Abstract: Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The structure includes a source/drain region disposed over a substrate, a first interlayer dielectric layer surrounding a first portion of the source/drain region, a second interlayer dielectric layer distinct from the first interlayer dielectric layer surrounding a second portion of the source/drain region, a silicide layer disposed on the source/drain region, and a conductive contact disposed over the source/drain region. The conductive contact is disposed in the second interlayer dielectric layer.

Abstract: A method includes: forming a first plurality of tiers that each comprises first and second dummy layers over a substrate, wherein within each tier, the second dummy layer is disposed above the first dummy layer; forming a second plurality of recessed regions in the first plurality of tiers, wherein at least one subgroup of the second plurality of recessed regions extend through respective different numbers of the second dummy layers; and performing an etching operation to concurrently forming a third plurality of trenches with respective different depths in the substrate through the at least one subgroup of the second plurality of recessed regions.

Abstract: A memory includes: a dielectric fin formed over a substrate; and a pair of memory cells disposed along respective sidewalls of the dielectric fin, each of the pair of memory cells comprising: a first conductor layer; a selector layer; a resistive material layer; and a second conductor layer, wherein the first conductor layer, selector layer, resistive material layer, and second conductor layer each includes upper and lower boundaries, and at least one of the upper and lower boundaries is tilted away from one of the sidewalls of the dielectric fin by an angle.

Abstract: In an embodiment, a device includes: an integrated circuit die; a through via adjacent the integrated circuit die; a molding compound encapsulating the integrated circuit die and the through via; and a redistribution structure including: a first conductive via extending through a first dielectric layer, the first conductive via electrically connected to the integrated circuit die, the first dielectric layer being over the integrated circuit die, the through via, and the molding compound; and a first conductive line over the first dielectric layer and the first conductive via, the first conductive via extending into the first conductive line.

Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

Abstract: Exemplary methods of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. The methods may include transferring the substrate to a metrology station. The methods may include measuring a topology of the substrate at the metrology station. The methods may include applying a first chucking force to the substrate to flatten the substrate. The methods may include generating a mapping of a die pattern on an exposed surface of the substrate. The methods may include transferring the substrate to a printing station. The methods may include applying a second chucking force to the substrate to flatten the substrate against a surface of the printing station. The methods may include adjusting a printing pattern based on the mapping of the die pattern. The methods may include printing the printing pattern on the exposed surface of the substrate.

Abstract: Actual physical locations of dies on a substrate package may be identified without using a full metrology scan of the substrate. Instead, one or more cameras may be used to efficiently locate the approximate location of any of the alignment features based on their expected positioning in the design file for the packages are substrate. The cameras may then be moved to locations where alignment features should be, and images may be captured to determine the actual location of the alignment feature. These actual locations of the alignment features may then be used to identify coordinates for the dies, as well as rotations and/or varying heights of the dies on the packages. A difference between the expected location from the design file and the actual physical location may be used to adjust instructions for the digital lithography system to compensate for the misalignment of the dies.

Abstract: The present disclosure provides a multi-substrate handling system having an alignment apparatus capable of positioning each of a set of substrates in predetermined orientations for transfer. A buffer chamber is configured to receive and condition the set of substrates which are disposed on a substrate carrier. A first transfer assembly is configured to transfer the set of substrates to and from the buffer chamber and is capable of transferring each of the set of substrates from the alignment apparatus to the carrier in the buffer chamber. The carrier includes a plurality of modules capable of securing the set of substrates. The system includes a second transfer assembly having at least two robots configured to transfer the carrier of the set of substrates between the buffer chamber and a process chamber. The process chamber is capable of processing the set of substrates using different process parameters for each substrate.

Abstract: An object detection method, an electronic apparatus and an object detection system are provided. The method is adapted to the electronic apparatus and includes the following steps. A first image is obtained. A geometric transformation operation is performed on the first image to obtain at least one second image. The first image and the at least one second image are combined to generate a combination image. The combination image including the first image and the at least one second image is inputted into a trained deep learning model to detect a target object.

Abstract: A light-emitting diode apparatus and a control method of the light-emitting diode apparatus are provided. The control method includes: applying a pre-reset voltage to a control terminal of a driving transistor of the light-emitting diode apparatus in a pre-resetting stage to pre-reset the control terminal of the driving transistor; resetting the control terminal of the driving transistor of the light-emitting diode apparatus by using a reset voltage source in a first resetting stage; compensating the control terminal of the driving transistor to a compensation voltage in a compensation stage; and providing, by the driving transistor, a driving current in a light emission stage to drive a light-emitting diode of the light-emitting diode apparatus to emit light.

Abstract: An object detection method, an electronic apparatus and an object detection system are provided. The method is adapted to the electronic apparatus and includes the following steps. A first image is obtained. A geometric transformation operation is performed on the first image to obtain at least one second image. The first image and the at least one second image are combined to generate a combination image. The combination image including the first image and the at least one second image is inputted into a trained deep learning model to detect a target object.

Abstract: A posture determination method applicable to an electronic system including an image capturing device is provided. The image capturing device is set up corresponding to a target. The posture determination method includes: acquiring a plurality of consecutive images captured by the image capturing device; performing a motion detection on the consecutive images; determining whether an image content of the consecutive images is static after a movement according to a detection result of the motion detection; and determining a posture of the target when the image content is static after the movement. In addition, the electronic system and a non-transitory computer-readable recording medium using the method are also provided.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: A target tracking method and system adaptable to multi-target tracking include performing global-search detection on a current image to obtain candidates of the current image. Association between the candidates and a tracked target is performed to determine similarity between the candidates and the tracked target and to give corresponding similarity values to the candidates. The candidate with a maximum similarity value is defined as an associated candidate of the tracked target. Candidates with non-zero similarity values and primary-object classification other than the associated candidate are filtered out and defined as filtered candidates. New tracked targets are generated according to the associated candidate and the filtered candidates.

Abstract: Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.

Abstract: A light-emitting diode apparatus and a control method of the light-emitting diode apparatus are provided. The control method includes: applying a pre-reset voltage to a control terminal of a driving transistor of the light-emitting diode apparatus in a pre-resetting stage to pre-reset the control terminal of the driving transistor; resetting the control terminal of the driving transistor of the light-emitting diode apparatus by using a reset voltage source in a first resetting stage; compensating the control terminal of the driving transistor to a compensation voltage in a compensation stage; and providing, by the driving transistor, a driving current in a light emission stage to drive a light-emitting diode of the light-emitting diode apparatus to emit light.

Abstract: Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.