Patents by Inventor Shih-Hsing LIN

Shih-Hsing LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier tape system and components and methods of use
    Patent number: 12016126
    Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: June 18, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu
  • CARRIER TAPE SYSTEM AND COMPONENTS AND METHODS OF USE
    Publication number: 20220110232
    Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
    Type: Application
    Filed: December 17, 2021
    Publication date: April 7, 2022
    Inventors: Sung-Sheng CHIU, Pei-Haw TSAO, Tsui-Mei CHEN, Shih-Hsing LIN, Li-Huan CHU
  • Carrier tape system and components and methods of use
    Patent number: 11240947
    Abstract: The current disclosure describes carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: February 1, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Sung-Sheng Chiu, Pei-Haw Tsao, Tsui-Mei Chen, Shih-Hsing Lin, Li-Huan Chu
  • CARRIER TAPE SYSTEM AND COMPONENTS AND METHODS OF USE
    Publication number: 20200008330
    Abstract: The current disclosure describes a carrier tape systems, which include a cover tape having adhesion areas and non-adhesion areas which are substantially free of adhesive. Methods for supplying semiconductor devices to an apparatus, which in operation, places the semiconductor devices at desired locations are also described. Methods of forming a semiconductor device carrier system are also described.
    Type: Application
    Filed: March 4, 2019
    Publication date: January 2, 2020
    Inventors: Sung-Sheng CHIU, Pei-Haw TSAO, Tsui-Mei CHEN, Shih-Hsing LIN, Li-Huan CHU