Patents by Inventor Shih-Fu Lee

Shih-Fu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200292157
    Abstract: A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 ?m and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.
    Type: Application
    Filed: May 29, 2020
    Publication date: September 17, 2020
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
  • Patent number: 10741721
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: August 11, 2020
    Assignee: EPISTAR Corporation
    Inventors: Cheng-Feng Yu, Ching-Yuan Tsai, Yao-Ru Chang, Hsin-Chan Chung, Shih-Chang Lee, Wen-Luh Liao, Cheng-Hsing Chiang, Kuo-Feng Huang, Hsu-Hsuan Teng, Hung-Ta Cheng, Yung-Fu Chang
  • Patent number: 10670244
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: June 2, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chi-Chih Pu, Chen-Hong Lee, Shih-Yu Yeh, Wei-Kang Cheng, Shyi-Ming Pan, Siang-Fu Hong, Chih-Shu Huang, Tzu-Hsiang Wang, Shih-Chieh Tang, Cheng-Kuang Yang
  • Publication number: 20200168757
    Abstract: This disclosure discloses an optical sensing device. The device includes a carrier body; a first light-emitting device disposed on the carrier body; and a light-receiving device including a group III-V semiconductor material disposed on the carrier body, including a light-receiving surface having an area, wherein the light-receiving device is capable of receiving a first received wavelength having a largest external quantum efficiency so the ratio of the largest external quantum efficiency to the area is ?13.
    Type: Application
    Filed: November 27, 2019
    Publication date: May 28, 2020
    Inventors: Yi-Chieh LIN, Shiuan-Leh LIN, Yung-Fu CHANG, Shih-Chang LEE, Chia-Liang HSU, Yi HSIAO, Wen-Luh LIAO, Hong-Chi SHIH, Mei-Chun LIU
  • Publication number: 20200152831
    Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventors: Yung-Fu CHANG, Hui-Fang KAO, Yi-Tang LAI, Shih-Chang LEE, Wen-Luh LIAO, Mei Chun LIU, Yao-Ru CHANG, Yi HISAO
  • Publication number: 20200152836
    Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventors: Wen-Luh LIAO, Cheng-Long YEH, Ko-Yin LAI, Yao-Ru CHANG, Yung-Fu CHANG, Yi HSIAO, Shih-Chang LEE
  • Patent number: 10607856
    Abstract: A manufacturing method of a redistribution layer is provided. The method includes the following steps. A patterned sacrificial layer is formed on a carrier. An actuate angle is formed between a side wall of the patterned sacrificial layer and the carrier. A first conductive layer is formed. The first conductive layer includes a plurality of first portions formed on the carrier and a plurality of second portions formed on the patterned sacrificial layer. The patterned sacrificial layer and the second portions of the first conductive layer are removed from the carrier. Another manufacturing method of a redistribution layer is also provided.
    Type: Grant
    Filed: June 18, 2017
    Date of Patent: March 31, 2020
    Assignee: Powertech Technology Inc.
    Inventors: Kun-Yung Huang, Chih-Fu Lung, Shih-Chi Li, Mei-Chen Lee, Chung-Hao Tsai, Chi-Liang Wang
  • Publication number: 20200075807
    Abstract: A semiconductor structure includes a carrier having a surface, a supporting element, a semiconductor stack and a bridge layer. The supporting element is on the surface. The semiconductor stack is on the surface and has a side surface. The bridge layer includes a first portion connecting to the supporting element, a second portion, and a third portion connecting to the semiconductor stack. The second portion is extended from the third portion toward the first portion and is protruded from the side surface.
    Type: Application
    Filed: August 23, 2019
    Publication date: March 5, 2020
    Inventors: Yung-Fu CHANG, Fan-Lei WU, Shih-Chang LEE, Wen-Luh LIAO, Hung-Ta CHENG, Chih-Chaing YANG, Yao-Ru CHANG, Yi HSIAO, Hsiang CHANG
  • Patent number: 10461223
    Abstract: A semiconductor device includes a semiconductor stack comprising a surface, and an electrode structure comprises an electrode pad formed on the surface, and the electrode structure further comprises a first extending electrode, a second extending electrode and a third extending electrode connecting to the electrode pad. The first extending electrode is closer to a periphery of the surface than the third extending electrode is, and the second extending electrode is between the first extending electrode and the third extending electrode. From a top view of the semiconductor device, the first extending electrode, the second extending electrode and the third extending electrode respectively include a first curve having a first angle ?1, a second curve having a second angle ?2 and a third curve having a third angle ?3, wherein ?3>?2>?1 .
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: October 29, 2019
    Assignee: Epistar Corporation
    Inventors: Yung-Fu Chang, Hsin-Chan Chung, Hung-Ta Cheng, Wen-Luh Liao, Shih-Chang Lee, Chih-Chiang Lu, Yi-Ming Chen, Yao-Ning Chan, Chun-Fu Tsai
  • Publication number: 20190229233
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Application
    Filed: April 3, 2019
    Publication date: July 25, 2019
    Inventors: Cheng-Feng YU, Ching-Yuan TSAI, Yao-Ru CHANG, Hsin-Chan CHUNG, Shih-Chang LEE, Wen-Luh LIAO, Cheng-Hsing CHIANG, Kuo-Feng HUANG, Hsu-Hsuan TENG, Hung-Ta CHENG, Yung-Fu CHANG
  • Publication number: 20190219252
    Abstract: The present invention relates to a light emitting device comprising a transparent substrate which light can pass through and at least one LED chip emitting light omni-directionally. Wherein the LED chip is disposed on one surface of the substrate and the light emitting angle of the LED chip is wider than 180°, and the light emitted by the LED chip will penetrate into the substrate and at least partially emerge from another surface of the substrate. According to the present invention, the light emitting device using LED chips can provide sufficient lighting intensity and uniform lighting performance.
