Abstract: A method and a system for sharing a digital pathological image are provided, where the digital pathological image is presented on a first interactive interface of a first terminal device with an editing permission and a second interactive interface of a second terminal device with an observing permission by a server. In the first terminal device, in response to an image adjustment operation or a tag adding operation performed through the first interactive interface, corresponding image adjustment information or added tag information is transmitted to the second interactive interface of the second terminal device through the first interactive interface. In the second terminal device, in response to receiving the image adjustment information or the added tag information through the second interaction interface, the content presented on the second interaction interface is correspondingly adjusted based on the image adjustment information or the tag adding information.

Abstract: A dummy gate electrode and a dummy gate dielectric are removed to form a recess between adjacent gate spacers. A gate dielectric is deposited in the recess, and a barrier layer is deposited over the gate dielectric. A first work function layer is deposited over the barrier layer. A first anti-reaction layer is formed over the first work function layer, the first anti-reaction layer reducing oxidation of the first work function layer. A fill material is deposited over the first anti-reaction layer.

Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.

Abstract: A wafer stacking process is provided in the present invention, including steps of forming a silicon oxide layer on a sacrificial carrier, bonding the silicon oxide layer with a dielectric layer on a front side of a silicon substrate, performing a thinning process on the back side of the silicon substrate to expose TSVs therewithin, bonding the back side of the silicon substrate with another silicon substrate, repeating the thinning process and the process of bonding another silicon substrate above so as to form a wafer stacking structure, and performing a removing process to completely remove the sacrificial carrier.

Abstract: The present invention discloses a shielding jig which mainly comprises an adjustment unit, a positioning unit and a sealing unit. The adjustment unit is configured and engaged between the positioning unit and the sealing unit. Therefore, a first actuation surface of the adjustment unit matches with a second actuation surface of the sealing unit, resulting in expansion of the sealing unit. This expansion makes the shielding jig be able to shade and seal any workpiece.

Abstract: The present invention discloses a shielding jig which mainly comprises an adjustment unit, a positioning unit and a sealing unit. The adjustment unit is configured and engaged between the positioning unit and the sealing unit. Therefore, a first actuation surface of the adjustment unit matches with a second actuation surface of the sealing unit, resulting in expansion of the sealing unit. This expansion makes the shielding jig be able to shade and seal any workpiece.

Abstract: A movable sink is provided with a body which is connected with a discharge element. The movable sink also includes at least one sink and one moving device, and the sink is located inside the body and is provided with an inlet and an outlet. The outlet is connected to the discharge element, and the moving device is located at a bottom of the body. After a water supply has been replenished from the inlet, the movable sink can be moved to any place to provide the water supply by the moving device.