Patents by Inventor Shih-Chin LIU

Shih-Chin LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to predict yield of a device manufacturing process
    Patent number: 11714357
    Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: August 1, 2023
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Alexander Ypma, Cyrus Emil Tabery, Simon Hendrik Celine Van Gorp, Chenxi Lin, Dag Sonntag, Hakki Ergün Cekli, Ruben Alvarez Sanchez, Shih-Chin Liu, Simon Philip Spencer Hastings, Boris Menchtchikov, Christiaan Theodoor De Ruiter, Peter Ten Berge, Michael James Lercel, Wei Duan, Pierre-Yves Jerome Yvan Guittet
  • METHOD TO PREDICT YIELD OF A DEVICE MANUFACTURING PROCESS
    Publication number: 20210325788
    Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Alexander YPMA, Cyrus Emil TABERY, Simon Hendrik Celine VAN GORP, Chenxi LIN, Dag SONNTAG, Hakki Ergün CEKLI, Ruben ALVAREZ SANCHEZ, Shih-Chin LIU, Simon Philip Spencer HASTINGS, Boris MENCHTCHIKOV, Christiaan Theodoor DE RUITER, Peter TEN BERGE, Michael James LERCEL, Wei DUAN, Pierre-Yves Jerome Yvan GUITTET
  • Method to predict yield of a device manufacturing process
    Patent number: 11086229
    Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: August 10, 2021
    Assignee: ASML Netherlands B.V.
    Inventors: Alexander Ypma, Cyrus Emil Tabery, Simon Hendrik Celine Van Gorp, Chenxi Lin, Dag Sonntag, Hakki Ergün Cekli, Ruben Alvarez Sanchez, Shih-Chin Liu, Simon Philip Spencer Hastings, Boris Menchtchikov, Christiaan Theodoor De Ruiter, Peter Ten Berge, Michael James Lercel, Wei Duan, Pierre-Yves Jerome Yvan Guittet
  • METHOD TO PREDICT YIELD OF A DEVICE MANUFACTURING PROCESS
    Publication number: 20200103761
    Abstract: A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 2, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Alexander YPMA, Cyrus Emil TABERY, Simon Hendrik Celine VAN GORP, Chenxi LIN, Dag SONNTAG, Hakki Ergün CEKLI, Ruben ALVAREZ SANCHEZ, Shih-Chin LIU, Simon Philip Spencer HASTINGS, Boris MENCHTCHIKOV, Christiaan Theodoor DE RUTTER, Peter TEN BERGE, Michael James LERCEL, Wei DUAN, Pierre-Yves Jerome Yvan GUITTET