Patents by Inventor Shih-Chuan Tsai

Shih-Chuan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad
    Publication number: 20150382459
    Abstract: The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench in the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench is electrically connect to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board is also provided.
    Type: Application
    Filed: June 26, 2015
    Publication date: December 31, 2015
    Inventors: Shih-Chuan Tsai, Ching-Chang Yang
  • Method of fabricating an environmental friendly cladding layer
    Patent number: 8557076
    Abstract: A method of fabricating an environmentally friendly cladding layer is provided. A metal layer is deposited on a hydrolysis film by a vacuum evaporation method. Then, after coating a polymeric adhesive layer on the metal layer, the hydrolysis film is immersed in water. After hydrolyzing the hydrolysis film, a substrate is adhered on the metal layer through the polymeric adhesive layer. Finally, the polymeric adhesive layer, the metal layer and the substrate are baked for thermosetting the polymeric adhesive.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: October 15, 2013
    Inventor: Shih-Chuan Tsai
  • METHOD OF FABRICATING AN ENVIRONMENTAL FRIENDLY CLADDING LAYER
    Publication number: 20100178516
    Abstract: A method of fabricating an environmentally friendly cladding layer is provided. A metal layer is deposited on a hydrolysis film by a vacuum evaporation method. Then, after coating a polymeric adhesive layer on the metal layer, the hydrolysis film is immersed in water. After hydrolyzing the hydrolysis film, a substrate is adhered on the metal layer through the polymeric adhesive layer. Finally, the polymeric adhesive layer, the metal layer and the substrate are baked for thermosetting the polymeric adhesive.
    Type: Application
    Filed: March 18, 2010
    Publication date: July 15, 2010
    Applicant: SHIH-CHUAN TSAI
    Inventor: Shih-Chuan TSAI
  • Method of fabricating an environmentally friendly cladding layer
    Publication number: 20060292363
    Abstract: A method of fabricating an environmentally friendly cladding layer is provided. A metal layer is deposited on a hydrolysis film by a vacuum evaporation method. Then, after coating a polymer adhesive on the metal layer, the hydrolysis film is immersed in water. After hydrolyzing the hydrolysis film, an electroplate is adhered on the metal layer through the polymer adhesive. Finally, the polymer adhesive, the metal layer and the electroplate are baked for thermosetting the polymer adhesive.
    Type: Application
    Filed: May 11, 2006
    Publication date: December 28, 2006
    Inventor: Shih-Chuan Tsai