Patents by Inventor Shih-Ding Lee

Shih-Ding Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11755335
    Abstract: In an example, a computing device includes a non-volatile storage device to store a basic input/output system (BIOS) variable. Further, the computing device includes a BIOS. During a boot process of the computing devices, the BIOS may read the BIOS variable from the non-volatile storage device. Further, the BIOS may detect that an application is to be deployed in the computing device based on the BIOS variable. Furthermore, the BIOS may load an application package from the non-volatile storage device into a volatile storage device and build an advanced configuration and power interface (ACPI) data structure with the application package loaded in the volatile storage device. Further, the BIOS may deploy the application using the ACPI data structure.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: September 12, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ming Chang Hung, Yun-Chu Chen, Shih-Ding Lee, Nathan Edward Kofahl
  • Publication number: 20230168901
    Abstract: In an example, a computing device includes a non-volatile storage device to store a basic input/output system (BIOS) variable. Further, the computing device includes a BIOS. During a boot process of the computing devices, the BIOS may read the BIOS variable from the non-volatile storage device. Further, the BIOS may detect that an application is to be deployed in the computing device based on the BIOS variable. Furthermore, the BIOS may load an application package from the non-volatile storage device into a volatile storage device and build an advanced configuration and power interface (ACPI) data structure with the application package loaded in the volatile storage device. Further, the BIOS may deploy the application using the ACPI data structure.
    Type: Application
    Filed: November 26, 2021
    Publication date: June 1, 2023
    Inventors: Ming Chang Hung, Yun-Chu Chen, Shih-Ding Lee, Nathan Edward Kofahl