Patents by Inventor Shih Hsien Yang

Shih Hsien Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250110307
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Inventors: Chao-Chang HU, Chih-Wei WENG, Chia-Che WU, Chien-Yu KAO, Hsiao-Hsin HU, He-Ling CHANG, Chao-Hsi WANG, Chen-Hsien FAN, Che-Wei CHANG, Mao-Gen JIAN, Sung-Mao TSAI, Wei-Jhe SHEN, Yung-Ping YANG, Sin-Hong LIN, Tzu-Yu CHANG, Sin-Jhong SONG, Shang-Yu HSU, Meng-Ting LIN, Shih-Wei HUNG, Yu-Huai LIAO, Mao-Kuo HSU, Hsueh-Ju LU, Ching-Chieh HUANG, Chih-Wen CHIANG, Yu-Chiao LO, Ying-Jen WANG, Shu-Shan CHEN, Che-Hsiang CHIU
  • Patent number: 12266703
    Abstract: An interconnect fabrication method is disclosed herein that utilizes a disposable etch stop hard mask over a gate structure during source/drain contact formation and replaces the disposable etch stop hard mask with a dielectric feature (in some embodiments, dielectric layers having a lower dielectric constant than a dielectric constant of dielectric layers of the disposable etch stop hard mask) before gate contact formation. An exemplary device includes a contact etch stop layer (CESL) having a first sidewall CESL portion and a second sidewall CESL portion separated by a spacing and a dielectric feature disposed over a gate structure, where the dielectric feature and the gate structure fill the spacing between the first sidewall CESL portion and the second sidewall CESL portion. The dielectric feature includes a bulk dielectric over a dielectric liner. The dielectric liner separates the bulk dielectric from the gate structure and the CESL.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: April 1, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Che Lin, Po-Yu Huang, I-Wen Wu, Chen-Ming Lee, Chia-Hsien Yao, Chao-Hsun Wang, Fu-Kai Yang, Mei-Yun Wang
  • Patent number: 12237218
    Abstract: A method of fabricating a contact structure includes the following steps. An opening is formed in a dielectric layer. A conductive material layer is formed within the opening and on the dielectric layer, wherein the conductive material layer includes a bottom section having a first thickness and a top section having a second thickness, the second thickness is greater than the first thickness. A first treatment is performed on the conductive material layer to form a first oxide layer on the bottom section and on the top section of the conductive material layer. A second treatment is performed to remove at least portions of the first oxide layer and at least portions of the conductive material layer, wherein after performing the second treatment, the bottom section and the top section of the conductive material layer have substantially equal thickness.
    Type: Grant
    Filed: May 6, 2022
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Ting Chung, Shih-Wei Yeh, Kai-Chieh Yang, Yu-Ting Wen, Yu-Chen Ko, Ya-Yi Cheng, Min-Hsiu Hung, Chun-Hsien Huang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 12211787
    Abstract: A semiconductor structure and the manufacturing method thereof are disclosed. An exemplary semiconductor structure includes a first source/drain contact and a second source/drain contact spaced apart by a gate structure, an etch stop layer (ESL) over the first source/drain contact and the second source/drain contact, a conductive feature disposed in the etch stop layer and in direct contact with the first source/drain contact and the second source/drain contact, a dielectric layer over the etch stop layer, and a contact via extending through the dielectric layer and electrically connected to the conductive feature. By providing the conductive feature, a number of metal lines in an interconnect structure of the semiconductor structure may be advantageously reduced.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: January 28, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chao-Hsun Wang, Wang-Jung Hsueh, Fu-Kai Yang, Mei-Yun Wang, Sheng-Hsiung Wang, Shih-Hsien Huang
  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Publication number: 20240322859
    Abstract: The technology provides for a power line communication system capable of providing data from a first device to a second device over a power line. The first device may include a set of contacts and a second device may include a second set of contacts. The second set of contacts may be adapted to electronically engage with the first set of contacts of the first device to form at least a power and ground lines connection. Circuitry within the first device and the second device may include circuitry for providing data over the power line connection between the first device and the second device. The circuitry may comprise a power line, a ground line, a transmitter line carrying data signals, a capacitor coupling the transmitter line to the power line at a connection point, and a receiver comprising two field effect transistors.
