Patents by Inventor Shih-Chin Gong

Shih-Chin Gong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250008270
    Abstract: A micro speaker structure is provided. The micro speaker structure includes a substrate, a diaphragm, a coil, a circuit board, and a magnet member. The substrate has a hollow space. The diaphragm is disposed over the substrate and covers the hollow chamber. The coil is embedded in the diaphragm. The circuit board is attached to the substrate. The magnet member is disposed on the circuit board and in the hollow chamber. The magnet member has a first side facing the coil and a second side opposite the first side, wherein the first side includes a first polar area and a second polar area having different polarities.
    Type: Application
    Filed: October 6, 2023
    Publication date: January 2, 2025
    Inventors: Shih-Chin GONG, Yu-Xuan XU
  • Patent number: 12170877
    Abstract: A package structure of a micro speaker includes a substrate having a hollow chamber. A diaphragm is disposed on the top surface of the substrate. The diaphragm includes a first portion suspended over the hollow chamber and a second portion surrounding the first portion. In a plan view, the second portion of the diaphragm and the hollow chamber do not overlap. A coil is embedded in the first portion of the diaphragm. At least one dummy structure is embedded in the second portion of the diaphragm, and it is electrically isolated from the coil structure by the diaphragm. A carrier board is disposed on the bottom surface of the substrate. A permanent magnetic element is disposed on the carrier board and in the hollow chamber. A package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the diaphragm.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: December 17, 2024
    Assignee: FORTEMEDIA, INC.
    Inventors: Yu-Xuan Xu, Shih-Chin Gong
  • Publication number: 20240357294
    Abstract: A package structure of a micro speaker is provided, and includes a substrate, a membrane, a coil, and a magnetic element. The substrate has a hollow chamber. The membrane is disposed on the substrate and covers the hollow chamber. The coil is embedded in the membrane. The magnetic element is disposed in the hollow chamber. A vent hole is formed in and penetrates the membrane, and the vent hole is separated from the coil and communicates with the hollow chamber.
    Type: Application
    Filed: April 18, 2023
    Publication date: October 24, 2024
    Inventors: Yu-Xuan XU, Shih-Chin GONG
  • Publication number: 20240196134
    Abstract: A package structure of a micro speaker includes a substrate having a hollow chamber. A diaphragm is disposed on the top surface of the substrate. The diaphragm includes a first portion suspended over the hollow chamber and a second portion surrounding the first portion. In a plan view, the second portion of the diaphragm and the hollow chamber do not overlap. A coil is embedded in the first portion of the diaphragm. At least one dummy structure is embedded in the second portion of the diaphragm, and it is electrically isolated from the coil structure by the diaphragm. A carrier board is disposed on the bottom surface of the substrate. A permanent magnetic element is disposed on the carrier board and in the hollow chamber. A package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the diaphragm.
    Type: Application
    Filed: December 12, 2022
    Publication date: June 13, 2024
    Inventors: Yu-Xuan XU, Shih-Chin GONG
  • Patent number: 11995246
    Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.
    Type: Grant
    Filed: February 13, 2023
    Date of Patent: May 28, 2024
    Assignee: FORTEMEDIA, INC.
    Inventors: Yu-Xuan Xu, Ching-Lung Chan, Shih-Chung Wang, Yen-Son Paul Huang, Shih-Chin Gong
  • Publication number: 20240126374
    Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.
    Type: Application
    Filed: February 13, 2023
    Publication date: April 18, 2024
    Inventors: Yu-Xuan XU, Ching-Lung CHAN, Shih-Chung WANG, Yen-Son Paul HUANG, Shih-Chin GONG
  • Publication number: 20240121545
    Abstract: A true wireless device is provided. The true wireless device includes a modulator for generating ultrasonic waves and a MEMS speaker coupled to the modulator. The MEMS speaker provides greater bandwidth than traditional speakers such as electrodynamic speakers and piezoelectric thin-film speakers. In particular, the MEMS speaker has an audio frequency band and an ultrasonic frequency band.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 11, 2024
    Inventors: Yen-Son Paul HUANG, Shih-Chin GONG
  • Publication number: 20240007793
    Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate having a hollow chamber, a diaphragm suspended over the hollow chamber, a coil embedded in the diaphragm, a carrier board disposed on a bottom surface of the substrate, a first permanent magnetic element disposed on the carrier board and in the hollow chamber, and a lid wrapped around the substrate and the diaphragm. The diaphragm includes an etching pattern. One end of the lid exposes a portion of the top surface of the diaphragm.
