Abstract: An antenna rotation structure includes a rotating shaft member rotatably disposed through a perforated groove of a housing, an annular member, and an elastic member. The rotating shaft member has a holding portion located in an accommodating space of the housing, a connecting portion connected to the holding portion and with an annular groove, and a gripping portion with one end connected to the connecting portion and the other end protruded from the housing. The annular member is disposed in the annular groove and abuts the perforated groove. The elastic member is sleeved on the one end of the gripping portion. The connecting portion and the one end of the gripping portion are disposed in the perforated groove. The gripping portion is turned to drive the rotating shaft member to rotate, thereby adjusting an angle of the antenna.

Abstract: An actuating and sensing module is disclosed and includes a bottom plate, a gas pressure sensor, a thin gas transportation device and a cover plate. The bottom plate includes a pressure relief orifice, a discharging orifice and a communication orifice. The gas pressure sensor is disposed on the bottom plate and seals the communication orifice. The thin gas transportation device is disposed on the bottom plate and seals the pressure relief orifice and the discharging orifice. The cover plate is disposed on the bottom plate and covers the gas pressure sensor and the thin gas-transportation device. The cover plate includes an intake orifice. The thin gas transportation device is driven to inhale gas through the intake orifice, the gas is then discharged through the discharging orifice by the thin gas transportation device, and a pressure change of the gas is sensed by the gas pressure sensor.

Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.

Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.

Abstract: An integrated circuit (IC) device includes a substrate, and a memory array layer having a plurality of transistors. First through fourth gate contacts are arranged along a first axis, and coupled to underlying gates of the plurality of transistors. First through fifth source/drain contacts in the memory array layer extend along a second axis transverse to the first axis, and are coupled to underlying source/drains of the plurality of transistors. The gate contacts and the source/drain contacts are alternatingly arranged along the first axis. A source line extends along the first axis, and is coupled to the first and fifth source/drain contacts. First and second word lines extend along the first axis, the first word line is coupled to the first and third gate contacts, and the second word line is coupled to the second and fourth gate contacts.

Abstract: A thermal-image proximity gesture recognition module, a device having a thermal-image proximity gesture recognition function, and a thermal-image proximity gesture recognition method are disclosed. The device has a non-lens infrared window and a thermal-image proximity gesture recognition module.

Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.

Abstract: An image object labeling method and system are disclosed. The method is executed by a processor coupled to a memory and includes providing an image file; detecting at least one first object on the image file and generating at least one graphic block and attribute thereof; performing a binarization process to present a first graphic feature on a region containing the graphic block in the image file and a second graphic feature on the rest region; combining the results of detecting and the binarization process, and filtering the image file through several gradually reduced masks to show several separated graphic components until number of the separated graphic components and the at least one graphic block are the same; and assigning a label to the separated graphic components according to the attribute, alternatively, outputting a message, receiving a command for adjusting the graphic block and attribute thereof, as the labels.

Abstract: A character recognition method includes inputting an input image of a document, with the input image including a plurality of characters; selecting the plurality of characters through an object detection module to form at least one character region; separating the plurality of characters in the at least one character region to form a plurality of character boxes; performing calculation to determine a format of a character in each of the plurality of character boxes; recognizing the characters in the at least one character region through an object recognition module to determine a symbol content of the character in each of the plurality of character boxes; and converting the plurality of characters according to the format and symbol content of the character in each of the plurality of character boxes, and outputting corresponding editable characters.

Abstract: A method for analyzing a viewing direction of an electronic component includes inputting a package type and a file image of an electronic component, with the file image having at least one engineering drawing image, and the at least one engineering drawing image being a view of the electronic component in at least one viewing direction; querying and acquiring a viewing direction detection model meeting the package type from a database, with the database storing respective viewing direction detection models of different package types of electronic components; inputting the file image into the viewing direction detection model of the package type to identify the viewing direction of the at least one engineering drawing image; and outputting the viewing direction of the at least one engineering drawing image of the electronic component.

Abstract: A temperature sensing apparatus and a temperature sensing method thereof are provided. A current source circuit provides a test current to a temperature sensing load, and the temperature sensing load generates a test voltage in response to the test current. A processing circuit determines a type of the temperature sensing load according to the test voltage, and determines a temperature according to the type of the temperature sensing load and a temperature sensing voltage generated by the temperature sensing load.

Abstract: A bus system is provided. The bus system includes a master device, a bus and a plurality of slave devices. The slave devices and the master device are electrically connected through the bus. The master device communicates with the slave devices by using a one-to-one communication mechanism. The slave devices communicate with the master device by using an arbitration mechanism in which one of the slave devices is selected to communicate with the master device.

Abstract: A modular intelligent clothing is provided, which includes a clothing body, modular main board, and a functional board, in which the modular main board is disposed at any position of the clothing body, the functional board is disposed at any position of the clothing body, and the functional board is electrically coupled with the modular main board. The electrically connection between the functional board and the modular main board utilize the metal conductor, magnetic induction, or wireless communication. Accordingly, the functional board and the modular main board are matched each other to sense the physiological signals of the user, to position of the location of user, or to perform the home care monitoring.

Abstract: The disclosure is related a method for testing and measuring the performances of electrical components on a semiconductor IC device through a test apparatus (also referred to as a testline) disposed in a scribe line between the semiconductor IC devices on a wafer. The test apparatus may include a built-in self-test (BIST) circuit and a duplication of the electrical components subjected to the performance measurement. Minimum and maximum testing voltages are provided to the test apparatus, where the range of voltage between the minimum and maximum testing voltages are divided into a plurality of testing operational voltages which are applied to the test apparatus. For each testing operational voltages, a memory array operation test is performed, where at least one of the testing operational voltages resulting in a performance failure is identified as the minimal operating voltage of the memory array.

Abstract: The disclosure is related a method for testing and measuring the performances of electrical components on a semiconductor IC device through a test apparatus (also referred to as a testline) disposed in a scribe line between the semiconductor IC devices on a wafer. The test apparatus may include a built-in self-test (BIST) circuit and a duplication of the electrical components subjected to the performance measurement. Minimum and maximum testing voltages are provided to the test apparatus, where the range of voltage between the minimum and maximum testing voltages are divided into a plurality of testing operational voltages which are applied to the test apparatus. For each testing operational voltages, a memory array operation test is performed, where at least one of the testing operational voltages resulting in a performance failure is identified as the minimal operating voltage of the memory array.

Abstract: A modular intelligent clothing is provided, which includes a clothing body, modular main board, and a functional board, in which the modular main board is disposed at any position of the clothing body, the functional board is disposed at any position of the clothing body, and the functional board is electrically coupled with the modular main board. The electrically connection between the functional board and the modular main board utilize the metal conductor, magnetic induction, or wireless communication. Accordingly, the functional board and the modular main board are matched each other to sense the physiological signals of the user, to position of the location of user, or to perform the home care monitoring.

Abstract: A temperature sensing apparatus and a temperature sensing method thereof are provided. A current source circuit provides a test current to a temperature sensing load, and the temperature sensing load generates a test voltage in response to the test current. A processing circuit determines a type of the temperature sensing load according to the test voltage, and determines a temperature according to the type of the temperature sensing load and a temperature sensing voltage generated by the temperature sensing load.

Abstract: A bus system is provided. The bus system includes a master device, a bus and a plurality of slave devices. The slave devices and the master device are electrically connected through the bus. The master device communicates with the slave devices by using a one-to-one communication mechanism. The slave devices communicate with the master device by using an arbitration mechanism in which one of the slave devices is selected to communicate with the master device.

Abstract: This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.

Abstract: This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.