Patents by Inventor Shih Fung Perng

Shih Fung Perng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10638597
    Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: April 28, 2020
    Assignee: Cisco Technology, Inc.
    Inventors: Shih Fung Perng, Weidong Xie, Nguyet-Anh Nguyen
  • Publication number: 20180228017
    Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
    Type: Application
    Filed: April 9, 2018
    Publication date: August 9, 2018
    Applicant: Cisco Technology, Inc.
    Inventors: Shih Fung Perng, Weidong Xie, Nguyet-Anh Nguyen
  • Patent number: 9980367
    Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: May 22, 2018
    Assignee: Cisco Technology, Inc.
    Inventors: Shih Fung Perng, Weidong Xie, Nguyet-Anh Nguyen
  • Publication number: 20160157335
    Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
    Type: Application
    Filed: February 3, 2016
    Publication date: June 2, 2016
    Inventors: Shih Fung Perng, Weidong Xie, Nguyet-Anh Nguyen
  • Patent number: 9282649
    Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
    Type: Grant
    Filed: October 8, 2013
    Date of Patent: March 8, 2016
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Shih Fung Perng, Weidong Xie, Nguyet-Anh Nguyen
  • Publication number: 20150096787
    Abstract: An apparatus may be provided. The apparatus may comprise a substrate and a circuit board. A ball grid array structure may be disposed between the substrate and the circuit board. In addition, a stand-off structure may be disposed between the substrate and the circuit board. The stand-off structure may be adjacent to the ball grid array structure.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 9, 2015
    Applicant: Cisco Technology, Inc.
    Inventors: Shih Fung Perng, Weidong Xie, Nguyet-Anh Nguyen