Abstract: Provided is an inductor structure and manufacturing method thereof, including forming an inductance coil in a semiconductor packaging carrier plate and disposing a patterned magnetic conductive layer in the inductance coil. Therefore, a patterned build-up wiring method is used to form a magnetic material in the carrier plate, thereby improving electrical characteristics of the inductor.

Abstract: A component-embedded packaging structure is provided, in which a plurality of metal layers are formed on an inactive surface of a semiconductor chip so as to serve as a buffer portion, and the semiconductor chip is disposed on a carrying portion with the buffer portion via an adhesive. Then, the semiconductor chip is encapsulated by an insulating layer, and a build-up circuit structure is formed on the insulating layer and electrically connected to the semiconductor chip. Therefore, the buffer portion can prevent delamination from occurring between the semiconductor chip and the adhesive on the carrying portion if the semiconductor chip has a CTE (Coefficient of Thermal Expansion) less than a CTE of the adhesive.

Abstract: When a real-time MPEG video encoding is performed, null frames are used to compensate lost frames. Or, when a performance of the real-time MPEG video encoding is insufficient, the encoding is performed in accordance with a predetermined frame-type output sequence, in which the null frames are uniformly distributed in the predetermined frame-type output sequence. The null frames are encoded by transforming a null predictive frame with a pixel value of 0 into a discrete cosine transform coefficient through a discrete cosine transform algorithm. The discrete cosine transform coefficient is then transformed into a quantized discrete cosine transform coefficient by quantization. The quantized discrete cosine transform coefficient is then encoded with a null motion vector of (0,0) by variable length coding.