Abstract: A network entity and a resource arrangement method are provided. In the method, a resource use condition of a radio resource is obtained. The radio resource is configured with multiple subcarriers. A subcarrier spacing between the subcarriers is adjusted according to the resource use condition.

Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.

Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

Abstract: A moored balloon includes a balloon, a wire coupled to the balloon, an antenna, a cable coupled to the balloon, a rotating device hung below the balloon, and a fixing device. The rotating device comprises a rotating unit and a bracket. The rotating unit comprises a bearing seat mounted on the bracket, a bearing unit mounted on the bearing seat, and a shaft passing through the bearing unit and coupled to the balloon. The fixing device comprises a receiving tube for receiving the antenna. The receiving tube is located on the bracket. The shaft moves with the balloon to generate a twisting force, the bearing unit counterbalances the twisting force to prevent the cable being twisted with the wires.

Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.

Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.

Abstract: A moored balloon includes a balloon, a wire coupled to the balloon, an antenna, a cable coupled to the balloon, a rotating device hung below the balloon, and a fixing device. The rotating device comprises a rotating unit and a bracket. The rotating unit comprises a bearing seat mounted on the bracket, a bearing unit mounted on the bearing seat, and a shaft passing through the bearing unit and coupled to the balloon. The fixing device comprises a receiving tube for receiving the antenna. The receiving tube is located on the bracket. The shaft moves with the balloon to generate a twisting force, the bearing unit counterbalances the twisting force to prevent the cable being twisted with the wires.

Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.

Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.

Abstract: A semiconductor package is disclosed, which includes: a first substrate; a first semiconductor component disposed on the first substrate; a second substrate disposed on the first semiconductor component and electrically connected to the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate and encapsulating the first semiconductor component and the conductive elements. The present invention can control the height and volume of the conductive elements since the distance between the first substrate and the second substrate is fixed by bonding the second substrate to the first semiconductor component.

Abstract: A gateway connects to a communication device, and communicates with a voice communication server through a network. When the communication device requests to establish a voice communication with a third-party communication terminal, the gateway parses the request to calculate a network bandwidth sufficient to establish the voice communication, and then requests the voice communication server to allocate the required network bandwidth for establishing the voice communication. Then voice data streaming sent from the communication device and the third-party communication terminal are respectively processed to generate RTP packets. The RTP packets are transmitted between the communication device and the third-party communication terminal, so as to realize the voice communication between the communication device and third-party communication terminal.

Abstract: A gateway device and method for establishing Voice over Internet Protocol (VoIP) communication includes setting coding methods of the VoIP, and setting quality of service (QoS) parameters corresponding to each coding method. In response to dialing a VoIP phone call from a local user terminal, a Session Initiation Protocol (SIP) session is initiated to determine a coding method. QoS parameters corresponding to the determined coding method are parsed to generate a request packet. The request packet is sent to base station to request for establishing a VoIP phone call. The VoIP phone call is established between the local user terminal and a remote user terminal by sending the VoIP packets through the base station to the remote user terminal.

Abstract: A gateway device and method for establishing Voice over Internet Protocol (VoIP) communication includes setting coding methods of the VoIP, and setting quality of service (QoS) parameters corresponding to each coding method. In response to dialing a VoIP phone call from a local user terminal, a Session Initiation Protocol (SIP) session is initiated to determine a coding method. QoS parameters corresponding to the determined coding method are parsed to generate a request packet. The request packet is sent to base station to request for establishing a VoIP phone call. The VoIP phone call is established between the local user terminal and a remote user terminal by sending the VoIP packets through the base station to the remote user terminal.