Patents by Inventor Shih-Chin Hung

Shih-Chin Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8486729
    Abstract: A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: July 16, 2013
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Chih-Chiang Lu, Chien-Yuan Wang, Yen-Wen Chen, Jui-Hung Yeh, Shih-Chin Hung, Yu-Wei Tu, Chun-Yi Wu, Wei-Chih Peng
  • Publication number: 20120231560
    Abstract: A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
    Type: Application
    Filed: May 23, 2012
    Publication date: September 13, 2012
    Inventors: Min-Hsun Hsieh, Chih-Chiang Lu, Chien-Yuan Wang, Yen-Wen Chen, Jui-Hung Yeh, Shih-Chin Hung, Yu-Wei Tu, Chun-Yi Wu, Wei-Chih Peng
  • Patent number: 8207539
    Abstract: A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: June 26, 2012
    Assignee: Epistar Corporation
    Inventors: Min-Hsun Hsieh, Chih-Chiang Lu, Chien-Yuan Wang, Yen-Wen Chen, Jui-Hung Yeh, Shih-Chin Hung, Yu-Wei Tu, Chun-Yi Wu, Wei-Chih Peng
  • Publication number: 20100308355
    Abstract: A semiconductor light-emitting device having a thinned structure comprises a thinned structure formed between a semiconductor light-emitting structure and a carrier. The manufacturing method comprises the steps of forming a semiconductor light-emitting structure above a substrate; attaching the semiconductor light-emitting structure to a support; thinning the substrate to form a thinned structure; forming or attaching a carrier to the thinned substrate; and removing the support.
    Type: Application
    Filed: June 9, 2009
    Publication date: December 9, 2010
    Inventors: Min-Hsun HSIEH, Chih-Chiang LU, Chien-Yuan WANG, Yen-Wen CHEN, Jui-Hung YEH, Shih-Chin HUNG, Yu-Wei TU, Chun-Yi WU, Wei-Chih PENG