Abstract: A semiconductor device includes a substrate and a gate structure. The gate structure is disposed on the substrate, and the gate structure includes a titanium nitride barrier layer a titanium aluminide layer, and a middle layer. The titanium aluminide layer is disposed on the titanium nitride barrier layer, and the middle layer is disposed between the titanium aluminide layer and the titanium nitride barrier layer. The middle layer is directly connected with the titanium aluminide layer and the titanium nitride barrier layer, and the middle layer includes titanium and nitrogen. A concentration of nitrogen in the middle layer is gradually decreased in a vertical direction towards an interface between the middle layer and the titanium aluminide layer.

Abstract: A manufacturing method for micro components includes the steps of manufacturing a large component by molding and shaping a thermally contractible material; heating and cooling the large component, such that the size of the large component can be reduced by the contraction of the material to form a reduced component; duplicating the reduced component to obtain a mold; and manufacturing a further reduced component by the molding and shaping process of the mold. The manufacturing method simply requires the processes of duplicating the component, contracting the material with an equal contraction ratio, and preparing the mold, and thus the manufacturing method is simple, easy and fast. The method can overcome the shortcomings of the prior art, of which the precision and the freedom for the external design of the micro components cannot be controlled easily.

Abstract: A phosphor package of light emitting diodes includes a lens made of a transparent optical material, and a side of the lens with at least one phosphor containing groove corresponding to a light emitting diode chip. The concentration of the phosphor is adjusted before a required quantity of phosphor is adhered into the phosphor containing groove. The phosphor is baked and solidified. A gel is filled into the gap between the wire-bonded light emitting chip and the phosphor for binding with each other to complete the manufacturing process of a phosphor package; and such manufacturing process can effectively and accurately control the phosphor to achieve high quality stability and color uniformity.