Abstract: A semiconductor device is provided. The semiconductor device includes a carrier, an electronic component, an adapter, a first metal wire and a second metal wire. The electronic component is disposed on the carrier. The adapter is disposed on the carrier. The first metal wire connects the electronic component and the adapter. The second metal wire connects the adapter and the carrier.

Abstract: A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.

Abstract: A resource allocation method comprises using resources with a used resource quantity of a machine learning system to execute a first experiment which has a first minimum resource demand, receiving an experiment request associated with a target dataset, deciding a second experiment according to the target dataset, deciding a second minimum resource demand of the second experiment, allocating resources with a quantity equal to the second minimum resource demand for an execution of the second experiment when a total resource quantity of the machine learning system meets a sum of the first minimum resource demand and the second minimum resource demand and a difference between the total resource quantity and the used resource quantity meets the second minimum resource demand, determining that the machine learning system has an idle resource, and selectively allocating said the idle resource for at least one of the first experiment and the second experiment.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

Abstract: A static auto-tuning system and method for controlling operation of a motor in a system. A speed reference signal is generated resulting in a speed response of the motor. Closed-loop feedback magnifies the rotating friction effect to an observable level. Inertia and rotating friction coefficient values of the system are estimated based on the speed frequency response and a virtual damping coefficient. A fixed low frequency speed signal may result in a first frequency response function for determining virtual damping, and a variable frequency excitation signal may result in a second frequency response function for determining the inertia and rotating friction characteristics. Closed-loop gains are determined based on these characteristics. The excitation signal may be sampled and a peak value in each interval may be identified and stored to produce an envelope of peak values for determining the gain response. Operation of the motor is controlled using the determined gains.

Abstract: A system, method, and apparatus is provided for production processes to coordinate the utilization of the operational zone for process variables and automate the execution of the target settings to maximize the production goals without requiring human intervention.

Abstract: A system, method, and apparatus is provided for production processes to coordinate the utilization of the operational zone for process variables and automate the execution of the target settings to maximize the production goals without requiring human intervention.

Abstract: A method for detecting a deflection between a source module and a detection module in a scanning apparatus and configured as a sensor pair for scanning transmission measurement of sheet material being transported in a machine direction through a sensing gap formed between the source module and the detection module. The source module is arranged on a first side of the sensing gap and emits a sensing radiation or sensing energy radiation towards the sensing gap, and the detection module is arranged on a second side of the sensing gap opposite to the first side and detects the radiation from the source module and transmitted through the sensing gap. The method includes: attaching a removable blocking device to the detection module; and performing a partially-blocked scanning process during which the source module and the detection module are jointly moved in a cross direction of the scanning apparatus.

Abstract: A magnetic recording device includes a substrate, an intermediate layer disposed on the substrate, a magnetic recording layer disposed on the intermediate layer, and a graphene overcoat disposed on the magnetic recording layer. The graphene overcoat includes at least one layer of a graphene monoatomic layer which is a sheet-like monoatomic layer of sp2 bonded carbon atoms. A transition layer is interposed between the graphene overcoat and the magnetic recording layer. The transition layer includes carbon and at least one metal of the magnetic recording layer.

Abstract: A method for detecting a deflection or relative deflection between a source module and a detection module in a scanning apparatus and configured as a sensor pair for scanning transmission measurement of sheet material being transported in a machine direction through a sensing gap formed between the source module and the detection module is provided. The source module is arranged on a first side of the sensing gap and emits a sensing radiation or sensing energy radiation towards the sensing gap, and the detection module is arranged on a second side of the sensing gap opposite to the first side and detects the radiation from the source module and transmitted through the sensing gap.

Abstract: CD variations and/or MD variations in scan measurements are determined from spectral components of power spectra of scan measurements taken using two or more scanning speeds. Dominant spectral components having the same spatial frequencies identify CD variations and dominant spectral components having the same temporal frequencies identify MD variations. Dominant spectral components are extracted from a noisy power spectrum (PS) by sorting all spectral components into an ordered PS. A first polynomial representing background noise of the ordered PS is used to set a first threshold. Spectral components of the ordered PS that exceed the first threshold are removed to form a noise PS. A second polynomial representing the noise PS is used to set a second threshold. Spectral components of the PS that exceed the second threshold are identified as dominant spectral components of the PS.

