Patents by Inventor Shih-Hsing KAO

Shih-Hsing KAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-cycle wafer cleaning method
    Patent number: 9687885
    Abstract: Methods for cleaning a wafer in semiconductor fabrication are provided. The method includes providing a wafer. The method further includes cleaning the wafer in a first cleaning cycle by supplying a cleaning solution and supplying a first washing liquid mixed with a purge gas in sequence. The method also includes cleaning the wafer in a second cleaning cycle by supplying the cleaning solution and a second washing liquid mixed with the purge gas in sequence. The second cleaning cycle is initiated after the first cleaning cycle is finished.
    Type: Grant
    Filed: July 17, 2015
    Date of Patent: June 27, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ying-Jie Cai, Bo-Wei Chou, Shih-Hsing Kao, Shin-Hsien Yang, Tzu-Min Lee, Tai-Yung Yu, Wen-Cheng Lien
  • MULTI-CYCLE WAFER CLEANING METHOD
    Publication number: 20170014871
    Abstract: Methods for cleaning a wafer in semiconductor fabrication are provided. The method includes providing a wafer. The method further includes cleaning the wafer in a first cleaning cycle by supplying a cleaning solution and supplying a first washing liquid mixed with a purge gas in sequence. The method also includes cleaning the wafer in a second cleaning cycle by supplying the cleaning solution and a second washing liquid mixed with the purge gas in sequence. The second cleaning cycle is initiated after the first cleaning cycle is finished.
    Type: Application
    Filed: July 17, 2015
    Publication date: January 19, 2017
    Inventors: Ying-Jie CAI, Bo-Wei CHOU, Shih-Hsing KAO, Shin-Hsien YANG, Tzu-Min LEE, Tai-Yung YU, Wen-Cheng LIEN