Abstract: A sensing device includes a first substrate, a first sensing element, a first light-shielding layer, a second light-shielding layer and an insulating layer. The first sensing element is disposed on the first substrate. The first light-shielding layer is disposed on the first sensing element and has a first opening, wherein the first opening is completely overlapped with the first sensing element. The second light-shielding layer is disposed on the first light-shielding layer and includes an upper light-shielding part and a lateral light-shielding part, wherein the upper light-shielding part is overlapped with the first light-shielding layer and has a second opening, and the lateral light-shielding part is separated from the upper light-shielding part. The insulating layer is disposed between the first light-shielding layer and the second light-shielding layer, and the lateral light-shielding part covers a sidewall of the insulating layer.

Abstract: A sensing device includes a first substrate, a first sensing element, a first light-shielding layer, a second light-shielding layer and an insulating layer. The first sensing element is disposed on the first substrate. The first light-shielding layer is disposed on the first sensing element and has a first opening, wherein the first opening is completely overlapped with the first sensing element. The second light-shielding layer is disposed on the first light-shielding layer and includes an upper light-shielding part and a lateral light-shielding part, wherein the upper light-shielding part is overlapped with the first light-shielding layer and has a second opening, and the lateral light-shielding part is separated from the upper light-shielding part. The insulating layer is disposed between the first light-shielding layer and the second light-shielding layer, and the lateral light-shielding part covers a sidewall of the insulating layer.

Abstract: An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.

Abstract: A light emitting diode (LED) display panel is provided. The LED display panel includes a printed circuit board (PCB), a flexible substrate disposed on the PCB, and a pixel array. The flexible substrate has a plurality of holes. The pixel array is formed by a first matrix circuit disposed on the flexible substrate, a second matrix circuit disposed on the PCB, and a plurality of LEDs disposed on the PCB, collectively defining a plurality of pixels. Each of the pixels comprises a corresponding one of the LEDs and pixel circuits formed by the first matrix circuit and the second matrix circuit. A projection of each of the LEDs correspondingly overlaps with a projection of one of the holes on the flexible substrate along an extending direction of the holes. A mosaic LED display panel may be formed by multiple LED display panel butted or tiled together.

Abstract: An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.

Abstract: A tiled light emitting diode (LED) display panel includes multiple flexible back plates arranged in tiles. Each flexible back plate has multiple through holes formed thereon. A pixel array is formed by multiple LEDs on the flexible back plates and collectively defines multiple pixels. Each pixel includes one LED and thin-film transistor (TFT) circuits disposed on a first side of a corresponding flexible back plate. A printed circuit board (PCB) is disposed at a second side of the flexible back plates. A third side of the PCB faces the second side of the flexible back plates and has multiple signal lines formed thereon. The LEDs and the TFT circuits of the pixels are electrically connected to the corresponding signal lines via multiple conductive structures formed in the through holes. A resistance per unit length of each flexible back plates is greater than a resistance per unit length of the PCB.

Abstract: An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.

Abstract: A light emitting diode (LED) display panel is provided. The LED display panel includes a printed circuit board (PCB), a flexible substrate disposed on the PCB, and a pixel array. The flexible substrate has a plurality of holes. The pixel array is formed by a first matrix circuit disposed on the flexible substrate, a second matrix circuit disposed on the PCB, and a plurality of LEDs disposed on the PCB, collectively defining a plurality of pixels. Each of the pixels comprises a corresponding one of the LEDs and pixel circuits formed by the first matrix circuit and the second matrix circuit. A projection of each of the LEDs correspondingly overlaps with a projection of one of the holes on the flexible substrate along an extending direction of the holes. A mosaic LED display panel may be formed by multiple LED display panel butted or tiled together.

Abstract: A tiled light emitting diode (LED) display panel includes multiple flexible back plates arranged in tiles. Each flexible back plate has multiple through holes formed thereon. A pixel array is formed by multiple LEDs on the flexible back plates and collectively defines multiple pixels. Each pixel includes one LED and thin-film transistor (TFT) circuits disposed on a first side of a corresponding flexible back plate. A printed circuit board (PCB) is disposed at a second side of the flexible back plates. A third side of the PCB faces the second side of the flexible back plates and has multiple signal lines formed thereon. The LEDs and the TFT circuits of the pixels are electrically connected to the corresponding signal lines via multiple conductive structures formed in the through holes. A resistance per unit length of each flexible back plates is greater than a resistance per unit length of the PCB.

Abstract: A pixel structure includes a data line, a first scan line, first and second transistors, first and second power lines, LED elements, a connection pattern, a first insulation layer, and a first conductive pattern. Each of the first transistor and the second transistor has a first end, a control end, and second end. Each LED element has a first electrode and a second electrode. The second power line is electrically coupled to the first electrodes. The connection pattern is electrically coupled between the second end of the first transistor and the control end of the second transistor. The first conductive pattern is disposed above the first insulation layer and electrically coupled between the second electrodes, the second electrodes are electrically coupled to the second end of the second transistor through the first conductive pattern, and the connection pattern and the first conductive pattern are overlapped in an orthogonal projection direction.

