Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A testing device includes a connecting module and a processor electrically connected to the connecting module. The connecting module is electrically coupled with a plurality of communication devices under tests (DUTs) synchronously. The processor determines a schedule for the communication DUTs and tests the communication DUTs according to the schedule. A testing method is applied to the testing device to implement the operations.

Abstract: A testing device of a signaling mode and a testing method thereof are provided. The testing device includes a connecting module and a processor electrically connected to the connecting module. The connecting module is configured to electrically couple with a plurality of communication devices under tests (DUTs) simultaneously. The processor is configured to execute a network attaching procedure between the testing device and each of the communication DUTs, wherein the network attaching procedures are overlapped to be executed. The processor is further configured to test the communication DUTs after executing the network attaching procedures.

Abstract: A testing device and a testing method are provided. The testing device includes a connecting module and a processor electrically connected to the connecting module. The connecting module is electrically coupled with a plurality of communication devices under tests (DUTs) synchronously. The processor determines a schedule for the communication DUTs and tests the communication DUTs according to the schedule. The testing method is applied to the testing device to implement the aforesaid operations.