    Type: Application
    Filed: March 26, 2019
    Publication date: July 18, 2019
    Inventors: CHI-CHIH PU, CHEN-HONG LEE, SHIH-YU YEH, WEI-KANG CHENG, SHYI-MING PAN, SIANG-FU HONG, CHIH-SHU HUANG, TZU-HSIANG WANG, SHIH-CHIEH TANG, CHENG-KUANG YANG
  • Patent number: 10312407
    Abstract: A light-emitting device is provided. The light-emitting device comprises a substrate; an insulating layer on the substrate, wherein the insulating layer comprises a first hole; a light-emitting stack on the insulating layer and comprising an active region comprising a top surface, wherein the top surface comprises a first part and a second part; and an opaque layer covering the first part of the top surface and exposing the second part of the top surface, wherein the second part is directly above the first hole.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: June 4, 2019
    Assignee: EPISTAR CORPORATION
    Inventors: Cheng-Feng Yu, Ching-Yuan Tsai, Yao-Ru Chang, Hsin-Chan Chung, Shih-Chang Lee, Wen-Luh Liao, Cheng-Hsing Chiang, Kuo-Feng Huang, Hsu-Hsuan Teng, Hung-Ta Cheng, Yung-Fu Chang
  • Patent number: 10288258
    Abstract: The lighting module includes a light emitter, a hood and a cover. The light emitter is mounted on an end of the hood. The cover is disposed in the hood and has a conic reflecting surface. When the light emitter is lit up, the lights are emitted into the hood and reflected by the conic reflecting surface and then further reflected by the hood to be projected outward.
    Type: Grant
    Filed: December 31, 2017
    Date of Patent: May 14, 2019
    Inventors: Shih-Fu Huang, Wei-Jung Lee
  • Patent number: 10288494
    Abstract: A thermometer circuit configured to estimate a monitored temperature is disclosed. The circuit includes an adjustable resistor presenting a first resistance value that is temperature-independent and a second resistance value that is temperature-dependent, wherein a first current signal is conducted across the resistor when it presents the first resistance value and a second current signal is conducted across the resistor when it presents the second resistance value; a plurality of gated conductors coupled to the resistor; and a control circuit, coupled to the resistor and the plurality of gated conductors, and configured to selectively deactivate at least one of the plurality of gated conductors to compare the first and second current signals to estimate the monitored temperature.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: May 14, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Lien Linus Lu, Chia-Fu Lee, Yi-Chun Shih, Chung-Cheng Chou, Yu-Der Chih
  • Patent number: 9307676
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: April 5, 2016
    Assignee: CHIPMOS TECHNOLOGIES INC.
    Inventors: Tzu Hsin Huang, Yu Ting Yang, Hung Hsin Liu, An Hong Liu, Geng Shin Shen, David Wei Wang, Shih Fu Lee
  • Publication number: 20140193538
    Abstract: Provided herein is an apparatus, including an imprint template including a dual-imprint pattern, wherein the dual-imprint pattern is characteristic of imprinting a first pattern on the template with a first template and a second pattern on the template with a second template, and wherein the first pattern and the second pattern at least partially overlap to form the dual-imprint pattern.
    Type: Application
    Filed: January 21, 2014
    Publication date: July 10, 2014
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: Kim Y. Lee, Bing K. Yen, David S. Kuo, Koichi Wago, Shih-fu Lee, Dieter K. Weller
  • Patent number: 8771529
    Abstract: A method of imprint lithography includes imprinting a first pattern with a first template on a first substrate of a lithographic template. A second pattern is imprinted with a second template on the substrate of the lithographic template. The first pattern and the second pattern at least partially overlap, thus forming a third pattern. The third pattern is lithographically formed on a second substrate with the lithographic template. In an embodiment, the first pattern is a concentric line pattern formed by thin film deposition. In an embodiment, the second pattern is a radial line pattern. In an embodiment the first pattern and the second pattern may have line frequency increased.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: July 8, 2014
    Assignee: Seagate Technology LLC
    Inventors: Kim Yang Lee, Bing Yen, David Kuo, Koichi Wago, Shih-Fu Lee, Dieter Weller
  • Publication number: 20130294033
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Application
    Filed: July 5, 2013
    Publication date: November 7, 2013
    Inventors: TZU HSIN HUANG, YU TING YANG, HUNG HSIN LIU, AN HONG LIU, GENG SHIN SHEN, DAVID WEI WANG, SHIH FU LEE
  • Patent number: 8564954
    Abstract: A thermally enhanced electronic package comprises a driver chip, an insulator, a flexible carrier, and carbon nanocapsules. The flexible carrier includes a flexible substrate, a wiring layer formed on the substrate, and a resistant overlaying the wiring layer. The driver chip is connected to the wiring layer. The insulator is filled in the gap between the driver chip and the flexible carrier. The carbon nanocapsules are disposed on the driver chip, on the resistant, on the flexible carrier, or in the insulator to enhance heat dissipation of electronic packages.
    Type: Grant
    Filed: November 18, 2010
    Date of Patent: October 22, 2013
    Assignee: Chipmos Technologies Inc.
    Inventors: Tzu Hsin Huang, Yu Ting Yang, Hung Hsin Liu, An Hong Liu, Geng Shin Shen, Wei David Wang, Shih Fu Lee
  • Patent number: D894850
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: September 1, 2020
    Assignee: EPISTAR CORPORATION
    Inventors: Chun-Fu Tsai, Yao-Ning Chan, Yi-Tang Lai, Yi-Ming Chen, Shih-Chang Lee