Patents by Inventor Shih-Hao Kuo

Shih-Hao Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240027896
    Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.
    Type: Application
    Filed: July 25, 2022
    Publication date: January 25, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Shih-Hao Kuo, Hsiu-Jen Wang, Ulrich Mueller, Jang Fung Chen
  • Publication number: 20230288822
    Abstract: Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.
    Type: Application
    Filed: March 12, 2022
    Publication date: September 14, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Ulrich Mueller, Hsiu-Jen Wang, Shih-Hao Kuo, Jang Fung Chen
  • Publication number: 20230260815
    Abstract: The present disclosure provides a multi-substrate handling system having an alignment apparatus capable of positioning each of a set of substrates in predetermined orientations for transfer. A buffer chamber is configured to receive and condition the set of substrates which are disposed on a substrate carrier. A first transfer assembly is configured to transfer the set of substrates to and from the buffer chamber and is capable of transferring each of the set of substrates from the alignment apparatus to the carrier in the buffer chamber. The carrier includes a plurality of modules capable of securing the set of substrates. The system includes a second transfer assembly having at least two robots configured to transfer the carrier of the set of substrates between the buffer chamber and a process chamber. The process chamber is capable of processing the set of substrates using different process parameters for each substrate.
    Type: Application
    Filed: June 16, 2021
    Publication date: August 17, 2023
    Inventors: Hsiu-jen WANG, Sin-Yi JIANG, Neng-rui DONG, Shih-Hao KUO, Chia-Hung KAO, Bang-Yu LIU, Hsu-Ming HSU
  • Patent number: 11263785
    Abstract: An object detection method, an electronic apparatus and an object detection system are provided. The method is adapted to the electronic apparatus and includes the following steps. A first image is obtained. A geometric transformation operation is performed on the first image to obtain at least one second image. The first image and the at least one second image are combined to generate a combination image. The combination image including the first image and the at least one second image is inputted into a trained deep learning model to detect a target object.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: March 1, 2022
    Assignee: Wistron Corporation
    Inventors: Shih-Hao Kuo, Hao-Gong Chou, Tai Chung
  • Patent number: 11145252
    Abstract: A light-emitting diode apparatus and a control method of the light-emitting diode apparatus are provided. The control method includes: applying a pre-reset voltage to a control terminal of a driving transistor of the light-emitting diode apparatus in a pre-resetting stage to pre-reset the control terminal of the driving transistor; resetting the control terminal of the driving transistor of the light-emitting diode apparatus by using a reset voltage source in a first resetting stage; compensating the control terminal of the driving transistor to a compensation voltage in a compensation stage; and providing, by the driving transistor, a driving current in a light emission stage to drive a light-emitting diode of the light-emitting diode apparatus to emit light.
    Type: Grant
    Filed: May 26, 2019
    Date of Patent: October 12, 2021
    Assignee: Au Optronics Corporation
    Inventors: Sen-Chuan Hung, Shih-Hao Kuo
  • Publication number: 20210150764
    Abstract: An object detection method, an electronic apparatus and an object detection system are provided. The method is adapted to the electronic apparatus and includes the following steps. A first image is obtained. A geometric transformation operation is performed on the first image to obtain at least one second image. The first image and the at least one second image are combined to generate a combination image. The combination image including the first image and the at least one second image is inputted into a trained deep learning model to detect a target object.
    Type: Application
    Filed: February 18, 2020
    Publication date: May 20, 2021
    Applicant: Wistron Corporation
    Inventors: Shih-Hao Kuo, Hao-Gong Chou, Tai Chung
  • Patent number: 10970557
    Abstract: A posture determination method applicable to an electronic system including an image capturing device is provided. The image capturing device is set up corresponding to a target. The posture determination method includes: acquiring a plurality of consecutive images captured by the image capturing device; performing a motion detection on the consecutive images; determining whether an image content of the consecutive images is static after a movement according to a detection result of the motion detection; and determining a posture of the target when the image content is static after the movement. In addition, the electronic system and a non-transitory computer-readable recording medium using the method are also provided.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: April 6, 2021
    Assignee: Wistron Corporation
    Inventor: Shih-Hao Kuo
  • Patent number: 10948834
    Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: March 16, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Ching-Chang Chen, Chien-Hua Lai, Wei-Chung Chen, Shih-Hao Kuo, Hsiu-Jen Wang
  • Patent number: 10928743
    Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: February 23, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chien-Hua Lai, Chia-Hung Kao, Hsiu-Jen Wang, Shih-Hao Kuo, Yi-Sheng Liu, Shih-Hsien Lee, Ching-Chang Chen, Tsu-Hui Yang
  • Publication number: 20200333711
    Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: Ching-Chang CHEN, Chien-Hua LAI, Wei-Chung CHEN, Shih-Hao KUO, Hsiu-Jen WANG
  • Patent number: 10719018
    Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: July 21, 2020
    Assignee: Applied Materials, Inc.