    Type: Application
    Filed: July 1, 2022
    Publication date: January 4, 2024
    Inventors: Yu-Xuan XU, Li-Jen CHEN, Yu-Ting CHENG, Shih-Chin GONG
  • Patent number: 11818563
    Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: November 14, 2023
    Assignee: FORTEMEDIA, INC.
    Inventors: Li-Jen Chen, Yu-Xuan Xu, Yu-Ting Cheng, Shih-Chin Gong
  • Publication number: 20230239628
    Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.
    Type: Application
    Filed: June 2, 2022
    Publication date: July 27, 2023
    Inventors: Li-Jen CHEN, Yu-Xuan XU, Yu-Ting CHENG, Shih-Chin GONG
  • Patent number: 11665484
    Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: May 30, 2023
    Assignee: FORTEMEDIA, INC.
    Inventors: Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng, Shih-Chin Gong
  • Publication number: 20220141595
    Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.
    Type: Application
    Filed: October 22, 2021
    Publication date: May 5, 2022
    Inventors: Li-Jen CHEN, Yu-Min FU, Yu-Ting CHENG, Shih-Chin GONG
  • Patent number: 11051106
    Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: June 29, 2021
    Assignee: FORTEMEDIA, INC.
    Inventors: Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng, Shih-Chin Gong
  • Publication number: 20200344551
    Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.
    Type: Application
    Filed: April 29, 2019
    Publication date: October 29, 2020
    Inventors: Li-Jen CHEN, Yu-Min FU, Yu-Ting CHENG, Shih-Chin GONG
  • Patent number: 9439309
    Abstract: An electronic apparatus and a controlling method thereof are provided. A fastened mechanism of the electronic apparatus is configured to secure a first housing and a second housing of the electronic apparatus. An operating object within a sensing range is sensed via a first sensor unit. A first sensing signal is sent to a control unit when the sensor unit sensed the operating object within the sensing range. A control signal is sent to the fastened mechanism for unlocking the fastened mechanism when the control unit receives the first sensing signal.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: September 6, 2016
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Te Shen, Yung-Ming Tien, Chih-Tarng Chuang, Hong-Tien Wang, Shi-Kuan Chen, Shih-Chin Gong, Yung-Hsiang Chen, Wei-Chih Hsu
  • Patent number: 9137913
    Abstract: A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 15, 2015
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Wei-Chih Hsu, Shi-Kuan Chen, Hong-Tien Wang, Yung-Hsiang Chen, Shih-Chin Gong, Yung-Ming Tien, Chun-Huang Yu, Chao-Tung Hsu, Jui-Che Hsu, Chih-Yin Lai, Chia-Sheng Liu
  • Publication number: 20140049147
    Abstract: An electronic apparatus and a controlling method thereof are provided. A fastened mechanism of the electronic apparatus is configured to secure a first housing and a second housing of the electronic apparatus. An operating object within a sensing range is sensed via a first sensor unit. A first sensing signal is sent to a control unit when the sensor unit sensed the operating object within the sensing range. A control signal is sent to the fastened mechanism for unlocking the fastened mechanism when the control unit receives the first sensing signal.
    Type: Application
    Filed: August 16, 2013
    Publication date: February 20, 2014
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Te Shen, Yung-Ming Tien, Chih-Tarng Chuang, Hong-Tien Wang, Shi-Kuan Chen, Shih-Chin Gong, Yung-Hsiang Chen, Wei-Chih Hsu
  • Publication number: 20130301201
    Abstract: A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body.
    Type: Application
    Filed: March 15, 2013
    Publication date: November 14, 2013
    Applicant: Compal Electronics, Inc.
    Inventors: Wei-Chih Hsu, Shi-Kuan Chen, Hong-Tien Wang, Yung-Hsiang Chen, Shih-Chin Gong, Yung-Ming Tien, Chun-Huang Yu, Chao-Tung Hsu, Jui-Che Hsu, Chih-Yin Lai, Chia-Sheng Liu
  • Patent number: 8351635
    Abstract: A silicon-based microphone structure, flip-chip mounted a substrate, has a backside and a via hole formed on the backside. A conductive layer covers the backside and the inner walls of the via hole. A solder ring is attached to the silicon-based microphone structure and electrically connected to the conductive layer.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: January 8, 2013
    Assignee: Fortemedia, Inc.
    Inventors: Chih Sun, Shih-Chin Gong
  • Patent number: 8102015
    Abstract: A microphone package includes a carrier, a cap, an integrated circuit chip, and a microphone unit. The cap covers the carrier to form a storage space. The integrated circuit chip is disposed in the storage space. The microphone unit is disposed in the storage space and stacked on the integrated circuit chip.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: January 24, 2012
    Assignee: Fortemedia, Inc.
    Inventors: Shih-Chin Gong, Wei-Chan Hsu