Patents by Inventor Shih-Hao Liao

Shih-Hao Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Benzoxazine resin, composition thereof and copper clad laminate made thereof
    Patent number: 12227637
    Abstract: A benzoxazine resin, including a compound of the following Formula 1-1: where R1, R2, and R3 are as defined herein.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: February 18, 2025
    Assignee: A.C.R. TECH CO., LTD.
    Inventors: Shih-Hao Liao, Min-Yuan Yang, Ya-Yen Chou, Jheng-Hong Ciou, Cheng-Chung Chen
  • Resin, composition thereof and copper clad laminate made thereof
    Patent number: 12227646
    Abstract: A resin, including a compound having the following Formula 1-1: wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: February 18, 2025
    Assignee: A.C.R. TECH CO., LTD.
    Inventors: Shih-Hao Liao, Min-Yuan Yang, Ya-Yen Chou, Jheng-Hong Ciou, Cheng-Chung Chen
  • Resin, copper clad laminate made of resin, and printed circuit board
    Patent number: 11773262
    Abstract: A resin comprises at least one compound selected from one of the following formulas
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: October 3, 2023
    Assignee: A.C.R. TECH CO., LTD.
    Inventors: Shih-Hao Liao, Min-Yuan Yang, Ya-Yen Chou, Jheng-Hong Ciou, Cheng-Chung Chen
  • BENZOXAZINE RESIN, COMPOSITION THEREOF AND COPPER CLAD LAMINATE MADE THEREOF
    Publication number: 20230193016
    Abstract: A benzoxazine resin, including a compound of the following Formula 1-1: where R1, R2, and R3 are as defined herein.
    Type: Application
    Filed: December 6, 2022
    Publication date: June 22, 2023
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN
  • RESIN, COMPOSITION THEREOF AND COPPER CLAD LAMINATE MADE THEREOF
    Publication number: 20230193027
    Abstract: A resin, including a compound having the following Formula 1-1: wherein n ranges from 1 to 5, and R1, R2, R3 and R4 are as defined herein.
    Type: Application
    Filed: December 5, 2022
    Publication date: June 22, 2023
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN
  • RESIN, COPPER CLAD LAMINATE MADE OF RESIN, AND PRINTED CIRCUIT BOARD
    Publication number: 20200263031
    Abstract: A resin comprises at least one compound selected from one of the following formulas.
    Type: Application
    Filed: December 16, 2019
    Publication date: August 20, 2020
    Inventors: Shih-Hao LIAO, Min-Yuan YANG, Ya-Yen CHOU, Jheng-Hong CIOU, Cheng-Chung CHEN
  • Semiconductor device and method
    Patent number: 10304700
    Abstract: A semiconductor device and method that comprise a first dielectric layer over a encapsulant that encapsulates a via and a semiconductor die is provided. A redistribution layer is over the first dielectric layer, and a second dielectric layer is over the redistribution layer, and the second dielectric layer comprises a low-temperature polyimide material.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 28, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zi-Jheng Liu, Yu-Hsiang Hu, Jo-Lin Lan, Shih-Hao Liao, Chen-Cheng Kuo, Hung-Jui Kuo, Chung-Shi Liu, Chen-Hua Yu, Meng-Wei Chou
  • Stable solution of the polymer prepared from N,O-heterocycles and its preparation method and use
    Patent number: 8580916
    Abstract: A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: November 12, 2013
    Assignee: Taiwan Union Technology Corporation
    Inventors: Shih-Hao Liao, Chih-Wei Liao, Hsuan-Hao Hsu, Hsien-Te Chen, Tsung-Hsien Lin
  • Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same
    Publication number: 20120097437
    Abstract: A resin composition is provided.
    Type: Application
    Filed: January 14, 2011
    Publication date: April 26, 2012
    Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Shih-Hao Liao, Chih-Wei Liao, Hsuan-Hao Hsu, Hsien-Te Chen, Tsung-Hsien Lin
  • Stable Solution of the Polymer Prepared from N,O-Heterocycles and its Preparation Method and Use
    Publication number: 20120059096
    Abstract: A stable solution of the polymer prepared from N,O-heterocyclic compound and its preparing method are provided, wherein the stable solution is prepared by making the N,O-heterocyclic compound of formulae I or II carry out a ring-opening polymerization: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification. The stable solution can be used as a hardener for curing epoxy resin.
    Type: Application
    Filed: December 13, 2010
    Publication date: March 8, 2012
    Applicant: Taiwan Union Technology Corporation
    Inventors: Shih-Hao Liao, Chih-Wei Liao, Hsuan-Hao Hsu, Hsien-Te Chen, Tsung-Hsien Lin