Abstract: A fingerprint identification device and a manufacturing method of the fingerprint identification device. The fingerprint identification device includes a substrate, a sensation electrode layer and a fingerprint identification sensation chip. The substrate has a first face, a second face and multiple perforations in connection with the first and second faces. The sensation electrode layer is disposed on the first face of the substrate and has multiple first electrodes, multiple second electrodes and an insulation layer. The first and second electrodes and the insulation layer are laminated with each other. A part of the insulation layer is disposed between the first and second electrodes and another part of the insulation layer encloses the first and second electrodes. The fingerprint identification sensation chip is disposed on the second face of the substrate.

Abstract: A touch device with fingerprint identification function includes a touch unit and a fingerprint identification unit. The touch unit has a touch section and a non-touch section. The non-touch section is disposed around the touch section in adjacency to the touch section. The fingerprint identification unit is disposed on the non-touch section of the touch unit. The fingerprint identification unit is integrated with the touch unit. Therefore, it is unnecessary to additionally form a perforation or a channel on the touch device for arranging the fingerprint identification unit as in the conventional touch device. In this case, the structural strength of the touch device will not be deteriorated. Also, the manufacturing cost can be lowered.

Abstract: A fingerprint identification unit is directly integrated into a touch panel, a Color Filter (CF), a Thin-Film Transistor (TFT), or a Liquid Crystal Module (LCM) to largely increase the identified sensitivity to solve the problem of the conventional fingerprint identification unit that is required to form on a silicon wafer first.

Abstract: A fingerprint identification device is directly integrated with and formed on a touch panel, a color filter (CF), a thin-film transistor (TFT) or a liquid crystal module (LCM). The fingerprint identification device improves the shortcoming of the conventional fingerprint identification device that it is necessary to first manufacture the fingerprint identification device on a silicon wafer and then integrate the fingerprint identification device with another component. Moreover, the fingerprint identification device has much higher fingerprint identification precision.

Abstract: The present disclosure provides a fingerprint identification device including a substrate, a sensitive die, a packaging material layer and a protection film. The sensitive die is positioned on the substrate, and has a top surface. The packaging material layer is positioned on the substrate, surrounding the sensitive die and exposing the top surface of the sensitive die, wherein a top surface of the packaging material layer and the top surface of the sensitive die have a coplanar. The protection film covers the sensitive die and the packaging material layer, wherein a material of the protection film is different from that of the packaging material layer. A method for manufacturing a fingerprint identification device is also provided herein.