Patents by Inventor Shih Fuyu

Shih Fuyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package integrated with conformal shield and antenna
    Patent number: 9007273
    Abstract: A semiconductor package integrated with conformal shield and antenna is provided. The semiconductor package includes a semiconductor element, an electromagnetic interference shielding element, a dielectric structure, an antenna element and an antenna signal feeding element. The electromagnetic interference shielding element includes an electromagnetic interference shielding film and a grounding element, wherein the electromagnetic interference shielding film covers the semiconductor element and the grounding element is electrically connected to the electromagnetic interference shielding layer and a grounding segment of the semiconductor element. The dielectric structure covers a part of the electromagnetic interference shielding element and has an upper surface. The antenna element is formed adjacent to the upper surface of the dielectric structure. The antenna signal feeding element passing through the dielectric structure electrically connects the antenna element and the semiconductor element.
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: April 14, 2015
    Assignee: Advances Semiconductor Engineering, Inc.
    Inventors: Kuo-Hsien Liao, Chi-Hong Chan, Shih Fuyu
  • SEMICONDUCTOR PACKAGE INTEGRATED WITH CONFORMAL SHIELD AND ANTENNA
    Publication number: 20120062439
    Abstract: A semiconductor package integrated with conformal shield and antenna is provided. The semiconductor package includes a semiconductor element, an electromagnetic interference shielding element, a dielectric structure, an antenna element and an antenna signal feeding element. The electromagnetic interference shielding element includes an electromagnetic interference shielding film and a grounding element, wherein the electromagnetic interference shielding film covers the semiconductor element and the grounding element is electrically connected to the electromagnetic interference shielding layer and a grounding segment of the semiconductor element. The dielectric structure covers a part of the electromagnetic interference shielding element and has an upper surface. The antenna element is formed adjacent to the upper surface of the dielectric structure. The antenna signal feeding element passing through the dielectric structure electrically connects the antenna element and the semiconductor element.
    Type: Application
    Filed: August 8, 2011
    Publication date: March 15, 2012
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuo-Hsien Liao, Chi-Hong Chan, Shih Fuyu