Abstract: CD variations and/or MD variations in scan measurements are determined from spectral components of power spectra of scan measurements taken using two or more scanning speeds. Dominant spectral components having the same spatial frequencies identify CD variations and dominant spectral components having the same temporal frequencies identify MD variations. Dominant spectral components are extracted from a noisy power spectrum (PS) by sorting all spectral components into an ordered PS. A first polynomial representing background noise of the ordered PS is used to set a first threshold. Spectral components of the ordered PS that exceed the first threshold are removed to form a noise PS. A second polynomial representing the noise PS is used to set a second threshold. Spectral components of the PS that exceed the second threshold are identified as dominant spectral components of the PS.

Abstract: An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and an opposite second surface; a device region disposed in the substrate; a dielectric layer located on the first surface of the semiconductor substrate; a plurality of conducting pads located in the dielectric layer and electrically connected to the device region; at least one alignment mark disposed in the semiconductor substrate and extending from the second surface towards the first surface.

Abstract: An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and an opposite second surface; a device region disposed in the substrate; a dielectric layer located on the first surface of the semiconductor substrate; a plurality of conducting pads located in the dielectric layer and electrically connected to the device region; at least one alignment mark disposed in the semiconductor substrate and extending from the second surface towards the first surface.

Abstract: An embodiment of the invention provides a chip package which includes: a chip including: a semiconductor substrate having a first surface; a device region formed in the semiconductor substrate; and a plurality of micro-lenses on the first surface and the device region; a cover substrate disposed on the chip, wherein the cover substrate is a transparent substrate; a spacer layer disposed between the chip and the cover substrate, wherein the spacer layer, the chip, and the cover substrate collectively surround a cavity in the device region; and at least one main lens on the cover substrate and in the cavity, wherein a width of the main lens is greater than that of each of the micro-lenses.

Abstract: A pixel structure having the following structure is provided. A light-shielding layer with a flat layer covering thereon is disposed on a substrate. A channel layer, a data line and a first pad are disposed on the flat layer. A source and a drain partially cover two sides of the channel layer. A gate dielectric layer with a gate, a scan line and a second pad disposed thereon covering the channel layer, the source and the data line exposes the drain and the first pad. A protection layer covering the gate and the scan line exposes the drain, the first and second pads. A patterned transparent conductive layer includes a pixel electrode disposed on the protection layer, a first retain portion disposed on the first pad and a second retain portion disposed on the second pad.

Abstract: CD variations and/or MD variations in scan measurements are determined from spectral components of power spectra of scan measurements taken using two or more scanning speeds. Dominant spectral components having the same spatial frequencies identify CD variations and dominant spectral components having the same temporal frequencies identify MD variations. Dominant spectral components are extracted from a noisy power spectrum (PS) by sorting all spectral components into an ordered PS. A first polynomial representing background noise of the ordered PS is used to set a first threshold. Spectral components of the ordered PS that exceed the first threshold are removed to form a noise PS. A second polynomial representing the noise PS is used to set a second threshold. Spectral components of the PS that exceed the second threshold are identified as dominant spectral components of the PS.

Abstract: A method and apparatus for generating a comprehensive response model for a sheet forming machine are provided. A finite number of critical points and a response type are used to create a continuous response profile for each actuator zone. The continuous response profile for each actuator zone is discretized into a discrete response profile based on the resolution appropriate for an application. A multi-zone response model for each pair of actuator set and sheet property profile is created from the discretized response profile of the actuator zones in the actuator set. The comprehensive response model for a multivariable sheet-forming machine is created from a collection of multi-zone response models for multiple pairs of actuator sets and sheet property profiles.

Abstract: A fabrication method of an active device array substrate is disclosed. A first metal material layer, a gate insulation material layer, a channel material layer, a second metal material layer, and a first photoresist layer are formed over a substrate sequentially. The first photoresist layer is patterned with a multi-tone mask to form a first patterned photoresist layer with two thicknesses. A first and second removing processes are performed sequentially using the first patterned photoresist layer as a mask to form a gate, a gate insulation layer, a channel layer, and a source/drain. The first patterned photoresist layer is removed. A passivation layer and a second patterned photoresist layer are formed over the substrate. A third removing process is performed to form a plurality of contact holes. A pixel electrode material layer is formed over the substrate. The second patterned photoresist layer is lifted off to form a pixel electrode.