Abstract: A semiconductor device includes a first stack structure, a second stack structure, and a third stack structure. Each of the stack structure includes semiconductor layers vertically spaced from one another. The first, second, and third stack structures all extend along a first lateral direction. The second stack structure is disposed between the first and third stack structures. The semiconductor device includes a first gate structure that extends along a second lateral direction and wraps around each of the semiconductor layers. The semiconductor layers of the first stack structure are coupled with respective source/drain structures. The semiconductor layers of the second stack structure are coupled with respective source/drain structures. The semiconductor layers of the third stack structure are coupled with a dielectric passivation layer.

Abstract: A method includes etching a semiconductor substrate to form a trench, with the semiconductor substrate having a sidewall facing the trench, and depositing a first semiconductor layer extending into the trench. The first semiconductor layer includes a first bottom portion at a bottom of the trench, and a first sidewall portion on the sidewall of the semiconductor substrate. The first sidewall portion is removed to reveal the sidewall of the semiconductor substrate. The method further includes depositing a second semiconductor layer extending into the trench, with the second semiconductor layer having a second bottom portion over the first bottom portion, and a second sidewall portion contacting the sidewall of the semiconductor substrate. The second sidewall portion is removed to reveal the sidewall of the semiconductor substrate.

Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).

Abstract: A semiconductor device includes a plurality of semiconductor layers vertically separated from one another. Each of the plurality of semiconductor layers extends along a first lateral direction. The semiconductor device includes a gate structure that extends along a second lateral direction and comprises at least a lower portion that wraps around each of the plurality of semiconductor layers. The lower portion of the gate structure comprises a plurality of first gate sections that are laterally aligned with the plurality of semiconductor layers, respectively, and wherein each of the plurality of first gate sections has ends that each extend along the second lateral direction and present a first curvature-based profile.

Abstract: A semiconductor device includes a substrate. The semiconductor device includes a fin that is formed over the substrate and extends along a first direction. The semiconductor device includes a gate structure that straddles the fin and extends along a second direction perpendicular to the first direction. The semiconductor device includes a first source/drain structure coupled to a first end of the fin along the first direction. The gate structure includes a first portion protruding toward the first source/drain structure along the first direction. A tip edge of the first protruded portion is vertically above a bottom surface of the gate structure.

Abstract: A semiconductor device is described. An isolation region is disposed on the substrate. A plurality of channels extend through the isolation region from the substrate. The channels including an active channel and an inactive channel. A dummy fin is disposed on the isolation region and between the active channel and the inactive channel. An active gate is disposed over the active channel and the inactive channel, and contacts the isolation region. A dielectric material extends through the active gate and contacts a top of the dummy fin. The inactive channel is a closest inactive channel to the dielectric material. A long axis of the active channel extends in a first direction. A long axis of the active gate extends in a second direction. The active channel extends in a third direction from the substrate. The dielectric material is closer to the inactive channel than to the active channel.

Abstract: A semiconductor device includes a plurality of channel layers vertically separated from one another. The semiconductor device also includes an active gate structure comprising a lower portion and an upper portion. The lower portion wraps around each of the plurality of channel layers. The semiconductor device further includes a gate spacer extending along a sidewall of the upper portion of the active gate structure. The gate spacer has a bottom surface. Moreover, a dummy gate dielectric layer is disposed between the gate spacer and a topmost channel layer of plurality of channel layers. The dummy gate dielectric layer is in contact with a top surface of the topmost channel layer, the bottom surface of the gate spacer, and the sidewall of the gate structure.

Abstract: A method of fabricating a semiconductor device is disclosed. The method includes forming semiconductor fins on a substrate. A first dummy gate is formed over the semiconductor fins. A recess is formed in the first dummy gate, and the recess is disposed between the semiconductor fins. A dummy fin material is formed in the recess. A portion of the dummy fin material is removed to expose an upper surface of the first dummy gate and to form a dummy fin. A second dummy gate is formed on the exposed upper surface of the first dummy gate.

