Patents by Inventor Shih-Hsin Tseng

Shih-Hsin Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12113382
    Abstract: A charging control apparatus provides a supply power to first and second mobile devices. Each of the first and the second mobile device includes a mobile charging circuit and a battery. The charging control apparatus includes a switching power converter for converting an input power to the supply power, and a conversion control circuit for controlling the switching power converter according to the following steps: S1: controlling the switching power converter, so as to establish a current versus voltage characteristic curve corresponding to the supply power; and S2: determining a charging mode combinations of the first and the second mobile device and/or adjusting a supply voltage of the supply power to charge the battery of each mobile device according to the current versus voltage characteristic curve, so as to reduce a voltage drop of each mobile device as well as the power loss.
    Type: Grant
    Filed: November 6, 2021
    Date of Patent: October 8, 2024
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Shih-Hsin Tseng, Tseng-Chuan Wu, Po-Ching Lee
  • Publication number: 20240079884
    Abstract: A battery balancing system includes a voltage sensing unit, a characteristic voltage selector and a control unit. The voltage sensing unit senses a battery voltage of each of the batteries connected in series in a battery group and generates corresponding battery voltage sensing signals. The characteristic voltage selector generates a characteristic voltage according to the battery voltage sensing signals. The control unit compares the characteristic voltage with a threshold voltage in a balance operation mode, to adaptively adjust the threshold voltage, and compares the battery voltage sensing signal with the adjusted threshold voltage to generate a battery balancing command, thereby executing a charge removal balancing command or a charge supplying balancing command on the corresponding battery, or thereby cease executing the charge removal balancing command or cease executing the charge supplying balancing command on the corresponding battery.
    Type: Application
    Filed: July 23, 2023
    Publication date: March 7, 2024
    Inventors: Chung-Jen Chou, Chien-Chin Huang, Shih-Hsin Tseng
  • Publication number: 20220166230
    Abstract: A charging control apparatus provides a supply power to first and second mobile devices. Each of the first and the second mobile device includes a mobile charging circuit and a battery. The charging control apparatus includes a switching power converter for converting an input power to the supply power, and a conversion control circuit for controlling the switching power converter according to the following steps: S1: controlling the switching power converter, so as to establish a current versus voltage characteristic curve corresponding to the supply power; and S2: determining a charging mode combinations of the first and the second mobile device and/or adjusting a supply voltage of the supply power to charge the battery of each mobile device according to the current versus voltage characteristic curve, so as to reduce a voltage drop of each mobile device as well as the power loss.
    Type: Application
    Filed: November 6, 2021
    Publication date: May 26, 2022
    Inventors: Shih-Hsin Tseng, Tseng-Chuan Wu, Po-Ching Lee
  • Publication number: 20210210443
    Abstract: A multi-chip packaging structure employing millimeter wave includes a substrate material, a first and a second substrate board and an adhesive layer. The substrate material has a first metal pad. The first substrate board has a first and a second integrated circuit, multiple first metal wirings and multiple second metal pads, which are layer-by-layer stacked and electrically connected. The first and second metal pads are electrically connected via at least one metal lead. The adhesive layer is disposed between the substrate material and the first substrate board. The second substrate board has a third and a fourth integrated circuit, multiple second metal wirings and multiple third metal pads, which are layer-by-layer stacked and electrically connected. The electro-conductive boss blocks are respectively electrically connected with the second and third metal pads. Chips and antennas are integrated to integrate signal height and avoid interference and minify the volume.
    Type: Application
    Filed: January 2, 2020
    Publication date: July 8, 2021
    Inventors: Wei-Cheng Lin, Shih-Hsin Tseng, Chien-Jen Hsiao, Chung-Hsin Liu