Patents by Inventor Shih-Hsien Wen

Shih-Hsien Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237218
    Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Ting Chung, Shih-Wei Yeh, Kai-Chieh Yang, Yu-Ting Wen, Yu-Chen Ko, Ya-Yi Cheng, Min-Hsiu Hung, Chun-Hsien Huang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 9348462
    Abstract: Techniques are described for tracking and recognizing gestures performed within a field-of-view of a sensor. In one or more implementations, the techniques may be implemented within an electronic device that is configured to receive a signal from a sensor in response to the sensor detecting a gesture occurring within a field of view of the sensor. A lens is positioned over the sensor to collimate light incident on the lens and to pass the collimated light to the sensor. The electronic device is configured to generate one or more light intensity ratios based upon the signal. The electronic device is then configured to determine a type of gesture performed based upon the one or more light intensity ratios.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: May 24, 2016
    Assignee: Maxim Integrated Products, Inc.
    Inventor: Shih-Hsien Wen
  • Publication number: 20130335225
    Abstract: Techniques are described for tracking and recognizing gestures performed within a field-of-view of a sensor. In one or more implementations, the techniques may be implemented within an electronic device that is configured to receive a signal from a sensor in response to the sensor detecting a gesture occurring within a field of view of the sensor. A lens is positioned over the sensor to collimate light incident on the lens and to pass the collimated light to the sensor. The electronic device is configured to generate one or more light intensity ratios based upon the signal. The electronic device is then configured to determine a type of gesture performed based upon the one or more light intensity ratios.
    Type: Application
    Filed: June 13, 2012
    Publication date: December 19, 2013
    Applicant: MAXIM INTEGRATED PRODUCTS, INC.
    Inventor: Shih-Hsien Wen
  • Patent number: 5345059
    Abstract: An electrically-heated spoon including a flat heating device made of a plate-like positive temperature coefficient (PTC) resistor having a periphery side wall of the spoon mounted to the periphery and a handle of the spoon extending from the side wall. A pair of conductive wires in electrical connection with the heating device are embedded in the handle and extend out of a remote end of the handle to define an external connector for connection to an external power source. The plate-like positive temperature coefficient resistor is sandwiched between two insulating plates and then encased by two opposite metal casing members with the conductive wires, which are connected to the resistor, extending through openings formed on the casing members for connection to a power source.
    Type: Grant
    Filed: August 2, 1993
    Date of Patent: September 6, 1994
    Inventor: Shih-Hsien Wen