Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: An energy storage system is provided comprising at least one energy string. Each energy string comprises a voltage adapter comprising a plurality of distributed sub-voltage adapter units, each having a primary side and a secondary side. Each energy string further comprises a primary energy storage block having at least one energy storage device. The primary sides of the plurality of distributed sub-voltage adapter units and the primary energy storage block are configured to be connected in series. The energy storage system further comprises at least one secondary energy storage block having at least one energy storage device. The secondary side of at least one sub-voltage adapter unit of the plurality of sub-voltage units is configured to be connected with one of said at least one secondary energy storage block.

Abstract: A method includes providing a placing layout of the integrated circuit; generating a routed layout including a layout region with a systematic design rule check (DRC) violation; and performing a loop when the DRC the systematic DRC violation exists. The loop includes: generating an adjusted routing layout of the integrated circuit by adjusting the layout region with the systematic DRC violation according to a target placement recipe; extracting features of the placing layout to obtain extracted data; extracting features of the layout region with the systematic DRC violation to obtain extracted routing data; generating a plurality of aggregated-cluster models based upon the extracted data and the extracted routing data; selecting a target aggregated-cluster model from the plurality of aggregated-cluster models by comparing the extracted data to the plurality of aggregated-cluster models; and selecting the target placement recipe from a plurality of placement recipes to generate the adjusted routing layout.

Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.

Abstract: A transistor is provided. The transistor includes a first source/drain epitaxial feature, a second source/drain epitaxial feature, and two or more semiconductor layers disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature. The two or more semiconductor layers comprise different materials. The transistor further includes a gate electrode layer surrounding at least a portion of the two or more semiconductor layers, wherein the transistor has two or more threshold voltages.

Abstract: A monitoring system for a spring machine includes a carrier platform, a sensing module, and a processing device. The carrier platform is adapted to be movably disposed adjacent to the spring machine. The sensing module includes a vision sensor, and a processing unit that is connected to the vision sensor. The vision sensor is configured to perform image detection on a dimension of a coil of a coil spring to be produced by the spring machine, and to generate and output a detection result of the dimension. The processing unit is configured to generate a detection signal according to the detection result received from the vision sensor. The processing device stores multiple correction values, and is configured to, obtain according to the detection signal, and to transmit to the spring machine, one of the correction values, for the spring machine to adjust the dimension of a coil later formed.

Abstract: A metal grid within a trench isolation structure on the back side of an image sensor is coupled to a contact pad so that a voltage on the metal grid is continuously variable with a voltage on the contact pad. One or more conductive structures directly couple the metal grid to a contact pad. The conductive structures may bypass a front side of the image sensor. A bias voltage on the metal grid may be varied through the contact pad whereby a trade-off between reducing cross-talk and increasing quantum efficiency may be adjusted dynamically in accordance with the application of the image sensor, its environment of use, or its mode of operation.

Abstract: A method for dynamic correction for pixels of thermal image array, which is applied to the factory correction of a bolometer, includes: individual resistance calculation step: at a reference temperature, a reference current is sequentially provided to the thermistors of all pixels in an image sensing array, to measure a corresponding resistance array values and recorded in a memory; individual current parameter calculation step: according to the resistance array values and a rated voltage value, respectively calculate a current array value, and record in the memory; and the step of confirming the rated voltage value: at the reference temperature, when reading the individual pixel voltage value of the image sensing array, provide the individual current parameter corresponding to each pixel according to the current array value, and confirm it corresponds to the rated voltage value.

Abstract: A cleaning system and a cleaning method are provided. The cleaning system includes a main body, an air suctioning device, a light source, an optical sensor, a memory and a processing unit. The air suctioning device includes an air flow passage and a fan-motor assembly that is disposed in the air flow passage and generates a suction force to suction outside air through the air flow passage. The light source emit light to the air flow passage. The optical sensor captures a plurality of successive image frames from the air flow passage. The processing unit is configured to: obtain first and second image frames from the successive image frames; compare the first image frame with the second image frame to identify dust particles; obtain a particle feature of the dust particles; and determine a current cleanness condition according to the particle feature.

Abstract: An image segmentation method includes the following steps: obtaining a target image; inputting the target image into a machine learning model to obtain an image segmentation parameter value corresponding to the target image; executing an image segmentation algorithm on the target image according to the image segmentation parameter value to obtain an image segmentation result, wherein the image segmentation result is segmenting the target image into object regions; and displaying the image segmentation result. In addition, an electronic device and storage medium using the method are also provided.

Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: A weeder robot includes a movable carrier and a blade module assembled to the movable carrier. The movable carrier includes a map creating module and a control module that is electrically coupled to the blade module and the map creating module. The map creating module includes an infrared unit and a vision sensing unit. The infrared unit can emit and receive an infrared light. The vision sensing unit can obtain an image information in a non-contact manner. The movable carrier can be used to move in a court, so that the map creating module can generate a three-dimensional (3D) court map through cooperation between the infrared unit and the vision sensing unit. When the weeder robot performs a maintenance process, the control module drives the blade module to weed a portion of a lawn higher than a predetermined height according to the 3D court map.

Abstract: An inverting and cleaning device includes a positioning mechanism, an inverting mechanism, and a cleaning mechanism. The positioning mechanism is adapted to move a drum to a first position. The inverting mechanism includes a holding member. When the drum is located at the first position, the holding member clamps a drum body of the drum and inverts the drum to a second position where an opening on a top of the drum faces downward. The cleaning mechanism includes a cleaning tool. When the drum is located at the second position, the cleaning tool enters the drum through the opening of the drum for cleaning an inside of the drum.

Abstract: A device includes a signal-edge detector, an anomaly detector and a reset-interrupt generator. The signal-edge detector outputs a timing-start signal when detecting that a logic level of an SDA signal from an SDA line of an I2C bus changes from logical high to logical low, and outputs a timing-reset signal when detecting that the logic level changes from logical low to logical high. Upon receiving the timing-start signal, the anomaly detector starts to time a timing duration, and outputs an error signal when the timing duration reaches a preset time duration. Upon receiving the timing-reset signal, the anomaly detector resets the timing duration to zero. In response to receipt of the error signal, the reset-interrupt generator outputs an interrupt signal to a processor for removing an abnormal state, or outputs a pin-reset signal to an optical module to reset a pin connected to the SDA line.

Abstract: The present invention discloses a shielding jig which mainly comprises an adjustment unit, a positioning unit and a sealing unit. The adjustment unit is configured and engaged between the positioning unit and the sealing unit. Therefore, a first actuation surface of the adjustment unit matches with a second actuation surface of the sealing unit, resulting in expansion of the sealing unit. This expansion makes the shielding jig be able to shade and seal any workpiece.

Abstract: The invention provides a semiconductor cleaning step, which comprises the following steps: providing a chamber with a bottom surface and a sidewall, the chamber contains a heater on the bottom surface, performing a first deposition step to leave a residual layer on the sidewall of the chamber, performing a carbon deposition step to form a carbon layer on at least the surface of the heater, and performing a plasma cleaning step to simultaneously remove the residual layer on the sidewall of the chamber and the carbon layer on the bottom surface.

Abstract: A cleaning system and a cleaning method are provided. The cleaning system includes a main body, an air suctioning device, a light source, an optical sensor, a memory and a processing unit. The air suctioning device includes an air flow passage and a fan-motor assembly that is disposed in the air flow passage and generates a suction force to suction outside air through the air flow passage. The light source emit light to the air flow passage. The optical sensor captures a plurality of successive image frames from the air flow passage. The processing unit is configured to: obtain first and second image frames from the successive image frames; compare the first image frame with the second image frame to identify dust particles; obtain a particle feature of the dust particles; and determine a current cleanness condition according to the particle feature.

Abstract: Systems and methods are provided for predicting systematic design rule check (DRC) violations in a placement layout before routing is performed on the placement layout. A systematic DRC violation prediction system includes DRC violation prediction circuitry. The DRC violation prediction circuitry receives placement data associated with a placement layout. The DRC violation prediction circuitry inspects the placement data associated with the placement layout, and the placement data may include data associated with a plurality of regions of the placement layout, which may be inspected on a region-by-region basis. The DRC violation prediction circuitry predicts whether one or more systematic DRC violations would be present in the placement layout due to a subsequent routing of the placement layout.

Abstract: An apparatus for synchronous Ethernet comprises a processor, a field programmable gate array, a synchronizer, a physical layer implementor and a media accessing controller, wherein, the processor transmits a control data through a first transmission interface; the field programmable gate array receives the control data, generates a control instruction in accordance with the control data and transmits the control instruction through a second transmission interface; the synchronizer receives the control instruction and generates a synchronous clock in accordance with the control instruction; and each of the physical layer implementor and the media accessing controller receives and works in accordance with the synchronous clock and media accessing control protocol.

Abstract: A navigation device applied to a wireless identification tag includes a movable signal transceiver and an operation processor. The movable signal transceiver is adapted to transmit a detection signal and receive an actuation signal relevant to the detection signal. The operation processor is electrically connected to the movable signal transceiver. The operation processor is adapted to analyze the actuation signal to acquire relative position between the movable signal transceiver and the wireless identification tag, and generate a motion parameter in accordance with the relative position for moving the movable signal transceiver.