Abstract: The present disclosure provides a dual-sided wafer imaging apparatus and methods thereof. The dual-sided wafer imaging apparatus includes one or more load ports, one or more mechanical arms for transporting a wafer, a wafer transfer stage, a first line scan camera mounted below the wafer transfer stage, a second line scan camera mounted above the wafer transfer stage, a first optical lens mounted on the first line scan camera, a second optical lens mounted on the second line scan camera, and line light sources respectively mounted below and above the wafer transfer stage. The load ports are configured for an automated load operation or unload operation of a wafer pod of an automated transport equipment. The wafer transfer stage includes vacuum suction points in contact with a backside of the wafer, and the wafer transfer stage further includes a drive motor producing a linear reciprocating motion for moving the wafer.

Abstract: The present disclosure provides a dual-sided wafer imaging apparatus and methods thereof. The dual-sided wafer imaging apparatus includes one or more load ports, one or more mechanical arms for transporting a wafer, a wafer transfer stage, a first line scan camera mounted below the wafer transfer stage, a second line scan camera mounted above the wafer transfer stage, a first optical lens mounted on the first line scan camera, a second optical lens mounted on the second line scan camera, and line light sources respectively mounted below and above the wafer transfer stage. The load ports are configured for an automated load operation or unload operation of a wafer pod of an automated transport equipment. The wafer transfer stage includes vacuum suction points in contact with a backside of the wafer, and the wafer transfer stage further includes a drive motor producing a linear reciprocating motion for moving the wafer.

Abstract: A heat sink capable of external deflection includes a heat-dissipating member, a cooling fan, and a deflector. The heat-dissipating member includes an entrance side and an exit side. The cooling fan is mounted at the entrance side of the heat-dissipating member. The deflector includes at least one inlet, at least one outlet, and at least one passage in communication with the at least one inlet and outlet. The deflector is mounted to the heat-dissipating member in such a way that each of the at least one inlet is close to the entrance side, each of the at lease one passage extends to an external side of said exit side, and each of the at least one outlet faces a lower side of the heat-dissipating member. Therefore, the heat sink attains relatively larger heat-dissipating range and relatively higher heat-dissipating efficiency on the whole.

Abstract: A heat sink includes a heat-dissipating member and a cooling fan. The heat-dissipating member includes at least two spaced fins. Each of the two fins has a first side, a second side, and a deflection piece mounted to a surface thereof. Each of the deflection pieces is inclined, extending from the first side toward the second side and engaging the adjacent fin. The cooling fan is mounted to the heat-dissipating member and close to the first sides of the fins. Accordingly, the heat sink enlarges the heat-dissipating area and enhances the heat-dissipating efficiency on the whole.