Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.

Abstract: A filter and a layout structure of the filter are provided. The filter includes a substrate, three capacitors, and three inductors. The three capacitors and the first and second inductors are disposed on a top surface of the substrate. The third inductor is disposed on a lateral surface of the substrate. First electrodes of the first and third capacitors and a first terminal of the first inductor are connected to a first I/O terminal of the filter. A first electrode of the second capacitor, a second electrode of the third capacitor and a first terminal of the second inductor are connected to a second I/O terminal of the filter. A first terminal of the third inductor is connected to second electrodes of the first and second capacitors.

Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.

Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.

Abstract: A network communication device is disclosed. The network communication device includes a circuit board, a network connector, a network chip and a plurality of network magnetic assemblies. The network connector, the network chip and the network magnetic assemblies are disposed on the circuit board. The network magnetic assemblies are electrically connected with the network connector and the network chip, respectively. Each of the network magnetic assemblies includes an Ethernet transformer and at least one inductor. The Ethernet transformer is electrically connected in series with the inductor via a conductive trace of the circuit board. The spaced distance or a path length of the conductive trace between the Ethernet transformer and the inductor of the at least one network magnetic assembly is less than a first specific length.

Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.

Abstract: The present invention discloses a substrate-less electronic component. A conductive element is disposed in the plurality of insulating layers, wherein the plurality of insulating layers are not supported by a substrate. The substrate-less electronic component can be manufactured by performing film process on a plurality of conductive layers or insulating layers on the substrate before the substrate is removed. In one embodiment, a buffer layer can be formed on the substrate. After the process is done, the buffer layer can be easily removed to decouple the substrate from the layers on the substrate.

Abstract: A monolithic power splitter is used to split a pair of input differential signals into two pairs of output differential signals in the present invention. The monolithic power splitter has two input terminals to receive a pair of input differential signals, and it has two one-by-two power splitters integrated in one single chip to split a pair of input differential signals into two pairs of output differential signals with equal power. And, the monolithic power splitter has four output terminals to output two pairs of output differential signals. In one embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on the same surface of the substrate. In another embodiment, the first one-by-two power splitter and the second one-by-two power splitter are made on opposite surfaces of the substrate. The monolithic power splitter can be used as a power combiner based on the reciprocal property of the power splitter circuit.

Abstract: An oxide semiconductor thin film transistor structure includes a substrate, a gate electrode disposed on the substrate, a semiconductor insulating layer disposed on the substrate and the gate electrode, an oxide semiconductor layer disposed on the semiconductor insulating layer, a patterned semiconductor layer disposed on the oxide semiconductor layer, and a source electrode and a drain electrode respectively disposed on the patterned semiconductor layer. The source electrode and the drain electrode are made of a metal layer.

Abstract: A method of producing an inductor with high inductance includes forming a removable polymer layer on a temporary carrier; forming a structure including a first coil, a second coil, and a dielectric layer on the removable polymer layer; forming a first magnetic glue layer on the removable polymer layer and the structure; removing the temporary carrier; and forming a second magnetic glue layer below the structure and the first magnetic glue layer.

Abstract: A filter and a layout structure of the filter are provided. The filter includes a substrate, three capacitors, and three inductors. The three capacitors and the first and second inductors are disposed on a top surface of the substrate. The third inductor is disposed on a lateral surface of the substrate. First electrodes of the first and third capacitors and a first terminal of the first inductor are connected to a first I/O terminal of the filter. A first electrode of the second capacitor, a second electrode of the third capacitor and a first terminal of the second inductor are connected to a second I/O terminal of the filter. A first terminal of the third inductor is connected to second electrodes of the first and second capacitors.

Abstract: An image display device capable of being produced with reduced manufacturing cost, and improved product performance. The image display device comprises: an LCD module, conjoint substrate, at least one driving circuit and a plurality of contacts, wherein the LCD module includes at least one liquid crystal layer and one transparent electrode, for displaying images in accompaniment with the a plurality of electrodes provided on the upper surface of the conjoint substrate, each pixel electrode being connected to a predetermined location at a lower surface of the conjoint substrate through at least one conductive route and then to driving transistors provided in the driving circuit through the contacts, so as to preserve the superior performance of active matrix displays while improving the production yield and reducing the manufacturing cost of the final products. Also disclosed are process of making and using and products comprising the image display device.

Abstract: A liquid crystal display device (LCD), and particularly to a liquid crystal display which has reduced production cost and enhanced performance. The LCD comprises an optical module, a control module and a backlight module. The optical module is fabricated with known liquid crystal manufacturing process to provide at least a liquid crystal layer and a plurality of pixel unit electrodes, which are provided with a pixel electrode transparent area and a pixel electrode reflective area respectively. The control module is fabricated with known semiconductor manufacturing process. Further, using a plurality of conductive plugs disposed at preset positions, the backlight module is electrically connected to the pixel unit electrodes of optical module and the control circuit devices of the control module. The structure of the present invention resulting enhanced performance of the product, production yield and reliability, and reduced production cost.

Abstract: An integrated circuit device has a substrate, an interconnection level, a shielding level and a plurality of stitching studs. The substrate has a plurality of active devices, and the stitching studs pass through the substrate. The interconnection level is on the substrate, having a plurality of metal lines to provide interconnections between the active devices with a plurality of plugs. The shielding level is on the interconnection level, having an electromagnetic shielding pattern. The electromagnetic shielding pattern, the plugs, and the stitching studs are connected to form an electromagnetic shielding housing of the integrated circuit device.

Abstract: The thin image pickup device has a substrate, an electromagnetic receiving area thereon as photoelectric converting elements, a peripheral circuit, and embedded trenches passing through the substrate and filled with conductive materials for forming stitching plugs. The stitching studs are formed from the stitching plugs after a lower surface of the substrate being thinned, and serve as electrode connecting terminals of the image pickup device.