Abstract: The present invention discloses a data transmission apparatus having clock gating mechanism. Each of data transmission circuits has a flip-flop depth of N and receives a write clock signal and one of read clock signals to receive and output one of data signals. A write clock gating circuit receives a write clock gating enabling signal to transmit the write clock signal to the data transmission circuits. Each of read clock gating circuits receives one of read clock gating enabling signals to transmit one of the read clock signals. The gating signal transmission circuit has a flip-flop depth of N+M and receives the write and the read clock signals to receive the write clock gating enabling signal and output the read clock gating enabling signals. A largest timing difference among the read clock signals is P clock cycles and M is at least [P].

Abstract: A detection circuit and a detection method are provided. The detection circuit is suitable for a system-on-chip (SoC). The SoC is coupled to an alarm pin of a DDR4 memory through a connection pad, and the detection circuit includes a control circuit coupled to the connection pad. In response to the DDR4 memory performing a refresh process or a specific event occurring, the control circuit outputs a test signal with a first voltage level to the connection pad, and determines whether a voltage level of the connection pad is tied to a second voltage level. In response to determining that the voltage level of the connection pad is tied to the second voltage level, the control circuit outputs an interrupt signal to a CPU of the SoC, and the interrupt signal indicates that the alarm pin of the DDR4 memory is not controlled normally by the DDR4 memory.

Abstract: A method of foreground auto-calibrating data reception window for a DRAM system is disclosed. The method comprises receiving data strobe and data from a DRAM of the DARM system, capturing a data strobe clock according to the received data strobe, generating three time points with a period of the data strobe clock, sampling the data at the three time points, to obtain three sampled data, determining whether to adjust positions of the three time points according to a comparison among the three sampled data, and configuring the valid data reception window according to the positions of the three time points when determining not to adjust the positions of the three time points.

Abstract: The present disclosure discloses a memory access interface device. The clock generation circuit thereof generates reference clocks. Each of the DDR access signal transmission circuits thereof, under a DDR mode, adjusts a phase and a duty cycle of one of DDR access signals according to one of DDR reference clock signals to generate one of output access signals to access the memory device. The data signal transmission circuit thereof, under an SDR mode, applies a minimum latency on an SDR data signal according to the command and address reference clock signal to generate an output SDR data signal to access the memory device. The command and address signal transmission circuit thereof, under either the DDR or SDR mode, applies a programmable latency on a command and address signal according to the command and address reference clock signal to generate an output command and address signal to access the memory device.

Abstract: A memory controller comprising: a delay circuit, configured to use a first delay value and a second delay value to respectively delay a sampling clock signal to generate a first and a second delayed sampling clock signal; a sampling circuit, configured to use a first edge of the first delayed sampling clock signal to sample a data signal to generate a first sampling value, and configured to use a second edge of the second delayed sampling clock signal to sample the data signal to generate a second sampling value; and a calibrating circuit, configured to generate a sampling delay value according to the first delay value based on the first sampling value and the second sampling value. The delay circuit uses the sampling delay value to generate an adjusted sampling clock signal and the sampling circuit sample the data signal by the adjusted sampling clock signal.

Abstract: A method of foreground auto-calibrating data reception window for a DRAM system is disclosed. The method comprises receiving data strobe and data from a DRAM of the DARM system, capturing a data strobe clock according to the received data strobe, generating three time points with a period of the data strobe clock, sampling the data at the three time points, to obtain three sampled data, determining whether to adjust positions of the three time points according to a comparison among the three sampled data, and configuring the valid data reception window according to the positions of the three time points when determining not to adjust the positions of the three time points.

Abstract: A memory signal phase difference calibration circuit includes: a clock generator providing clocks allowing a physical layer (PHY) circuit of DDR SDRAM to generate a data input/output signal (DQ) and a data strobe signal (DQS) for accessing a storage circuit; a calibration control circuit outputting a phase control signal according to an adjustment range to adjust the phase of a target signal (DQ or DQS), and outputting a calibration control signal; an access control circuit reading storage data representing predetermined data from the storage circuit according to the calibration control signal; a comparison circuit comparing the predetermined data with the storage data to output a result allowing the calibration control circuit to alter the adjustment range accordingly; and a phase controller outputting a clock control signal according to the phase control signal to set the phase of a target clock used for the PHY circuit generating the target signal.