Abstract: A method and a system for sharing a digital pathological image are provided, where the digital pathological image is presented on a first interactive interface of a first terminal device with an editing permission and a second interactive interface of a second terminal device with an observing permission by a server. In the first terminal device, in response to an image adjustment operation or a tag adding operation performed through the first interactive interface, corresponding image adjustment information or added tag information is transmitted to the second interactive interface of the second terminal device through the first interactive interface. In the second terminal device, in response to receiving the image adjustment information or the added tag information through the second interaction interface, the content presented on the second interaction interface is correspondingly adjusted based on the image adjustment information or the tag adding information.

Abstract: A method and a system for image recognition and a computer readable storage medium are provided. The method includes: obtaining an image to be recognized; cutting the image to be recognized into multiple tiles, wherein a size of each of the tiles conforms to a preset size; inputting the tiles into a trained artificial intelligence model respectively; obtaining multiple judgment results of the tiles, wherein each of the judgment results includes a specified category in which the corresponding tile is classified into multiple categories; and storing the judgment results as a structured report to be output to a digital pathology platform.

Abstract: A metal grid within a trench isolation structure on the back side of an image sensor is coupled to a contact pad so that a voltage on the metal grid is continuously variable with a voltage on the contact pad. One or more conductive structures directly couple the metal grid to a contact pad. The conductive structures may bypass a front side of the image sensor. A bias voltage on the metal grid may be varied through the contact pad whereby a trade-off between reducing cross-talk and increasing quantum efficiency may be adjusted dynamically in accordance with the application of the image sensor, its environment of use, or its mode of operation.

Abstract: A method for dynamic correction for pixels of thermal image array, which is applied to the factory correction of a bolometer, includes: individual resistance calculation step: at a reference temperature, a reference current is sequentially provided to the thermistors of all pixels in an image sensing array, to measure a corresponding resistance array values and recorded in a memory; individual current parameter calculation step: according to the resistance array values and a rated voltage value, respectively calculate a current array value, and record in the memory; and the step of confirming the rated voltage value: at the reference temperature, when reading the individual pixel voltage value of the image sensing array, provide the individual current parameter corresponding to each pixel according to the current array value, and confirm it corresponds to the rated voltage value.

Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.

Abstract: A thermal-image proximity gesture recognition module, a device having a thermal-image proximity gesture recognition function, and a thermal-image proximity gesture recognition method are disclosed. The device has a non-lens infrared window and a thermal-image proximity gesture recognition module.

Abstract: An image object classification method and system are disclosed. The method is executed by a processor coupled to a memory. The method includes: providing an image file including at least one image object, performing a process of extracting multiple binary-classified characteristics on the image object to obtain a plurality of first results independent of each other in categories, combining the plurality of first results in a manner of dimensionality reduction based on concatenation, performing a process of characteristics abstraction on the combined first results to obtain a second result, and performing a process of characteristics integration on the plurality of first results and the second result in a manner of dot product of matrices to obtain a classification result.

Abstract: An image object labeling method and system are disclosed. The method is executed by a processor coupled to a memory and includes providing an image file; detecting at least one first object on the image file and generating at least one graphic block and attribute thereof; performing a binarization process to present a first graphic feature on a region containing the graphic block in the image file and a second graphic feature on the rest region; combining the results of detecting and the binarization process, and filtering the image file through several gradually reduced masks to show several separated graphic components until number of the separated graphic components and the at least one graphic block are the same; and assigning a label to the separated graphic components according to the attribute, alternatively, outputting a message, receiving a command for adjusting the graphic block and attribute thereof, as the labels.

Abstract: A method for analyzing a viewing direction of an electronic component includes inputting a package type and a file image of an electronic component, with the file image having at least one engineering drawing image, and the at least one engineering drawing image being a view of the electronic component in at least one viewing direction; querying and acquiring a viewing direction detection model meeting the package type from a database, with the database storing respective viewing direction detection models of different package types of electronic components; inputting the file image into the viewing direction detection model of the package type to identify the viewing direction of the at least one engineering drawing image; and outputting the viewing direction of the at least one engineering drawing image of the electronic component.

