Patents by Inventor Shih-Hsun Huang

Shih-Hsun Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240077804
    Abstract: A method includes forming a test pattern and a reference pattern in an absorption layer of a photomask structure. The test pattern has a first trench and a second trench, the reference pattern has a third trench and a fourth trench, the test pattern and the reference pattern have substantially the same dimension in a top view, and the second trench is deeper than the first trench, the third trench, and the fourth trench. The method further includes emitting a light beam to the test pattern to obtain a first interference pattern reflected from the test pattern, emitting the light beam to the reference pattern to obtain a second interference pattern reflected from the reference pattern; and comparing the first interference pattern with the second interference pattern to obtain a measured complex refractive index of the absorption layer.
    Type: Application
    Filed: September 1, 2022
    Publication date: March 7, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ping-Hsun LIN, Chien-Cheng CHEN, Shih Ju HUANG, Pei-Cheng HSU, Ta-Cheng LIEN, Hsin-Chang LEE
  • Patent number: 11923315
    Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen, Chien-Hsun Chen, Shih-Ya Huang
  • Patent number: 11917230
    Abstract: A system and method for maximizing bandwidth in an uplink for a 5G communication system is disclosed. Multiple end devices generate image streams. A gateway is coupled to the end devices. The gateway includes a gateway monitor agent collecting utilization rate data of the gateway and an image inspector collecting inspection data from the received image streams. An edge server is coupled to the gateway. The edge server includes an edge server monitor agent collecting utilization rate data of the edge server. An analytics manager is coupled to the gateway and the edge server. The analytics manager is configured to determine an allocation strategy based on the collected utilization rate data from the gateway and the edge server.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: February 27, 2024
    Assignee: Quanta Cloud Technology Inc.
    Inventors: Yi-Neng Zeng, Keng-Cheng Liu, Wei-Ming Huang, Shih-Hsun Lai, Ji-Jeng Lin, Chia-Jui Lee, Liao Jin Xiang
  • Publication number: 20230072388
    Abstract: An organic light-emitting diode (OLED) display device and an operating method thereof are disclosed. The OLED display device includes an OLED panel, a non-volatile memory and a volatile memory. The non-volatile memory is coupled to the OLED panel and used for storing accumulated current data from the OLED panel. The volatile memory is coupled between the non-volatile memory and the OLED panel and used for storing a compensation value generated according to the accumulated current data stored in the non-volatile memory. When the OLED panel is directly compensated with the compensation value, the non-volatile memory receives and stores updated accumulated current data of the OLED panel.
    Type: Application
    Filed: August 31, 2022
    Publication date: March 9, 2023
    Inventors: YUHE CHIOU, SHIH HSUN HUANG, SHAO-PING HUNG
  • Patent number: 11143937
    Abstract: Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: October 12, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ya-Ting Yeh, Kuan-Ting Wu, Shih-Hsun Huang
  • Publication number: 20210286234
    Abstract: Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.
    Type: Application
    Filed: December 15, 2017
    Publication date: September 16, 2021
    Inventors: Ya-Ting Yeh, Kuan-Ting Wu, Shih-Hsun Huang
  • Publication number: 20210165465
    Abstract: In one example, a hinge assembly may include a first hinge member and a second hinge member. The first hinge member may include a first hinge base and a first hinge bracket pivotally connected to the first hinge base. The second hinge member may include a second hinge base and a second hinge bracket pivotally connected to the second hinge base. Further, the hinge assembly may include a hydraulic unit connected between the first hinge member and the second hinge member to provide synchronous movements between the first hinge bracket and the second hinge bracket.
    Type: Application
    Filed: June 6, 2018
    Publication date: June 3, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Shih-Hsun Huang, Ya-Ting Yeh
  • Publication number: 20200192429
    Abstract: In one example, a kickstand for a portable electronic device is disclosed which includes a body portion rotatably connected to the portable electronic device. The body portion defines at least one recess. Further, the kickstand includes at least one rubber magnet disposed within the at least one recess. The at least one rubber magnet, when located in close proximity to the portable electronic device, interacts magnetically with at least one magnetic material included within the portable electronic device.
    Type: Application
    Filed: July 4, 2017
    Publication date: June 18, 2020
    Inventors: KUAN-TING WU, YA-TING YEH, SHIH-HSUN HUANG
  • Publication number: 20200110447
    Abstract: Electronic devices comprising a substrate at least partially enclosed by an energy absorbing material are disclosed herein. The energy absorbing material can integrally or removably attach to the substrate. The substrate can be carbon fiber, glass, ceramic, metal, composite, or mixtures thereof. The energy absorbing material can comprise at least one thermoplastic polymer.
    Type: Application
    Filed: April 14, 2017
    Publication date: April 9, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Ya-Ting Yeh, Shih-Hsun Huang
  • Publication number: 20190256984
    Abstract: Examples relating to coating an alloy substrate are described. For example, techniques for coating a surface of the alloy substrate with a coating layer and an exterior coat include anodizing an alloy substrate to form a metal oxide layer on surface of the alloy substrate and obtain an anodized alloy substrate. The alloy substrate is a metal alloy and the anodized alloy substrate has irregularities on surface. Thereafter, a coating layer is applied on the surface of the alloy substrate to smoothen the surface by providing a uniform covering on the irregularities of the surface. After applying the coating layer, an exterior coat is deposited on the surface of the alloy substrate.
    Type: Application
    Filed: October 26, 2016
    Publication date: August 22, 2019
    Inventors: YA-TING YEH, KUAN-TING WU, SHIH-HSUN HUANG
  • Publication number: 20120172232
    Abstract: The present invention relates to a nanorod-containing precursor powder, a nanorod-containing superconductor bulk and a method for manufacturing the same. The method for manufacturing a nanorod-containing precursor powder includes the following steps: providing a precursor powder; and forming a plurality of nanorods on particle surfaces of the precursor powder. Accordingly, the present invention can significantly enhance critical current density and pinning force.
    Type: Application
    Filed: July 6, 2011
    Publication date: July 5, 2012
    Applicant: National Cheng Kung University
    Inventors: In-Gann Chen, Chun-Chih Wang, Shih-Hsun Huang