Patents by Inventor Shih-Chin Gong
Shih-Chin Gong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240126374Abstract: A method for touchless gesture recognition is provided. The method includes transmitting ultrasonic signals via a speaker. The method includes generating ultrasonic signals. The method includes receiving the reflected ultrasonic signals from an object via two or more microphones. The method includes computing a frequency shift according to the reflected ultrasonic signals. The method includes identifying a gesture that corresponds to a movement of the object according to the frequency shift. The method includes performing a function that corresponds to the gesture.Type: ApplicationFiled: February 13, 2023Publication date: April 18, 2024Inventors: Yu-Xuan XU, Ching-Lung CHAN, Shih-Chung WANG, Yen-Son Paul HUANG, Shih-Chin GONG
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Publication number: 20240121545Abstract: A true wireless device is provided. The true wireless device includes a modulator for generating ultrasonic waves and a MEMS speaker coupled to the modulator. The MEMS speaker provides greater bandwidth than traditional speakers such as electrodynamic speakers and piezoelectric thin-film speakers. In particular, the MEMS speaker has an audio frequency band and an ultrasonic frequency band.Type: ApplicationFiled: December 9, 2022Publication date: April 11, 2024Inventors: Yen-Son Paul HUANG, Shih-Chin GONG
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Publication number: 20240007793Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate having a hollow chamber, a diaphragm suspended over the hollow chamber, a coil embedded in the diaphragm, a carrier board disposed on a bottom surface of the substrate, a first permanent magnetic element disposed on the carrier board and in the hollow chamber, and a lid wrapped around the substrate and the diaphragm. The diaphragm includes an etching pattern. One end of the lid exposes a portion of the top surface of the diaphragm.Type: ApplicationFiled: July 1, 2022Publication date: January 4, 2024Inventors: Yu-Xuan XU, Li-Jen CHEN, Yu-Ting CHENG, Shih-Chin GONG
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Patent number: 11818563Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.Type: GrantFiled: June 2, 2022Date of Patent: November 14, 2023Assignee: FORTEMEDIA, INC.Inventors: Li-Jen Chen, Yu-Xuan Xu, Yu-Ting Cheng, Shih-Chin Gong
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Publication number: 20230239628Abstract: A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.Type: ApplicationFiled: June 2, 2022Publication date: July 27, 2023Inventors: Li-Jen CHEN, Yu-Xuan XU, Yu-Ting CHENG, Shih-Chin GONG
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Patent number: 11665484Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.Type: GrantFiled: October 22, 2021Date of Patent: May 30, 2023Assignee: FORTEMEDIA, INC.Inventors: Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng, Shih-Chin Gong
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Publication number: 20220141595Abstract: A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.Type: ApplicationFiled: October 22, 2021Publication date: May 5, 2022Inventors: Li-Jen CHEN, Yu-Min FU, Yu-Ting CHENG, Shih-Chin GONG
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Patent number: 11051106Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.Type: GrantFiled: April 29, 2019Date of Patent: June 29, 2021Assignee: FORTEMEDIA, INC.Inventors: Li-Jen Chen, Yu-Min Fu, Yu-Ting Cheng, Shih-Chin Gong
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Publication number: 20200344551Abstract: A movable embedded microstructure includes a substrate, a diaphragm, a circuit board, a permanent magnetic element, and a multi-layered coil. The substrate has a hollow chamber. The diaphragm is disposed on the substrate, and covers the hollow chamber. The circuit board is bonded to the substrate. The permanent magnetic element is disposed on the circuit board and in the hollow chamber. The multi-layered coil is embedded in the diaphragm.Type: ApplicationFiled: April 29, 2019Publication date: October 29, 2020Inventors: Li-Jen CHEN, Yu-Min FU, Yu-Ting CHENG, Shih-Chin GONG
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Patent number: 9439309Abstract: An electronic apparatus and a controlling method thereof are provided. A fastened mechanism of the electronic apparatus is configured to secure a first housing and a second housing of the electronic apparatus. An operating object within a sensing range is sensed via a first sensor unit. A first sensing signal is sent to a control unit when the sensor unit sensed the operating object within the sensing range. A control signal is sent to the fastened mechanism for unlocking the fastened mechanism when the control unit receives the first sensing signal.Type: GrantFiled: August 16, 2013Date of Patent: September 6, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Chun-Te Shen, Yung-Ming Tien, Chih-Tarng Chuang, Hong-Tien Wang, Shi-Kuan Chen, Shih-Chin Gong, Yung-Hsiang Chen, Wei-Chih Hsu
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Patent number: 9137913Abstract: A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body.Type: GrantFiled: March 15, 2013Date of Patent: September 15, 2015Assignee: COMPAL ELECTRONICS, INC.Inventors: Wei-Chih Hsu, Shi-Kuan Chen, Hong-Tien Wang, Yung-Hsiang Chen, Shih-Chin Gong, Yung-Ming Tien, Chun-Huang Yu, Chao-Tung Hsu, Jui-Che Hsu, Chih-Yin Lai, Chia-Sheng Liu
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Publication number: 20140049147Abstract: An electronic apparatus and a controlling method thereof are provided. A fastened mechanism of the electronic apparatus is configured to secure a first housing and a second housing of the electronic apparatus. An operating object within a sensing range is sensed via a first sensor unit. A first sensing signal is sent to a control unit when the sensor unit sensed the operating object within the sensing range. A control signal is sent to the fastened mechanism for unlocking the fastened mechanism when the control unit receives the first sensing signal.Type: ApplicationFiled: August 16, 2013Publication date: February 20, 2014Applicant: COMPAL ELECTRONICS, INC.Inventors: Chun-Te Shen, Yung-Ming Tien, Chih-Tarng Chuang, Hong-Tien Wang, Shi-Kuan Chen, Shih-Chin Gong, Yung-Hsiang Chen, Wei-Chih Hsu
