Patents by Inventor SHIH-HAO TUNG

SHIH-HAO TUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220400488
    Abstract: A network entity and a resource arrangement method are provided. In the method, a resource use condition of a radio resource is obtained. The radio resource is configured with multiple subcarriers. A subcarrier spacing between the subcarriers is adjusted according to the resource use condition.
    Type: Application
    Filed: September 10, 2021
    Publication date: December 15, 2022
    Applicant: Lite-On Technology Corporation
    Inventors: Han-Sheng Hung, Shih-Hao Tung
  • Patent number: 10163662
    Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.
    Type: Grant
    Filed: April 4, 2017
    Date of Patent: December 25, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Cheng-Chia Chiang, Don-Son Jiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang
  • Publication number: 20180138158
    Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.
    Type: Application
    Filed: January 11, 2018
    Publication date: May 17, 2018
    Inventors: Shih-Hao Tung, Chang-Yi Lan, Lung-Yuan Wang, Cheng-Chia Chiang, Shu-Huei Huang
  • Patent number: 9905546
    Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: February 27, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shih-Hao Tung, Chang-Yi Lan, Lung-Yuan Wang, Cheng-Chia Chiang, Chu-Huei Huang
  • Patent number: 9731806
    Abstract: A moored balloon includes a balloon, a wire coupled to the balloon, an antenna, a cable coupled to the balloon, a rotating device hung below the balloon, and a fixing device. The rotating device comprises a rotating unit and a bracket. The rotating unit comprises a bearing seat mounted on the bracket, a bearing unit mounted on the bearing seat, and a shaft passing through the bearing unit and coupled to the balloon. The fixing device comprises a receiving tube for receiving the antenna. The receiving tube is located on the bracket. The shaft moves with the balloon to generate a twisting force, the bearing unit counterbalances the twisting force to prevent the cable being twisted with the wires.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: August 15, 2017
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Shih-Hao Tung, Chien-Hung Lee, Feng-Ching Su, Cheng-Yi Lai, Tzu-Hsiu Hung
  • Publication number: 20170207104
    Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.
    Type: Application
    Filed: April 4, 2017
    Publication date: July 20, 2017
    Inventors: Cheng-Chia Chiang, Don-Son Jiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang
  • Patent number: 9646921
    Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.
    Type: Grant
    Filed: April 17, 2014
    Date of Patent: May 9, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Cheng-Chia Chiang, Don-Son Jiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang
  • Publication number: 20160121991
    Abstract: A moored balloon includes a balloon, a wire coupled to the balloon, an antenna, a cable coupled to the balloon, a rotating device hung below the balloon, and a fixing device. The rotating device comprises a rotating unit and a bracket. The rotating unit comprises a bearing seat mounted on the bracket, a bearing unit mounted on the bearing seat, and a shaft passing through the bearing unit and coupled to the balloon. The fixing device comprises a receiving tube for receiving the antenna. The receiving tube is located on the bracket. The shaft moves with the balloon to generate a twisting force, the bearing unit counterbalances the twisting force to prevent the cable being twisted with the wires.
    Type: Application
    Filed: October 30, 2015
    Publication date: May 5, 2016
    Inventors: SHIH-HAO TUNG, CHIEN-HUNG LEE, FENG-CHING SU, CHENG-YI LAI, TZU-HSIU HUNG
  • Publication number: 20150187722
    Abstract: A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof; a plurality of conductive posts formed on the second conductive pads, respectively; and a first encapsulant formed on the first surface of the packaging substrate for encapsulating the chip and the conductive posts and having a plurality of openings for exposing upper surfaces of the conductive posts, thereby increasing the package density and protecting the chip and the interconnection structure from being adversely affected by intrusion of moisture.
    Type: Application
    Filed: April 17, 2014
    Publication date: July 2, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Chia Chiang, Don-Son Jiang, Lung-Yuan Wang, Shih-Hao Tung, Shu-Huei Huang
  • Publication number: 20150187741
    Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.
    Type: Application
    Filed: March 14, 2014
    Publication date: July 2, 2015
    Applicant: Siliconware Precision Industries Co., Ltd
    Inventors: Shih-Hao Tung, Chang-Yi Lan, Lung-Yuan Wang, Cheng-Chia Chiang, Chu-Huei Huang
  • Publication number: 20150041972
    Abstract: A semiconductor package is disclosed, which includes: a first substrate; a first semiconductor component disposed on the first substrate; a second substrate disposed on the first semiconductor component and electrically connected to the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate and encapsulating the first semiconductor component and the conductive elements. The present invention can control the height and volume of the conductive elements since the distance between the first substrate and the second substrate is fixed by bonding the second substrate to the first semiconductor component.
    Type: Application
    Filed: April 10, 2014
    Publication date: February 12, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chia-Kai Shih, Lung-Yuan Wang, Cheng-Chia Chiang, Chu-Chi Hsu, Shih-Hao Tung
  • Publication number: 20140050214
    Abstract: A gateway connects to a communication device, and communicates with a voice communication server through a network. When the communication device requests to establish a voice communication with a third-party communication terminal, the gateway parses the request to calculate a network bandwidth sufficient to establish the voice communication, and then requests the voice communication server to allocate the required network bandwidth for establishing the voice communication. Then voice data streaming sent from the communication device and the third-party communication terminal are respectively processed to generate RTP packets. The RTP packets are transmitted between the communication device and the third-party communication terminal, so as to realize the voice communication between the communication device and third-party communication terminal.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 20, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Shih-Hao TUNG, Li-Jen HSU, Shih-Min HU
  • Patent number: 8457011
    Abstract: A gateway device and method for establishing Voice over Internet Protocol (VoIP) communication includes setting coding methods of the VoIP, and setting quality of service (QoS) parameters corresponding to each coding method. In response to dialing a VoIP phone call from a local user terminal, a Session Initiation Protocol (SIP) session is initiated to determine a coding method. QoS parameters corresponding to the determined coding method are parsed to generate a request packet. The request packet is sent to base station to request for establishing a VoIP phone call. The VoIP phone call is established between the local user terminal and a remote user terminal by sending the VoIP packets through the base station to the remote user terminal.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: June 4, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Shih-Hao Tung
  • Publication number: 20120044820
    Abstract: A gateway device and method for establishing Voice over Internet Protocol (VoIP) communication includes setting coding methods of the VoIP, and setting quality of service (QoS) parameters corresponding to each coding method. In response to dialing a VoIP phone call from a local user terminal, a Session Initiation Protocol (SIP) session is initiated to determine a coding method. QoS parameters corresponding to the determined coding method are parsed to generate a request packet. The request packet is sent to base station to request for establishing a VoIP phone call. The VoIP phone call is established between the local user terminal and a remote user terminal by sending the VoIP packets through the base station to the remote user terminal.
    Type: Application
    Filed: December 27, 2010
    Publication date: February 23, 2012
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: SHIH-HAO TUNG