Patents by Inventor Shih-Hsi Yen

Shih-Hsi Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR ASSEMBLING MEMORY MODULE WITH HEAT DISSIPATING SHEET AND APPARATUS THEREOF
    Publication number: 20100188820
    Abstract: A method for assembling memory module with heat dissipating sheet includes the flowing steps: providing a heat dissipating sheet; providing a memory module having a circuit board and at least one chip arranged on the circuit board; arranging the circuit board perpendicularly on the heat dissipating sheet; and folding at least a part of the heat dissipating sheet toward the chip and adhering the part of the heat dissipating sheet to the chip by the glue. Besides, an apparatus which the method of the present invention could perform on is also provided.
    Type: Application
    Filed: January 27, 2009
    Publication date: July 29, 2010
    Inventors: Wei-Hau CHEN, Shih-Hsi Yen
  • Heat sink for read only memory device
    Patent number: D609199
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: February 2, 2010
    Assignee: Comptake Technology Inc.
    Inventors: Wei-Hau Chen, Shih-Hsi Yen
  • Heat sink for read only memory device
    Patent number: D610557
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: February 23, 2010
    Assignee: Comptake Technology Inc.
    Inventors: Wei-Hau Chen, Shih-Hsi Yen