    Type: Application
    Filed: May 31, 2024
    Publication date: September 26, 2024
    Applicant: Google LLC
    Inventors: Yuan Jen Chang, Shih-hsien Yang
  • Publication number: 20240265956
    Abstract: A memory chip includes a first decoding device and a memory device. The first decoding device is configured to generate multiple word line signals. The memory device is configured to generate a third data signal based on a first data signal and a second data signal. The memory device includes a first memory circuit and a second memory circuit. The first memory circuit is configured to generate the first data signal at a first node according to the word line signals during a first period. The second memory circuit is configured to generate the second data signal at a second node different from the first node according to the word line signals during a second period after the first period. A method of operating a memory chip is also disclosed herein.
    Type: Application
    Filed: April 15, 2024
    Publication date: August 8, 2024
    Inventors: Hsiang-Chi CHENG, Shyh-Bin KUO, Yi-Cheng LAl, Chung-Hung CHEN, Shih-Hsien YANG, Yu-Chih WANG, Kuo-Hsiang CHEN
  • Patent number: 12028127
    Abstract: The technology provides for a power line communication system capable of providing data from a first device to a second device over a power line. The first device may include a set of contacts and a second device may include a second set of contacts. The second set of contacts may be adapted to electronically engage with the first set of contacts of the first device to form at least a power and ground lines connection. Circuitry within the first device and the second device may include circuitry for providing data over the power line connection between the first device and the second device. The circuitry may comprise a power line, a ground line, a transmitter line carrying data signals, a capacitor coupling the transmitter line to the power line at a connection point, and a receiver comprising two field effect transistors.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: July 2, 2024
    Assignee: Google LLC
    Inventors: Yuan Jen Chang, Shih-Hsien Yang
  • Patent number: 11996165
    Abstract: A memory chip includes a first decoding device and a memory device. The first decoding device is configured to generate multiple word line signals. The memory device is configured to generate a third data signal based on a first data signal and a second data signal. The memory device includes a first memory circuit and a second memory circuit. The first memory circuit is configured to generate the first data signal at a first node according to the word line signals during a first period. The second memory circuit is configured to generate the second data signal at a second node different from the first node according to the word line signals during a second period after the first period. A method of operating a memory chip is also disclosed herein.
    Type: Grant
    Filed: May 17, 2022
    Date of Patent: May 28, 2024
    Assignee: AU OPTRONICS CORPORATION
    Inventors: Hsiang-Chi Cheng, Shyh-Bin Kuo, Yi-Cheng Lai, Chung-Hung Chen, Shih-Hsien Yang, Yu-Chih Wang, Kuo-Hsiang Chen
  • Publication number: 20230408712
    Abstract: The disclosure provides a light detection device and a detection method for controlling a light source device. The light detection device includes a detection panel and a processor. The detection panel converts an input light from the light source device into a converted light and converts the converted light into a charge. The processor selects a first region and a second region other than the first region from the detection panel. A first charge of the converted light received by at least one first pixel of the first region during a first period is used to detect a dose of the input light. A second charge of the converted light received by the second region during the first period is used to generate a data image. The charge of the converted light received by at least one first pixel during a second period is used to generate the data image.
    Type: Application
    Filed: May 2, 2023
    Publication date: December 21, 2023
    Applicant: InnoCare Optoelectronics Corporation
    Inventor: Shih-Hsien Yang
  • Publication number: 20230376434
    Abstract: The present disclosure provides systems and methods for activating a general purpose input/out (“GPIO”) pin. The system may include a control device, agency device, and a controlled device. The agency device may be part of the controlled device or it may be a separate device. The agency device may receive a communication signal transmitted from the control device. The agency device may count the number of pulses during a certain period of time to determine a GPIO pin to trigger on the controlled device.