Abstract: A light emitting device including a base, a first electrode, a barrier structure layer, a light emitting layer and a second electrode is provided. The barrier structure layer includes a first barrier layer in contact with the first electrode, a second barrier layer and a third barrier layer. The first barrier layer, the second barrier layer and the third barrier layer stack sequentially. The materials of the first barrier layer and the third barrier layer include a dielectric material. The material of the second barrier layer includes a metal material. A boundary between the third barrier layer and the second barrier layer keeps a vertical distance from the first electrode. The light emitting structure layer is disposed between the first electrode and the second electrode and surrounded by the barrier structure layer. The thickness of the light emitting structure layer is not greater than the vertical distance.

Abstract: An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.

Abstract: A pixel structure includes a data line, a first scan line, first and second transistors, first and second power lines, LED elements, a connection pattern, a first insulation layer, and a first conductive pattern. Each of the first transistor and the second transistor has a first end, a control end, and second end. Each LED element has a first electrode and a second electrode. The second power line is electrically coupled to the first electrodes. The connection pattern is electrically coupled between the second end of the first transistor and the control end of the second transistor. The first conductive pattern is disposed above the first insulation layer and electrically coupled between the second electrodes, the second electrodes are electrically coupled to the second end of the second transistor through the first conductive pattern, and the connection pattern and the first conductive pattern are overlapped in an orthogonal projection direction.

Abstract: A light emitting device including a base, a first electrode, a barrier structure layer, a light emitting layer and a second electrode is provided. The barrier structure layer includes a first barrier layer in contact with the first electrode, a second barrier layer and a third barrier layer. The first barrier layer, the second barrier layer and the third barrier layer stack sequentially. The materials of the first barrier layer and the third barrier layer include a dielectric material. The material of the second barrier layer includes a metal material. A boundary between the third barrier layer and the second barrier layer keeps a vertical distance from the first electrode. The light emitting structure layer is disposed between the first electrode and the second electrode and surrounded by the barrier structure layer. The thickness of the light emitting structure layer is not greater than the vertical distance.

Abstract: A display includes a first substrate, a second substrate, a plurality of pixels and a photo-catalyst layer. The plurality of pixels are disposed between the first substrate and the second substrate. The photo-catalyst layer is disposed above a surface of the second substrate facing the first substrate or above a surface of the first substrate facing the second substrate. Manufacturing methods of a display are additionally disclosed.

Abstract: A display includes a first substrate, a second substrate, a plurality of pixels and a photo-catalyst layer. The plurality of pixels are disposed between the first substrate and the second substrate. The photo-catalyst layer is disposed above a surface of the second substrate facing the first substrate or above a surface of the first substrate facing the second substrate. Manufacturing methods of a display are additionally disclosed.

Abstract: A flexible display panel includes a first flexible substrate, a second flexible substrate, a display medium, and a sealant. The first flexible substrate has a plurality of non-folding areas and at least one folding area located between the non-folding areas. The non-folding areas are separated. The second flexible substrate is configured above the first flexible substrate. The display medium is configured between the first flexible substrate and the second flexible substrate. The sealant is configured on the first flexible substrate to surround the display medium. The elasticity of the sealant in the folding area is greater than the elasticity of the sealant in the non-folding areas.

Abstract: A flexible electronic device includes a flexible film, an electronic element layer, and a protecting film, wherein the electronic element layer is disposed on a top surface of the flexible film, and the protecting film is disposed on the top surface of the flexible film and covers the electronic element layer. The protecting film has at least one side wall connected to the top surface of the flexible film to form an included angle between the side wall and the flexible film, wherein the included angle is an acute angle.

Abstract: A display panel and a display mother board including the display panel are provided. The display panel includes a substrate, a pixel array, at least one driver circuit, an insulating layer, and a metal wall. The substrate includes a display region and a non-display region, and the non-display region has a driver circuit region and an outer region disposed outside of the driver circuit region. The pixel array and the driver circuit are disposed in the display region and the driver circuit region respectively. The insulating layer is disposed on the substrate and in the non-display region. The metal wall is disposed on the insulating layer and in the outer region, wherein a Poisson's ratio of the metal wall is greater than or equal to 0.32.

Abstract: A display panel includes a substrate, a luminous display array, a thin film encapsulation, an auxiliary layer, an optical film and an optical clear adhesive. The luminous display array is disposed on the substrate. The thin film encapsulation layer is disposed on the substrate, covering the luminous display array. The auxiliary layer is disposed on the then thin film encapsulation. The auxiliary layer has an even top surface, and a shore hardness ranging from D4 to D60. The optical film is disposed on the auxiliary layer. The optical clear adhesive is disposed on the even top surface of the auxiliary layer for attaching the auxiliary layer and the optical film.