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Publication number: 20130301201Abstract: A portable electronic device adapted to be detachably connected to a cradle having a containing cavity is provided, wherein an inner wall of the containing cavity has a recess. The portable electronic device includes a body and a locking-and-releasing mechanism disposed in the body and including a driving unit and a latch. The driving unit is disposed in the body. The latch is connected to the driving unit and suitable for being driven by the driving unit to protrude out of the body or hide in the body. When the portable electronic device is disposed in the containing cavity, the driving unit drives the latch to protrude out of the body and be engaged with the recess. When the portable electronic device is going to be detached from the containing cavity, the driving unit drives the latch to be disengaged from the recess and move back in the body.Type: ApplicationFiled: March 15, 2013Publication date: November 14, 2013Applicant: Compal Electronics, Inc.Inventors: Wei-Chih Hsu, Shi-Kuan Chen, Hong-Tien Wang, Yung-Hsiang Chen, Shih-Chin Gong, Yung-Ming Tien, Chun-Huang Yu, Chao-Tung Hsu, Jui-Che Hsu, Chih-Yin Lai, Chia-Sheng Liu
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Patent number: 8351635Abstract: A silicon-based microphone structure, flip-chip mounted a substrate, has a backside and a via hole formed on the backside. A conductive layer covers the backside and the inner walls of the via hole. A solder ring is attached to the silicon-based microphone structure and electrically connected to the conductive layer.Type: GrantFiled: November 5, 2008Date of Patent: January 8, 2013Assignee: Fortemedia, Inc.Inventors: Chih Sun, Shih-Chin Gong
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Patent number: 8102015Abstract: A microphone package includes a carrier, a cap, an integrated circuit chip, and a microphone unit. The cap covers the carrier to form a storage space. The integrated circuit chip is disposed in the storage space. The microphone unit is disposed in the storage space and stacked on the integrated circuit chip.Type: GrantFiled: October 2, 2008Date of Patent: January 24, 2012Assignee: Fortemedia, Inc.Inventors: Shih-Chin Gong, Wei-Chan Hsu
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Publication number: 20100111344Abstract: A silicon-based microphone structure, flip-chip mounted a substrate, has a backside and a via hole formed on the backside. A conductive layer covers the backside and the inner walls of the via hole. A solder ring is attached to the silicon-based microphone structure and electrically connected to the conductive layer.Type: ApplicationFiled: November 5, 2008Publication date: May 6, 2010Applicant: FORTEMEDIA, INC.Inventors: Chih Sun, Shih-Chin Gong
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Publication number: 20100086164Abstract: A microphone package includes a carrier, a cap, an integrated circuit chip, and a microphone unit. The cap covers the carrier to form a storage space. The integrated circuit chip is disposed in the storage space. The microphone unit is disposed in the storage space and stacked on the integrated circuit chip.Type: ApplicationFiled: October 2, 2008Publication date: April 8, 2010Applicant: FORTEMEDIA, INC.Inventors: Shih-Chin GONG, Wei-Chan HSU
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Publication number: 20100086146Abstract: A microphone package includes a carrier, a cap, a first silicon-based microphone, and a first integrated circuit chip. The carrier has a first storage space. The cap has a planar part contacting the carrier and a plurality of flanges extending from the planar part and surrounding the carrier. The first silicon-based microphone is disposed in the first storage space and covered by the cap. The first integrated circuit chip is disposed in the first storage space, electrically connected to the first silicon-based microphone, and covered by the cap.Type: ApplicationFiled: October 2, 2008Publication date: April 8, 2010Applicant: FORTEMEDIA, INC.Inventors: Shih-Chin GONG, Wei-Chan HSU
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Publication number: 20080083958Abstract: A micro-electromechanical system package includes a substrate, a set of components, at least one solder pad, a frame, a peripheral shield and a top shield. The set is provided on the substrate. At least one solder pad is attached to the substrate opposite to the set. A frame is provided on the substrate. A peripheral shield is provided on the substrate around the set. The isolative stuff seals the set. The isolative stuff defines a tunnel. The top shield is provided on the isolative stuff for shielding the set from electromagnetic interference. The top shield includes a column inserted through the tunnel and connected to the solder pad.Type: ApplicationFiled: January 5, 2007Publication date: April 10, 2008Inventors: Wen-Chieh Wei, Hong-Ching Her, Shih-Chin Gong, Chih-Wei Chang
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Publication number: 20080083957Abstract: A micro-electromechanical system package includes a substrate, a group of components, isolative stuff and a conductive shield. The substrate is made with an upper face and a lower face. The group is mounted on the upper face of the substrate. The isolative stuff seals the group and the upper face of the substrate, thus protecting the group from moisture. The conductive shield covers the isolative stuff, thus protecting the group from electromagnetic interference.Type: ApplicationFiled: October 5, 2006Publication date: April 10, 2008Inventors: Wen-Chieh Wei, Hong-Ching Her, Shih-Chin Gong, Chih-Wei Chang