Abstract: A character recognition method includes inputting an input image of a document, with the input image including a plurality of characters; selecting the plurality of characters through an object detection module to form at least one character region; separating the plurality of characters in the at least one character region to form a plurality of character boxes; performing calculation to determine a format of a character in each of the plurality of character boxes; recognizing the characters in the at least one character region through an object recognition module to determine a symbol content of the character in each of the plurality of character boxes; and converting the plurality of characters according to the format and symbol content of the character in each of the plurality of character boxes, and outputting corresponding editable characters.

Abstract: A temperature sensing apparatus and a temperature sensing method thereof are provided. A current source circuit provides a test current to a temperature sensing load, and the temperature sensing load generates a test voltage in response to the test current. A processing circuit determines a type of the temperature sensing load according to the test voltage, and determines a temperature according to the type of the temperature sensing load and a temperature sensing voltage generated by the temperature sensing load.

Abstract: A bus system is provided. The bus system includes a master device, a bus and a plurality of slave devices. The slave devices and the master device are electrically connected through the bus. The master device communicates with the slave devices by using a one-to-one communication mechanism. The slave devices communicate with the master device by using an arbitration mechanism in which one of the slave devices is selected to communicate with the master device.

Abstract: A modular intelligent clothing is provided, which includes a clothing body, modular main board, and a functional board, in which the modular main board is disposed at any position of the clothing body, the functional board is disposed at any position of the clothing body, and the functional board is electrically coupled with the modular main board. The electrically connection between the functional board and the modular main board utilize the metal conductor, magnetic induction, or wireless communication. Accordingly, the functional board and the modular main board are matched each other to sense the physiological signals of the user, to position of the location of user, or to perform the home care monitoring.

Abstract: The disclosure is related a method for testing and measuring the performances of electrical components on a semiconductor IC device through a test apparatus (also referred to as a testline) disposed in a scribe line between the semiconductor IC devices on a wafer. The test apparatus may include a built-in self-test (BIST) circuit and a duplication of the electrical components subjected to the performance measurement. Minimum and maximum testing voltages are provided to the test apparatus, where the range of voltage between the minimum and maximum testing voltages are divided into a plurality of testing operational voltages which are applied to the test apparatus. For each testing operational voltages, a memory array operation test is performed, where at least one of the testing operational voltages resulting in a performance failure is identified as the minimal operating voltage of the memory array.

Abstract: The disclosure is related a method for testing and measuring the performances of electrical components on a semiconductor IC device through a test apparatus (also referred to as a testline) disposed in a scribe line between the semiconductor IC devices on a wafer. The test apparatus may include a built-in self-test (BIST) circuit and a duplication of the electrical components subjected to the performance measurement. Minimum and maximum testing voltages are provided to the test apparatus, where the range of voltage between the minimum and maximum testing voltages are divided into a plurality of testing operational voltages which are applied to the test apparatus. For each testing operational voltages, a memory array operation test is performed, where at least one of the testing operational voltages resulting in a performance failure is identified as the minimal operating voltage of the memory array.

Abstract: A modular intelligent clothing is provided, which includes a clothing body, modular main board, and a functional board, in which the modular main board is disposed at any position of the clothing body, the functional board is disposed at any position of the clothing body, and the functional board is electrically coupled with the modular main board. The electrically connection between the functional board and the modular main board utilize the metal conductor, magnetic induction, or wireless communication. Accordingly, the functional board and the modular main board are matched each other to sense the physiological signals of the user, to position of the location of user, or to perform the home care monitoring.

Abstract: A temperature sensing apparatus and a temperature sensing method thereof are provided. A current source circuit provides a test current to a temperature sensing load, and the temperature sensing load generates a test voltage in response to the test current. A processing circuit determines a type of the temperature sensing load according to the test voltage, and determines a temperature according to the type of the temperature sensing load and a temperature sensing voltage generated by the temperature sensing load.

Abstract: A bus system is provided. The bus system includes a master device, a bus and a plurality of slave devices. The slave devices and the master device are electrically connected through the bus. The master device communicates with the slave devices by using a one-to-one communication mechanism. The slave devices communicate with the master device by using an arbitration mechanism in which one of the slave devices is selected to communicate with the master device.

Abstract: This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.

Abstract: This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.