    Inventors: Ching-Chang Chen, Chien-Hua Lai, Wei-Chung Chen, Shih-Hao Kuo, Hsiu-Jen Wang
  • Patent number: 10599942
    Abstract: A target tracking method and system adaptable to multi-target tracking include performing global-search detection on a current image to obtain candidates of the current image. Association between the candidates and a tracked target is performed to determine similarity between the candidates and the tracked target and to give corresponding similarity values to the candidates. The candidate with a maximum similarity value is defined as an associated candidate of the tracked target. Candidates with non-zero similarity values and primary-object classification other than the associated candidate are filtered out and defined as filtered candidates. New tracked targets are generated according to the associated candidate and the filtered candidates.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: March 24, 2020
    Assignee: Wistron Corporation
    Inventors: Shih-Hao Kuo, Ming-Che Ho
  • Publication number: 20200019065
    Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
    Type: Application
    Filed: July 10, 2018
    Publication date: January 16, 2020
    Inventors: Ching-Chang CHEN, Chien-Hua LAI, Wei-Chung CHEN, Shih-Hao KUO, Hsiu-Jen WANG
  • Publication number: 20190378460
    Abstract: A light-emitting diode apparatus and a control method of the light-emitting diode apparatus are provided. The control method includes: applying a pre-reset voltage to a control terminal of a driving transistor of the light-emitting diode apparatus in a pre-resetting stage to pre-reset the control terminal of the driving transistor; resetting the control terminal of the driving transistor of the light-emitting diode apparatus by using a reset voltage source in a first resetting stage; compensating the control terminal of the driving transistor to a compensation voltage in a compensation stage; and providing, by the driving transistor, a driving current in a light emission stage to drive a light-emitting diode of the light-emitting diode apparatus to emit light.
    Type: Application
    Filed: May 26, 2019
    Publication date: December 12, 2019
    Applicant: Au Optronics Corporation
    Inventors: Sen-Chuan Hung, Shih-Hao Kuo
  • Publication number: 20190369499
    Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.
    Type: Application
    Filed: March 19, 2019
    Publication date: December 5, 2019
    Inventors: Chien-Hua LAI, Chia-Hung KAO, Hsiu-Jen WANG, Shih-Hao KUO, Yi-Sheng LIU, Shih-Hsien LEE, Ching-Chang CHEN, Tsu-Hui YANG
  • Publication number: 20190332868
    Abstract: A posture determination method applicable to an electronic system including an image capturing device is provided. The image capturing device is set up corresponding to a target. The posture determination method includes: acquiring a plurality of consecutive images captured by the image capturing device; performing a motion detection on the consecutive images; determining whether an image content of the consecutive images is static after a movement according to a detection result of the motion detection; and determining a posture of the target when the image content is static after the movement. In addition, the electronic system and a non-transitory computer-readable recording medium using the method are also provided.
    Type: Application
    Filed: July 23, 2018
    Publication date: October 31, 2019
    Applicant: Wistron Corporation
    Inventor: Shih-Hao Kuo
  • Patent number: 10459341
    Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 29, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Chien-Hua Lai, Ching-Chang Chen, Shih-Hao Kuo, Tsu-Hui Yang, Hsiu-Jen Wang, Yi-Sheng Liu, Chia-Hung Kao
  • Publication number: 20190235389
    Abstract: Embodiments of the present disclosure generally provide a digital lithography system that can process both large area substrates as well as semiconductor device substrates, such as wafers. Both the large area substrates and the semiconductor device substrates can be processed in the same system simultaneously. Additionally, the system can accommodate different levels of exposure for forming the features over the substrates. For example, the system can accommodate very precise feature patterning as well as less precise feature patterning. The different exposures can occur in the same chamber simultaneously. Thus, the system is capable of processing both semiconductor device substrates and large area substrates simultaneously while also accommodating very precise feature patterning simultaneous with less precise feature patterning.
    Type: Application
    Filed: December 11, 2018
    Publication date: August 1, 2019
    Inventors: Chien-Hua Lai, Ching-Chang Chen, Shih-Hao Kuo, Tsu-Hui Yang, Hsiu-Jen Wang, Yi-Sheng Liu, Chia-Hung Kao
  • Publication number: 20190114501
    Abstract: A target tracking method and system adaptable to multi-target tracking include performing global-search detection on a current image to obtain candidates of the current image. Association between the candidates and a tracked target is performed to determine similarity between the candidates and the tracked target and to give corresponding similarity values to the candidates. The candidate with a maximum similarity value is defined as an associated candidate of the tracked target. Candidates with non-zero similarity values and primary-object classification other than the associated candidate are filtered out and defined as filtered candidates. New tracked targets are generated according to the associated candidate and the filtered candidates.
    Type: Application
    Filed: November 28, 2017
    Publication date: April 18, 2019
    Inventors: Shih-Hao Kuo, Ming-Che Ho