    Type: Application
    Filed: August 26, 2020
    Publication date: November 23, 2023
    Applicant: Google LLC
    Inventors: Yuan Jen Chang, Shih-hsien Yang
  • Patent number: 11736856
    Abstract: An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: August 22, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Ching-Feng Lin, Chia-Chien Chen, Po-Cheng Huang, Shih-Hsien Yang, Cheng-Kun Chiang, Ching-Hsin Chen, Ching-Chieh Lin, Che-Hao Liao
  • Publication number: 20230154511
    Abstract: A memory chip includes a first decoding device and a memory device. The first decoding device is configured to generate multiple word line signals. The memory device is configured to generate a third data signal based on a first data signal and a second data signal. The memory device includes a first memory circuit and a second memory circuit. The first memory circuit is configured to generate the first data signal at a first node according to the word line signals during a first period. The second memory circuit is configured to generate the second data signal at a second node different from the first node according to the word line signals during a second period after the first period. A method of operating a memory chip is also disclosed herein.
    Type: Application
    Filed: May 17, 2022
    Publication date: May 18, 2023
    Inventors: Hsiang-Chi CHENG, Shyh-Bin KUO, Yi-Cheng LAI, Chung-Hung CHEN, Shih-Hsien YANG, Yu-Chih WANG, Kuo-Hsiang CHEN
  • Patent number: 11582551
    Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: February 14, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Chia-Chien Chen, Ching-Feng Lin, Po-Cheng Huang, Shih-Hsien Yang, Kuo-Lin Chao, Cheng-Chih Tai, Kuan-Yu Su, En-De Su, Cheng-Kun Chiang, Ke-Yu Lin, Ching-Hsin Chen
  • Patent number: 11553273
    Abstract: A passive diaphragm assembly includes a counterweight member, a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart from each other, are connected respectively to opposite ends of the counterweight member, and cooperate with the counterweight member to define an air space thereamong.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: January 10, 2023
    Assignee: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen, Po-Cheng Huang, Shih-Hsien Yang
  • Publication number: 20220173768
    Abstract: The technology provides for a power line communication system capable of providing data from a first device to a second device over a power line. The first device may include a set of contacts and a second device may include a second set of contacts. The second set of contacts may be adapted to electronically engage with the first set of contacts of the first device to form at least a power and ground lines connection. Circuitry within the first device and the second device may include circuitry for providing data over the power line connection between the first device and the second device. The circuitry may comprise a power line, a ground line, a transmitter line carrying data signals, a capacitor coupling the transmitter line to the power line at a connection point, and a receiver comprising two field effect transistors.
    Type: Application
    Filed: June 29, 2020
    Publication date: June 2, 2022
    Inventors: Yuan Jen Chang, Shih-hsien Yang
  • Publication number: 20220141574
    Abstract: A passive diaphragm assembly includes a counterweight member, a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart from each other, are connected respectively to opposite ends of the counterweight member, and cooperate with the counterweight member to define an air space thereamong.
    Type: Application
    Filed: September 15, 2021
    Publication date: May 5, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen Hong Wang, Ching Feng Lin, Chia Chien Chen, Po-Cheng Huang, Shih-Hsien Yang
  • Publication number: 20220141575
    Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.
    Type: Application
    Filed: October 25, 2021
    Publication date: May 5, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Chia-Chien Chen, Ching-Feng Lin, Po-Cheng Huang, Shih-Hsien Yang, Kuo-Lin Chao, Cheng-Chih Tai, Kuan-Yu Su, En-De Su, Cheng-Kun Chiang, Ke-Yu Lin, Ching-Hsin Chen
  • Publication number: 20220141570
    Abstract: An earphone device includes a speaker unit, an inner housing body and an outer housing body. The inner housing body covers the speaker unit through an insert molding technique. The outer housing body covers the inner housing body through the insert molding technique.
    Type: Application
    Filed: October 26, 2021
    Publication date: May 5, 2022
    Applicant: Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Wen-Hong Wang, Ching-Feng Lin, Chia-Chien Chen, Po-Cheng Huang, Shih-Hsien Yang, Cheng-Kun Chiang, Ching-Hsin Chen, Ching-Chieh Lin, Che-Hao Liao
  • Publication number: 20210014433
    Abstract: An image processing method includes setting a detection panel with an active region, acquiring raw image data by using the detection panel, partitioning the active region into a first region and a second region, discharging at least a part of the electrical charges in the first region by using a particular scanning process, acquiring calibration data through the detection panel, and calibrating the raw image data to generate calibrated image data according to the calibration data.
    Type: Application
    Filed: June 17, 2020
    Publication date: January 14, 2021
    Inventor: Shih-Hsien Yang