Patents by Inventor Shih-Hsun Chou

Shih-Hsun Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10635620
    Abstract: A functional module board for outputting an output signal to an application terminal includes a main board and a sub board. The main board includes a processor and a main board connector. The sub board includes a sub board connector, a signal converter, and a signal output terminal. The main board connector is detachably connected to the sub board connector, and the processor sends a native signal to the sub board. The sub board converts the native signal to the output signal via the signal converter after receiving the native signal, and the signal output terminal outputs the output signal to the application terminal. The functional module board of the present application can change the design of the sub board according to different application terminal requirements in the case of the same main board to save the development cost.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: April 28, 2020
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Yu-Li Tsai, Yu-Yun Liu, Shih-Hsun Chou
  • Publication number: 20190361828
    Abstract: A functional module board for outputting an output signal to an application terminal includes a main board and a sub board. The main board includes a processor and a main board connector. The sub board includes a sub board connector, a signal converter, and a signal output terminal. The main board connector is detachably connected to the sub board connector, and the processor sends a native signal to the sub board. The sub board converts the native signal to the output signal via the signal converter after receiving the native signal, and the signal output terminal outputs the output signal to the application terminal. The functional module board of the present application can change the design of the sub board according to different application terminal requirements in the case of the same main board to save the development cost.
    Type: Application
    Filed: November 9, 2018
    Publication date: November 28, 2019
    Inventors: Yu-Li Tsai, Yu-Yun Liu, Shih-Hsun Chou