
Shih Chieh Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11965905Abstract: An electronic module is provided. The electronic module includes a carrier, a movable component and an optical component. The movable component is on the carrier and configured to be movable with respect to the carrier. The optical component is configured to detect a movement of the movable component by an optical coupling between the optical component and the movable component.Type: GrantFiled: December 22, 2021Date of Patent: April 23, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Shih-Chieh Tang
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Patent number: 11808436Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.Type: GrantFiled: February 21, 2022Date of Patent: November 7, 2023Assignee: EPISTAR CORPORATIONInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Publication number: 20230194807Abstract: An electronic module is provided. The electronic module includes a carrier, a movable component and an optical component. The movable component is on the carrier and configured to be movable with respect to the carrier. The optical component is configured to detect a movement of the movable component by an optical coupling between the optical component and the movable component.Type: ApplicationFiled: December 22, 2021Publication date: June 22, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shih-Chieh TANG
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Publication number: 20230062337Abstract: The present disclosure provides an electronic module includes a light source configured to radiate a first light beam having a first wavelength and a converting device configured to receive the first light beam and to convert the first light beam to a second light beam having a second wavelength different from the first wavelength. The electronic module also includes a connection element configured to transmit the first light beam from the light source to the converting device and adapted to a predetermined geometric relationship between the light source and the converting device to meet a condition of total internal reflection.Type: ApplicationFiled: September 2, 2021Publication date: March 2, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Chieh TANG, Ying-Chung CHEN
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Publication number: 20230063405Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.Type: ApplicationFiled: September 2, 2021Publication date: March 2, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Chieh TANG, Lu-Ming LAI, Yu-Che HUANG, Ying-Chung CHEN
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Patent number: 11588081Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.Type: GrantFiled: March 4, 2020Date of Patent: February 21, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Shih-Chieh Tang, Lu-Ming Lai
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Publication number: 20220178527Abstract: A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.Type: ApplicationFiled: February 21, 2022Publication date: June 9, 2022Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
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Patent number: 11296025Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.Type: GrantFiled: July 17, 2019Date of Patent: April 5, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsun-Wei Chan, Shih-Chieh Tang
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Patent number: 11276806Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.Type: GrantFiled: January 3, 2020Date of Patent: March 15, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi Wen Chiang, Kuang-Hsiung Chen, Lu-Ming Lai, Hsun-Wei Chan, Hsin-Ying Ho, Shih-Chieh Tang
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Patent number: 11276720Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.Type: GrantFiled: October 31, 2019Date of Patent: March 15, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Shih-Chieh Tang, Lu-Ming Lai, Chia Yun Hsu
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Patent number: 11255524Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 ?m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.Type: GrantFiled: May 29, 2020Date of Patent: February 22, 2022Assignee: EPISTAR CORPORATIONInventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
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Publication number: 20210358823Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package structure includes a semiconductor die and a light absorbing layer. The semiconductor die has a first surface, a second surface and a third surface. An active layer of the semiconductor die is adjacent to the first surface. The second surface is opposite to the first surface. The third surface extends from the first surface to the second surface. The light absorbing layer covers the second surface and the third surface of the semiconductor die. The semiconductor die has a thickness defined from the first surface to the second surface, and the thickness of the semiconductor die is less than or equal to about 300 micrometers (?m).Type: ApplicationFiled: May 18, 2020Publication date: November 18, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chi Sheng TSENG, Lu-Ming LAI, Yu-Che HUANG, Shih-Chieh TANG, Yu-Min PENG, Hui-Chung LIU
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Publication number: 20210280755Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.Type: ApplicationFiled: March 4, 2020Publication date: September 9, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-Ying HO, Hsun-Wei CHAN, Shih-Chieh TANG, Lu-Ming LAI
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Publication number: 20210210662Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.Type: ApplicationFiled: January 3, 2020Publication date: July 8, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi Wen CHIANG, Kuang-Hsiung CHEN, Lu-Ming LAI, Hsun-Wei CHAN, Hsin-Ying HO, Shih-Chieh TANG
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Publication number: 20210134857Abstract: An optical package includes a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. The image sensor is disposed on the substrate. The microlens having a first Young's modulus is disposed on the image sensor. The optical filter layer having a second Young's modulus disposed on the microlens. The constraining layer is disposed between the optical filter layer and the microlens. The buffer layer having a third Young's modulus disposed on the constraining layer. The third Young's modulus is greater than the first Young's modulus and smaller than the second Young's modulus.Type: ApplicationFiled: October 31, 2019Publication date: May 6, 2021Inventors: Shih-Chieh TANG, Lu-Ming LAI, Chia Yun HSU
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Patent number: 10862014Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.Type: GrantFiled: November 12, 2015Date of Patent: December 8, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsin-Ying Ho, Hsun-Wei Chan, Lu-Ming Lai, Shih-Chieh Tang
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Patent number: 10818816Abstract: An optical device includes a substrate, a plurality of light emitting devices, a photo detector and a circuit layer. The substrate has a first surface and a second surface opposite to the first surface. The substrate includes a first region and a second region. The light emitting devices are disposed on the first surface in the first region of the substrate. The photo detector is disposed in the second region of the substrate. The photo detector includes an electrical contact exposed from the second surface of the substrate. The circuit layer is disposed on the second surface of the substrate and electrically connected to the electrical contact of the photo detector.Type: GrantFiled: November 22, 2017Date of Patent: October 27, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Lu-Ming Lai, Shih-Chieh Tang
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Publication number: 20200292157Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 ?m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.Type: ApplicationFiled: May 29, 2020Publication date: September 17, 2020Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
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Patent number: 10752494Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.Type: GrantFiled: December 6, 2018Date of Patent: August 25, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chi Sheng Tseng, Lu-Ming Lai, Shih-Chieh Tang, Hsin-Ying Ho, Hsun-Wei Chan
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Patent number: 10720751Abstract: An optical package structure includes a substrate having a first surface, an interposer bonded to the first surface through a bonding layer, the interposer having a first area from a top view perspective, and an optical device on the interposer, having a second area from the top view perspective, the first area being greater than the second area. A method for manufacturing the optical package structure is also provided.Type: GrantFiled: August 30, 2018Date of Patent: July 21, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yu-Hsuan Tsai, Lu-Ming Lai, Ying-Chung Chen, Shih-Chieh Tang